207results about How to "High bonding reliability" patented technology

A semiconductor device includes a semiconductor substrate and an array of protruding electrodes arranged at a pitch X1. Each of the protruding electrodes has a height X3 and is formed on a barrier metal base of diameter X2 coupled to an electrode arranged on the semiconductor substrate so as to satisfy the relations (X1 / 2)≦X2≦(3*X1 / 4) and (X1 / 2)≦X3≦(3*X1 / 4).

The invention relates to a high-humidity and high-temperature resisting single component epoxy adhesive and its preparation method. The epoxy adhesive comprises the following raw materials by weight: 40% to 60% of epoxy resin, 1% to 5% of reactive diluent, 30% to 50% of filling material, 0.5% to 1% of coupling agent, 0 to 1% of cross-linking agent, 1% to 10% of flexibilizer, 3% to 8% of latent curing agent and 3% to 5% of curing accelerator. According to the invention, the requirement of high temperature and high humidity resisting performance after the electronic packaging can be satisfied by the high-humidity and high-temperature resisting single component epoxy adhesive, the application scope of the electronic and electric appliances can be greatly extended, and the solidified system has the advantages of high adhesion reliability and wide application range.

After columnar electrodes and a sealing film are formed above a semiconductor substrate in a wafer state, probe pins are brought into contact with the upper surfaces of the columnar electrodes, and burn-in is executed. Next, solder balls are formed on the columnar electrodes, and the semiconductor substrate in a wafer state is diced. As a result, any unwanted deformation of the solder balls by contact of the probe pins can be prevented. In addition, even when the heights of the solder balls vary, burn-in can be performed.

The invention relates to a single-component photo-curable and thermal-curable adhesive and a preparation method thereof. The single-component photo-curable and thermal-curable adhesive consists of the following components in percentage by weight: 1 to 10 percent of epoxy resin, 1 to 10 percent of vinyl epoxy resin, 15 to 60 percent of acrylate oligomer, 20 to 50 percent of acrylate active diluent, 2 to 7 percent of photoinitiator and 0.5 to 7 percent of latent curing agent. The preparation method for the single-component photo-curable and thermal-curable adhesive comprises the following stepsof: weighing a proper amount of epoxy resin, vinyl epoxy resin, acrylate oligomer, acrylate active diluent, photoinitiator and latent curing agent in percentage by weight, adding into a stirrer in turn, uniformly stirring in vacuum, naturally cooling to room temperature, and performing sealing packaging.

The liquid ejection head comprises: a plurality of pressure chambers which contain liquid and are arranged in a two-dimensional matrix configuration; a plurality of nozzles which connect to the pressure chambers and eject the liquid; a diaphragm which forms one face of the pressure chambers; a plurality of piezoelectric elements which are formed on a face of the diaphragm reverse to a face thereof adjacent to the pressure chambers, each of the piezoelectric elements corresponding to each of the pressure chambers; a plurality of electrical wires which connect to the piezoelectric elements and extend in a direction substantially perpendicular to the face on which the piezoelectric elements are formed; a sealing member which seals off at least one of the piezoelectric elements and at least one of the electrical wires so that space is formed over a side of the at least one of the piezoelectric elements reverse to a side adjacent to the diaphragm; and a common liquid chamber which supplies the liquid to the pressure chambers and is arranged on a side of the sealing member reverse to a side thereof on which the pressure chambers are arranged.

Embodiments in accordance with the present invention improve bonding reliability in a feedthrough sealing portion. According to one embodiment of the present invention, an opening of a through hole is provided on the bottom of the base of the magnetic disk device and a feedthrough mounting plane which is one of the steps formed toward the outside of the device is provided around the opening. The feedthrough includes a flange and pins which are fixed to the flange by a glass material and pass an electric signal. The flange is larger in outer shape than the opening of the base. The periphery of the flange of the feedthrough is mounted on the feedthrough mounting plane of the base from the outside and bonded thereto by solder.

A wafer level package and a manufacturing method thereof capable of reducing stress between an under bump metal and a bump. The wafer level package includes a substrate provided with a plurality of chip pads on a top surface; a first passivation layer to expose the chip pads; vias connected to the chip pads by passing through the first passivation layer; a metal wiring layer formed on the first passivation layer and connected to the vias; an under bump metal formed on the first passivation layer to be connected to the metal wiring layer and having a buffer pattern separated through a trench on a center; a second passivation layer formed on the first passivation layer to expose the under bump metal; a first bump formed on the buffer pattern; and a second bump filling the trench and formed on the first bump and the under bump metal.

A wind turbine blade comprising an aerodynamic fairing supported along at least a portion of its axial length by a spar (12). The spar comprises at least two spar segments (12) joined end-to-end at an interface (9), each spar segment comprising a shear web (3) with a spar cap (4) on each side. The outer face (6) of each spar cap tapers inwardly towards the interface such that its depth is reduced towards the interface creating a recess on each side of the interface formed by the tapered faces of adjacent spar caps. A respective connection piece (8) is sized to fit into each recess. Each connection piece (8) is sized to fit into each recess. Each connection piece (8) being fixed to the tapered faces of adjacent spar caps to form a double scarf joint.

A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball.The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.

A semiconductor device includes a semiconductor substrate and an array of protruding electrodes arranged at a pitch X1. Each of the protruding electrodes has a height X3 and is formed on a barrier metal base of diameter X2 coupled to an electrode arranged on the semiconductor substrate so as to satisfy the relations (X1 / 2)≦X2≦(3*X1 / 4) and (X1 / 2)≦X3≦(3*X1 / 4).

A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad exposed from the surface of the insulating layer in a peripheral region of the cavity. A chip is flip-chip bonded to the pads in the cavity of the package, and another package is bonded to the pads in the peripheral region of the cavity, to thereby form a semiconductor device having a package on package (POP) structure.

The invention discloses a one-component ultraviolet-light-anaerobic dual-curing adhesive. The adhesive comprises the following active ingredients in percentage by weight: 40-50% of epoxy acrylate, 15-20% of polyurethane acrylate, 30-35% of acrylics reactive diluents, 1-2% of photoinitiator, 0.5-1% of oxidizing agent, 0.1-0.5% of reducing agent, 0.1-0.5% of polymerization inhibitor, and 0.5-2% of accelerator. The one-component ultraviolet-light-anaerobic dual-curing adhesive has the advantage of entirely solving the difficulty that the photocuring adhesive cannot be entirely cured at the shading parts. In addition, the adopted resin contains acrylate and double bonds. Through the one-component ultraviolet-light-anaerobic dual-curing adhesive, the photocuring reaction and anaerobic curing reaction are well combined, the reaction system is uniform, the curing property is excellent, the binding reliability is high, the energy resource can be saved, and the application range is wide.

The invention relates to a dimer acid type polyamide hot melt adhesive and a preparation method thereof. The polyamide hot melt adhesive contains an N alkyl substitution diamine structure and consists of 50 percent of component A and 50 percent of component B according to mole percent, wherein the component A consists of 60-90 percent of unsaturated aliphatic dimer acid and 10-40 percent of aliphatic dicarboxylic acid according to the mole percent; the component B comprises 60-90 percent of N alkyl substituted aliphatic diamine, 10-30 percent of aliphatic diamine and 0-10 percent of heterocyclic diamine according to the mole percent. The dimer acid type polyamide hot melt adhesive has high softening point, good low-temperature resistance, high elongation, low high-temperature melting viscosity, high tensile strength and shearing intensity, and is suitable for low-pressure molding-injection forming process; and the dimer acid type polyamide hot melt adhesive has high bonding reliability and is particularly suitable for bonding of polar high polymer materials.