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Anisotropic conductive film and semiconductor device using same

An anisotropic, conductive film technology, applied in the direction of semiconductor devices, electric solid devices, conductive layers on insulating carriers, etc., can solve the problems of reducing the flow of the composition, undisclosed adjustment of the anisotropic conductive film of insulating particles, etc. Improve the effect of connection characteristics

Active Publication Date: 2016-06-22
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, as a prior art for adjusting the fluidity of a layer containing conductive particles, in Korean Laid-Open Patent No. 10-2012-0122943, the weights of film-forming resin and radical polymerizable resin are adjusted, and in Korean Laid-Open Patent No. In No. 10-2011-0063586, the thickness of the layer is adjusted, thereby reducing the flow of the composition. However, no ultra-low fluidity anisotropic conductive film for adjusting the content of insulating particles is disclosed.

Method used

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  • Anisotropic conductive film and semiconductor device using same
  • Anisotropic conductive film and semiconductor device using same
  • Anisotropic conductive film and semiconductor device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] Preparation of conductive layer composition

[0137] As a binder resin that functions as a matrix for forming a film, 20 parts by weight of a phenoxy resin (PKHH, Inchemrez, USA) dissolved in a xylene / ethyl acetate azeotrope mixed solvent at 40% by volume was used as The curing agent for curing reaction uses 15 parts by weight of propylene oxide epoxy resin (EP-4000S, Adeka, Japan), 10 parts by weight of propylene oxide epoxy resin (EP-4010S, Adeka, Japan), Used as a thermosetting cationic curing agent (Si-60L, Sanshin Chemical, Japan) 5 parts by weight, used as insulating particles for fluidity and insulation (SFP-20M, DENKA, Japan) 30 parts by weight, conductive particles (AUL -704, an average particle size of 4 μm, SEKISUI company, Japan) 20 parts by weight, insulation treatment, and mixing to prepare a conductive layer composition.

[0138] Preparation of insulating layer composition

[0139] When preparing the conductive layer composition, the same method was used to ...

Embodiment 2

[0147] The anisotropic conductive film of Example 2 was produced by the same method and conditions as Example 1, except that the content of each composition was adjusted to be shown in Table 1 in Example 1.

Embodiment 3

[0149] The anisotropic conductive film of Example 3 was produced by the same method and conditions as Example 1, except that the content of each composition was adjusted to be shown in Table 1 in Example 1.

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Abstract

The present invention relates to an anisotropic conductive film that can prevent a short circuit by adjusting density of conductive particles pressed to electrode parts between electrodes and density of conductive particles in a space between the electrodes and exhibit enhanced cost-reduction effects and connection characteristics, and a semiconductor device connected thereby.

Description

Technical field [0001] The present invention relates to an anisotropic conductive film and a semiconductor device using the same. Background technique [0002] Anisotropic conductive film (ACF) is usually made by dispersing conductive particles such as nickel (Ni) or gold (Au) or conductive particles such as polymer particles of the above metal on a resin such as epoxy resin The film-shaped adhesive film means a polymer film having electrical anisotropy and adhesiveness that has conductivity in the film thickness direction of the film and insulation in the surface direction. [0003] After arranging this anisotropic conductive film between circuits and performing a thermocompression bonding process under specified conditions, the circuit electrodes are electrically connected by conductive particles, and a space is formed between the electrodes and the electrodes. It is filled with insulating adhesive resin and the conductive particles are independent of each other, thus having hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14
CPCH01L24/29H01L24/32H01L24/83H01L2224/2929H01L2224/293H01L2224/29386H01L2224/29499H01L2224/83851H01L2224/83986H01L2924/15788H01L2924/00
Inventor 黃慈英金智软朴憬修郑光珍
Owner KUKDO ADVANCED MATERIALS CO LTD
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