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31results about How to "Improve connection characteristics" patented technology
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Insulated non-halogenated covered aluminum conductor and wire harness assembly
InactiveUS20110079427A1Light weightImprove connection characteristicsInsulated cablesInsulatorsNorylElectrical conductor
Disclosed herein a covered conductor comprising a conductor and a covering, wherein the covering is disposed over the conductor, wherein the conductor comprises aluminum or an alloy comprising aluminum, wherein the covering comprises a poly(arylene ether) composition, wherein optionally, the covering comprises a poly(arylene ether) composition selected from the group consisting of Noryl resins from SABIC Innovative Plastics, Xyron resins from Asahi Kasei Chemicals Corporation, Iupiace resins from Mitsubishi, Lemalloy resins from Mitsubishi, Polyphenyl Ether resins from Bluestar, Acnor resins from Aquafil Technopolymers, Ashlene resins from Ashley Polymers, Vestoran resins from Evonik Degussa. Further disclosed herein is a wire harness assembly comprising the covered conductor, and an end use equipment comprising the wire harness assembly.
Owner:SABIC INNOVATIVE PLASTICS IP BV
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
InactiveUS20070209831A1Improve adhesionAvoid crackingPrinted electric component incorporationSemiconductor/solid-state device detailsEngineeringCopper
A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
Owner:IBIDEN CO LTD
Hole-assisted single mode optical fiber
ActiveUS7228040B2Increase resistanceImprove connection characteristicsCladded optical fibreOptical waveguide light guideRelative refractive indexOptical communication
A single mode fiber is provided which is suitable for high-speed, large-capacity optical communication and for optical wiring. The single mode fiber has a first cladding region with a uniform refractive index, a core region with a refractive index higher than that of the first cladding region, and a second cladding region including at least four air hole regions placed in the first cladding region. Optimization can be achieved by making the distance from the center of the core region to the air hole regions equal to 2–4.5 times the core radius, and the air hole radius equal to or greater than 0.2 times the core radius. It is preferable the core radius be 3.7–4.8 μm, the relative index difference of the core region from the first cladding region be 0.3–0.55 %.
Owner:NIPPON TELEGRAPH & TELEPHONE CORP
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
InactiveUS20080148563A1Improve connection characteristicsAvoid residuePrinted circuit assemblingSemiconductor/solid-state device detailsInter layerCopper
Owner:IBIDEN CO LTD
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
InactiveUS20080151522A1Improve connection characteristicsAvoid residuePrinted electric component incorporationSemiconductor/solid-state device detailsInter layerEngineering
An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the intermediate layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
Owner:IBIDEN CO LTD
Printed circuit board and method of manufacturing printed ciruit board
InactiveUS20070258225A1Improve connection characteristicsPrevent smoothnessFinal product manufactureCross-talk/noise/interference reductionCapacitanceEngineering
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
Owner:IBIDEN CO LTD
Optical connector and connection structure of optical fibers
An optical connector having: a ferrule into which a first optical fiber is inserted; an optical fiber connector disposed at an back end of the ferrule; and a cross-linkable refractive index matching member attached onto an end face on a back end side of the first optical fiber. The end face on the back end side of the first optical fiber and an end face of a second optical fiber to be inserted into the optical fiber connector from a back end side thereof are to be connected by a butting connection. The cross-linkable refractive index matching member is formed such that a cross-linkable refractive index matching agent is coated on the end face on the back end side of the first optical fiber, and the coated agent is cross-linked and hardened.
Owner:HITACHI METALS LTD
Method for removing film
InactiveCN101740338AAvoid damageAchieve removalSemiconductor/solid-state device manufacturingMetal silicidePlasma activation
The invention discloses a method for removing a film. The method comprises the following steps of: providing a substrate the surface of which is provided with a film; transmitting the substrate to a treating room; carrying out the plasma activation on reactant gas outside the treating room by using a low-powered radio-frequency power supply; introducing the reactant gas after being subjected to the plasma activation to the treating room; and carrying out etching treatment by using the reactant gas after being subjected the plasma activation to remove the film, and removing resultants produced in the etching treatment process by using the annealing treatment. The invention also discloses specific implementation steps for forming a local metal silicide and forming the opening of a contact hole by using the method correspondingly. By using the method for removing a film, the damage to the understructure by a traditional dry etching method can be avoided, and the damage to the side-wall structure by an isotropic wet corrosion method can be also avoided.
Owner:SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP
Single mode optical fiber with electron vacancies
ActiveUS20060045448A1High bending loss resistanceImprove connection characteristicsCladded optical fibreOptical waveguide light guideRelative refractive indexOptical communication
A single mode fiber is provided which is suitable for high-speed, large-capacity optical communication and for optical wiring. The single mode fiber has a first cladding region with a uniform refractive index, a core region with a refractive index higher than that of the first cladding region, and a second cladding region including at least four air hole regions placed in the first cladding region. Optimization can be achieved by making the distance from the center of the core region to the air hole regions equal to 2-4.5 times the core radius, and the air hole radius equal to or greater than 0.2 times the core radius. It is preferable the core radius be 3.2-4.8 μm, the relative index difference of the core region from the first cladding region be 0.3-0.55%.
Owner:NIPPON TELEGRAPH & TELEPHONE CORP
Composite-material braided prefabricated filling belt and preparation method of composite-material braided prefabricated filling belt
InactiveCN102707373AImprove connection characteristicsOnline Monitoring of Shock ThreatsCladded optical fibreOptical waveguide light guideForeign matterFiber
The invention belongs to a composite-material braided prefabricated filling belt and a preparation method of the composite-material braided prefabricated filling belt, and relates to a standard size for structural shape and size of the braided prefabricated filling belt, and a braided prefabrication technology; the integral filling of a composite material structural member in a sealed or semi-open triangle region is provided by the filling belt, and the connecting characteristics, the overall characteristics and the structural integrity of a filling region can be improved, so that the usage performance of the composite material structural member is improved; meanwhile, Bragg grating fibers can be covered inside the filling belt, and the filling belt becomes a sensor embedded with the composite material structural member, so that online monitoring of threats on the composite material structural members by foreign members in a service state can be performed, and the usage safety and the value of the composite material structural member can be improved.
Owner:AVIC BEIJING INST OF AERONAUTICAL MATERIALS
Resistance spot welding method of aluminium matrix composites
InactiveCN103978301AGood conditionImprove connection characteristicsWelding/cutting media/materialsWelding/soldering/cutting articlesElectrical resistance and conductanceAdhesive
The invention discloses a resistance spot welding method of aluminium matrix composites. The resistance spot welding method comprises the following steps: when the aluminium matrix composites are subjected to resistance spot welding connection, additionally arranging a pure aluminium foil with a thickness of 2-10[mu]m between the aluminium matrix composites, and carrying out spot welding connection after the pure aluminium foil is additionally arranged between the aluminium matrix composites at the squeeze time of 0.8-1.8 seconds, the maintenance time of 1.0-2.2 seconds, the electrode pressure of 2500-3500N, the welding time of 0.3-0.5 second and the welding current of 16.5-19.5kA. According to the resistance spot welding method disclosed by the invention, the pure aluminium foil is additionally arranged between the aluminium matrix composites, and then the resistance spot welding is carried out, thus the defects that resistance spot weld nuggets of the aluminium matrix composites are small in diameter, the joints are low in strength, adhesive and the like at present are effectively improved. The resistance spot welding method is used for carrying out spot welding on the aluminium matrix composites, wherein the average diameter of nuggets is 7.2mm, and the average shearing resistance of the joints is 2043.9N.
Owner:ZHENGZHOU UNIV +1
Unpaired weldment lead-acid battery pack
ActiveCN102916153AIncrease specific energyLower unit costCell component detailsElectrical batteryEngineering
The invention is suitable for the technical field of chemical battery production, and provides an unpaired weldment lead-acid battery pack, which comprises at least two individual batteries, wherein each individual battery comprises a plurality of positive pole plates and a plurality of negative pole plates, which are arranged at intervals; the plurality of positive plates form a positive pole group, and the plurality of negative pole plates form a negative pole group; the positive pole group of one individual battery and the negative pole group of the adjacent individual battery are connected through a combined bus bar or / and a lengthened bus bar; and the residual positive pole group and the residual negative pole group are connected through a conventional bus bar. In the unpaired weldment lead-acid battery pack, the individual batteries in the pack are not connected by the weldment connection manner, but by the integrally molded bus bar or the lengthened bus bar; the bus bar can realize in-parallel connection of pole plates in the pole group, and serial connection between pole groups between the individual batteries. Therefore, the space waste in the battery design is avoided; the energy density and the volume density of the battery are improved; and the production cost is reduced.
Owner:SHENZHEN CENT POWER TECH
Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide
A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ / 4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg / 4, where λg is an in-substrate effective wavelength of the signal wave.
Owner:MITSUBISHI ELECTRIC CORP
Manufacturing method of flexible printed circuit board
ActiveCN103607845ASimple processImprove connection characteristicsMultilayer circuit manufactureFlexible electronicsPrinting ink
The invention discloses a manufacturing method of a flexible printed circuit board. The manufacturing method comprises the following steps that: (1) a first flexible printed circuit board is manufactured; (2) a second flexible printed circuit board is manufactured; (3) the first flexible printed circuit board and the second flexible printed circuit board are laminated; (4) laser drilling is performed on a multilayer flexible printed circuit board accomplished in the step (3); (5) solder-resisting printing ink is printed on positions of the multilayer flexible printed circuit board where electronic components are not needed to be welded; and (6) the multilayer flexible printed circuit board is cut into a flexible printed circuit board in a predetermined specification through using a laser cutting process.
Owner:LIYANG TECH DEV CENT
Preparation method and application of self-supporting catalytic electrode
ActiveCN112921351AImprove connection characteristicsSlow acid etchMaterial nanotechnologyElectrodesAcid etchingOxygen evolution
The invention discloses a preparation method and application of a self-supporting catalytic electrode, which belong to the technical field of hydrogen and oxygen preparation through water electrolysis. The method comprises the following steps of immersing the ferro-nickel alloy into an acidic aqueous solution containing ethylene glycol, taking out, cleaning, and airing in air. The preparation process is realized through a one-step acid etching method, the preparation process is simple, and production can be carried out only by immersing cleaned foamed ferronickel into an ethylene glycol aqueous solution of sulfuric acid; conditions are mild, safety is high, raw materials are low in price, pollutant emission is avoided, and the prepared electrode has high catalytic oxygen evolution activity, can effectively reduce water electrolysis energy consumption and has batch manufacturing feasibility.
Owner:TSINGHUA UNIV
Spherical hinge disc suspension type connection device of converter ring and furnace shell
InactiveCN101781696AAdapt to free expansion and contractionSimple structureManufacturing convertersEngineeringHinge angle
Owner:WISDRI ENG & RES INC LTD
Connecting device for spherical hinge slider type converter backing ring and furnace shell
InactiveCN101974662AAdapt to free expansion and contractionSimple structureManufacturing convertersEngineeringMechanical engineering
Owner:WISDRI ENG & RES INC LTD
Anisotropic conductive film and semiconductor device using same
ActiveCN105706183AAvoid short circuitImprove connection characteristicsConductive layers on insulating-supportsSolid-state devicesAnisotropic conductive filmSemiconductor
The present invention relates to an anisotropic conductive film that can prevent a short circuit by adjusting density of conductive particles pressed to electrode parts between electrodes and density of conductive particles in a space between the electrodes and exhibit enhanced cost-reduction effects and connection characteristics, and a semiconductor device connected thereby.
Owner:KUKDO ADVANCED MATERIALS CO LTD
Coaxial connector
ActiveUS9728910B2Improve PIM performanceImprove connection characteristicsTwo pole connectionsCouplings bases/casesElectrical conductorElectrical connection
The present invention relates to a coaxial connector. According to the present invention, there is provided a coaxial connector which is installed for electrical connection of a communication module, and includes a first connector in which an insulator through which a conductor penetrates is installed inside a first housing, and a conductive gasket is seated between the first housing and the insulator; and a second connector which is coupled so that a front end comes into close contact with the conductive gasket.
Owner:SOLID
A kind of resistance spot welding method of aluminum matrix composite material
InactiveCN103978301BGood conditionImprove connection characteristicsWelding/cutting media/materialsWelding/soldering/cutting articlesElectrical resistance and conductanceSpot welding
The invention discloses a resistance spot welding method of an aluminum-based composite material. When performing resistance spot welding connection of aluminum matrix composite materials, a pure aluminum foil with a thickness of 2-10 μm is added between the aluminum matrix composite materials, and a pure aluminum foil is added between the aluminum matrix composite materials for spot welding connection. The preloading time is 0.8-1.8 seconds, the holding time is 1.0-2.2 seconds, the electrode pressure is 2500-3500 Newtons, the welding time is 0.3-0.5 seconds, and the welding current is 16.5-19.5 kA. In the invention, a pure aluminum foil is added between the aluminum matrix composite materials for resistance spot welding connection, thereby effectively improving defects such as small nugget diameter, low joint strength and adhesion of the current aluminum matrix composite material resistance spot welding. The aluminum-based composite material is spot-welded by the present invention, the average diameter of the nugget is 7.2mm, and the average shear resistance of the joint is 2043.9N.
Owner:ZHENGZHOU UNIV +1
A kind of mortar concrete internal curing material and preparation method thereof
The invention discloses a mortar concrete internal maintenance material and a preparation method thereof, and relates to the technical field of mortar concrete. In the early stage of hydration, a masking agent is used to form a covering film to isolate water and circulating fluidized bed sulfur-fixing ash, which can act as a water reducing agent. It can reduce the water consumption of concrete, and in the later stage, it can be cross-linked with cement hydration products to improve the properties of the transition zone of the concrete interface. The internal curing material can participate in the hydration reaction in the later stage of hydration, and at the same time rely on its own expansion to reduce the porosity of the system and increase Concrete strength without compromising concrete durability.
Owner:四川鑫统领混凝土有限公司
Method for removing film
InactiveCN101740338BAvoid damageAchieve removalSemiconductor/solid-state device manufacturingMetal silicidePlasma activation
Owner:SEMICON MFG INT (BEIJING) CORP
A copper electroplating solution
The invention belongs to the technical field of metal electroplating, in particular to a copper electroplating solution. The copper electroplating solution includes: copper sulfate, sulfuric acid, chloride ion, sodium alkyl succinate sulfonate and sulfonates. Its advantage is that the acid-copper ratio of the electroplating solution is increased, which can ensure the thickness of the copper layer in the nano-scale deep hole; the fluidity is better, and the step coverage ability of electroplating copper has been effectively improved. After the high-grade copper is filled, there are no voids and cracks; the electroplated samples have good reliability in the subsequent device preparation process.
Owner:FUDAN UNIV
An optical connector and a connection structure of optical fibers
InactiveCN100465679CIncrease the cross-sectional areaImprove connection characteristicsCoupling light guidesCross-linkEngineering
The invention relates to an optical connector and a connection structure of optical fibers. To connect optical fibers to each other in the state of being cut without polishing end faces of the optical fibers after cutting them. The optical connector is provided with a ferrule 7 with a 1st built-in optical fiber 11, and an optical fiber connector 9 connected with an end edge of the ferrule 7, and the end face of a 2nd optical fiber 12 inserted from the end edge side 9a of the optical fiber connector 9 and the end edge side end face 11a of the 1st optical fiber 11 are butt-connected. A cross-linking-hardening refractive index matching body 6 is adhering to the end edge side end face 11a, and the cross-linking-hardening refractive index matching body 6 cross-linking-hardens a cross-linking-hardening refractive index matching agent applied to the end edge side end face 11a of the optical fiber 11.
Owner:HITACHI CABLE
Method for hybrid networking of electronic class cards and hybrid networking class board equipment
PendingCN112804681ARealize networkingNetworking made easyNetwork traffic/resource managementNetwork topologiesCampus networkEmbedded system
The invention discloses a method for hybrid networking of electronic class cards. The method comprises the following steps: acquiring direct networking state information between a first class card and a central server; acquiring ad hoc network state information of a second class board close to the first class board and acquiring ad hoc network wireless information of the second class board; determining a networking mode according to the direct networking state information and the ad hoc network state information; and feeding back the networking mode of the first class board to the central server. The invention further discloses electronic class cards equipment capable of achieving hybrid networking. The hybrid networking class card equipment comprises a network state recognition module, an ad hoc network recognition module, a networking control module and a server feedback module. According to the method, the characteristic that physical positions of class cards deployed in a campus are close is utilized, so that the class cards can operate the class board function even under the condition that hardware communication equipment such as a campus network is not completely deployed or related part of equipment is not in place in time, and dependence on deployment of heavy hardware equipment is reduced.
Owner:上海光数信息科技有限公司
Anisotropic conductive film and semiconductor device using same
ActiveCN105706183BAvoid short circuitImprove connection characteristicsConductive layers on insulating-supportsSolid-state devicesAnisotropic conductive filmParticle density
Owner:KUKDO ADVANCED MATERIALS CO LTD
Spherical hinge disc suspension type connection device of converter ring and furnace shell
Owner:WISDRI ENG & RES INC LTD
A method of manufacturing a flexible printed circuit board
ActiveCN103607845BSimple processImprove connection characteristicsMultilayer circuit manufactureLaser cuttingPrinting ink
Owner:LIYANG TECH DEV CENT
A kind of pressure-resistant flexible cable and its preparation process
ActiveCN110504054BGood flexibilityImprove flexibilityFlexible cablesCable/conductor manufactureStructural engineeringElectric cables
The invention provides a compression resistant flexible cable and a preparation process thereof. The cable comprises a cable core, an insulating layer, a compression resistant flexible layer, a shielding layer and a protective sleeve, which are sequentially sleeved from inside to outside, the compression resistant flexible layer comprises a compression resistant segment and a flexible segment, which are alternately connected, a length ratio of the compression resistant segment to the flexible segment is 1:0.2-0.3, wherein the compression resistant segment is prepared by laminating a first level skeleton network layer, a buffer compression layer and a second level skeleton network layer, and the flexible segment is prepared from a buffer occlusion layer material and has the same thickness as the compression resistant segment. According to the compression resistant flexible cable provided by the invention, the first level skeleton network layer, the buffer occlusion layer and the secondlevel skeleton network layer are provided, and constituents are reasonably optimized, so that the interlayer bonding and auxiliary support have been well improved, excellent mechanical properties suchas compression resistance, impact resistance, high strength and abrasion resistance or the like are provided for the cable, furthermore, the material has good flexibility and a good flexibility effect during the construction, thereby greatly improving the application efficiency.
Owner:ECI HUIZHOU CABLE SCI & TECH CO LTD
Production of press-fit and crimp connections in a vice
ActiveCN112449734AAvoid temperature differenceImprove connection characteristicsLine/current collector detailsSoldered/welded conductive connectionsClassical mechanicsStructural engineering
The invention relates to a method for connecting a strand element (100) to a connection element (150) using a re-shaping method, e.g. connecting a cable to a cable lug. The system (10) comprises a pair of receiving elements (200) having a front side (210) with a recess (215) and a hollow section (230). The hollow section (230) is designed to accommodate a press insert (300) having a front side (310) with a recess (315). The receiving elements (200) and the press inserts (300) are arranged in a vice (500). The system (10) also comprises a clamp (400) having a front side (410) with a recess (415), which is suitable for receiving the connection element (150). When a pair of receiving elements (200) is arranged, together with the press insert (300), around a central region (155) of the connection element (150), then a re-shaping connection, e.g. a crimp connection, is produced between the strand element (100) and the connection element (150).
Owner:LISA DRAXLMAIER GMBH
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