A method of manufacturing a flexible printed circuit board

Abstract

The invention discloses a manufacturing method of a flexible printed circuit board. The manufacturing method comprises the following steps that: (1) a first flexible printed circuit board is manufactured; (2) a second flexible printed circuit board is manufactured; (3) the first flexible printed circuit board and the second flexible printed circuit board are laminated; (4) laser drilling is performed on a multilayer flexible printed circuit board accomplished in the step (3); (5) solder-resisting printing ink is printed on positions of the multilayer flexible printed circuit board where electronic components are not needed to be welded; and (6) the multilayer flexible printed circuit board is cut into a flexible printed circuit board in a predetermined specification through using a laser cutting process.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a method for manufacturing a flexible printed circuit board. Background technique [0002] Because the flexible circuit board can be bent, folded, wound, and can move freely in the three-dimensional space and expand and contract, and has good heat dissipation performance, it can also use FPC to reduce the volume, realize lightweight, miniaturization, and thinning, and achieve component devices and Wire connection integration. Moreover, the cost of the single-sided flexible board is low, and it has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is rolled copper foil. The insulating substrate can be easily selected from polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride; therefore, single-sided flexible circuit boards are widely used in the automot...

AI Technical Summary

Problems solved by technology

Because of the softness of the single-sided flexible circuit board, the light-cured product is prone to deformation, curling, and unevenness, which increases the workload of the subsequent production process and affects production efficiency.

[0003] At present, the flexible printed circuit boards in the industry have the following disadvantages: poor thermal conductivity and heat dissipation, difficult to control the expansion and contraction size, and difficult to improve reliability; extremely poor dimensional stability, low wiring density, not high temperature resistance, and not easy to make multi-layer board, and in the prior art, when mechanical punching and mechanical cutting are used in the production of multilayer flexible circuit boards, the aperture cannot be precisely controlled, and it is easy to cause waste boards

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