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A copper electroplating solution

A technology for electroplating copper and solution, applied in the field of metal electroplating, can solve the problems of reducing the thickness of the dielectric layer and increasing the feature aspect ratio, and achieves the effects of improving the step coverage, reducing the roughness and improving the reliability.

Inactive Publication Date: 2016-02-24
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the circuit density increases, the line width of interconnect lines, the size of contact vias, and other feature sizes will decrease. However, the thickness of the dielectric layer cannot be reduced proportionally. The result is that the feature aspect ratio increase

Method used

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  • A copper electroplating solution
  • A copper electroplating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The distribution ratio of the electroplating copper solution is as follows:

[0026] Copper sulfate: 80g / L

[0027] Sulfuric acid: 150g / L

[0028] Chloride ion concentration: 40ppm

[0029] Sodium dipentyl succinate: 5g / L

[0030] Sodium polydisulfide dipropane sulfonate: 5ppm

[0031] The copper electroplating solution configured according to the above components is repeatedly filtered and then stirred by air, and the circulation of the copper electroplating solution is continuously maintained during the electroplating process.

Embodiment 2

[0033] The distribution ratio of the electroplating copper solution is as follows:

[0034] Copper sulfate: 90g / L

[0035] Sulfuric acid: 160g / L

[0036] Chloride ion concentration: 45ppm

[0037] Sodium dipentyl succinate: 5.5g / L

[0038] Sodium thiazoline propane sulfonate: 5.5ppm

[0039] The copper electroplating solution configured according to the above components is repeatedly filtered and then stirred by air, and the circulation of the copper electroplating solution is continuously maintained during the electroplating process.

Embodiment 3

[0041] The distribution ratio of the electroplating copper solution is as follows:

[0042] Copper sulfate: 100g / L

[0043] Sulfuric acid: 170g / L

[0044] Chloride ion concentration: 50ppm

[0045] Sodium dihexyl sulfonate: 6g / L

[0046] Sodium thiazoline propane sulfonate: 6ppm

[0047] The copper electroplating solution configured according to the above components is repeatedly filtered and then stirred by air, and the circulation of the copper electroplating solution is continuously maintained during the electroplating process.

[0048] Of course, the copper electroplating solution provided by the present invention can add other auxiliary additives on the basis of the formula, only to re-optimize the content of the present invention, and it is also within the protection scope of the present invention.

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Abstract

The invention belongs to the technical field of metal electroplating, in particular to a copper electroplating solution. The copper electroplating solution includes: copper sulfate, sulfuric acid, chloride ion, sodium alkyl succinate sulfonate and sulfonates. Its advantage is that the acid-copper ratio of the electroplating solution is increased, which can ensure the thickness of the copper layer in the nano-scale deep hole; the fluidity is better, and the step coverage ability of electroplating copper has been effectively improved. After the high-grade copper is filled, there are no voids and cracks; the electroplated samples have good reliability in the subsequent device preparation process.

Description

technical field [0001] The invention belongs to the technical field of metal electroplating, and in particular relates to an electroplating copper solution used in the subsequent process of integrated circuits. Background technique [0002] With the development of very large-scale integration (VLSI) and ultra-large-scale integration (ULSI), the degree of integration continues to increase, and circuit components are becoming denser. Chip interconnection has become a key factor affecting chip performance. However, the scaling down of interconnect lines in VLSI and ULSI technologies has placed additional demands on processing capabilities due to size constraints of the circuitry. Such requirements include precise machining of multi-layered, high-aspect-ratio structural features. The reliability of these interconnect structures plays a very important role in the success of VLSI and ULSI and the improvement of circuit density. [0003] As the circuit density increases, the line...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 卢红亮谢立恒丁士进张卫
Owner FUDAN UNIV
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