42results about How to "Guaranteed vacuum tightness" patented technology

The invention provides a semiconductor device, which comprises a preheating cavity. The preheating cavity comprises a shell, a heater arranged at the bottom of the shell and used for placing a substrate, an electrode arranged at the top of the shell and positioned above the substrate, and a lifting rotating mechanism connected with the electrode. According to the semiconductor device provided by the invention, the steps of thin film deposition can be simplified.

The invention discloses a making process of a wind-power blade main model, which belongs to the technical field of wind-power blade molding. The process comprises the following steps of: 1) making a metal steel frame platform at the bottom; 2) laying a wood plate; 3) coating epoxy resin white carbon black filler on the surface of the wood plate, placing multiple EPS (Expandable Polystyrene) polystyrene solid foams according to the shape of the designed main model in a laminated way, and bonding and fixing the EPS polystyrene solid foams; 4) machining profiles of the EPS polystyrene solid foams; 5) pasting glass fiber reinforced plastic airtight layers on the machined profiles in the step 4); 6) detecting the vacuum degrees of the glass fiber reinforced plastic airtight layers; 7) uniformly spreading wood substituted epoxy resin layers on the surfaces of the glass fiber reinforced plastic airtight layers which satisfy the vacuum degree requirements, controlling the spreading thicknesses at about 15-35 mm and curing the wood substituted epoxy resin layers at normal temperature; and 8) machining the surfaces of the wood substituted epoxy resin layers; and then coating gel coat layers on the wood substituted epoxy resin layers and curing and molding the wood substituted epoxy resin layers to obtain the main model. The main model made by using the process disclosed by the invention has the advantages of high profile precision, easiness for construction operation, low making cost as well as contribution to promotion and application.

The invention relates to a vacuum-pumped packaging bottle, which comprises a pump head and an elastic body. A discharge pipe is arranged in the pump head, and two through holes arranged in sequence along the discharge direction and close to each other are arranged in the discharge pipe, and the two through holes are connected together. One-way connected one-way valve, the fluid in the discharge pipe can only flow from the end of the one-way valve far away from the discharge port to the end close to the discharge port. The elastic body is mainly composed of a pressing cylinder, a telescopic cylinder and an annular connecting piece. Both ends of the tube are open, and the two open ends located on both sides of the connecting piece and close to each other are respectively connected with the inner ring and outer ring of the connecting piece. The hollow discharge cylinder has a plurality of discharge openings on the side wall of the hollow discharge cylinder. The parts in the vacuum-pumped packaging bottle of the present invention are compact and reliable, firmly connected, not easy to fall off during use, simple in structure, convenient in operation, can automatically cut off the paste, prevent paste backflow, and have good vacuum sealing performance.

The invention provides a method and device for testing the adhesion coefficient of a friction pair couple material. The method and device provided by the invention can realize loading and unloading ofnormal test load on the couple material in vacuum and ultrahigh vacuum environments and accurate measurement of cold welding force (adhesive force). According to the testing method for the adhesion coefficient of friction pair couple material, the action force generated by electromagnetic coils and magnets is transmitted to the couple material via a balancing lever so as to realize loading and unloading of the couple material in a vacuum environment, and thus, the measurement of cold welding force and adhesive force is accomplished; and a ratio of the cold welding force to the adhesive forceis calculated so as to obtain the adhesion coefficient of couple material in the vacuum environment.

The invention relates to a modularization continuous microwave freeze-drying cavity which comprises a chamber body and a shielding plate. A boss part is arranged in the middle of the shielding plate, and body sealing ring grooves are formed in the four sides of the boss part. A shielding plate installation channel is formed in the middle of the bottom face of the chamber body. Grooves are formed in the two ends of the outer surface of the chamber body in the length direction of the chamber body, and positioning pin assembling holes are formed in the grooves. Adjacent sealing ring grooves are formed in the part, around the hollow structure, of one side end face of the chamber body. By means of the modularization continuous microwave freeze-drying cavity, the temperature change deformation difference caused by inconformity of coefficients of linear expansion between a freeze-drying bin made of nonmetal wave-transmitting materials and the microwave shielding plate made of metal materials is effectively overcome, and the vacuum sealing performance is ensured; a metal connecting piece between a chamber body and a shielding plate in the conventional technology is removed, and the microwave loading uniformity in the freeze-drying process is ensured; assembling is achieved through modularization design, and the requirements for increasing the yield and expanding production are effectively met.

The present invention relates to a charge induction imaging method based on semiconductor layer, wherein the charge induction imaging method comprises the following steps: 1) changing the fluorescent screen of photoelectronic imaging device to the semiconductor layer with a substrate, setting a position sensitive anode at the outer side of vacuum at the back surface of substrate of semiconductor layer, and the range of square resistance of semiconductor layer is 100Momega / piece to 1000Momega / piece; 2) receiving the light signal of measured object by the photoelectronic conversion part of photoelectronic image device, transmitting photon into an electron optical system, entering a microchannel plate after focusing for multiplication, and forming an electron cloud; 3) bombarding the semiconductor layer after the microchannel plate with the electron cloud after electric field acceleration; 4) collecting the charges on the semiconductor layer through charge induction by the position sensitive anode at the back surface of substrate of semiconductor layer; and 5) realizing imaging detection through exteriorly connecting the position sensitive anode with an electron read-out circuit and a computer image output circuit. The charge induction imaging method of the invention settles the technical problems of inferior imaging quality, hard vacuum closing and inconvenient anode changing inprior art.

A refrigerator jacket structure for superconducting magnets and methods for its installation and disassembly, which relate to the technical fields of cryogenic engineering and superconducting magnets; from top to bottom, it includes a refrigerator flange seat (3), a first-stage bellows ( 11), the first-stage flange seat (12) that forms a thermal connection with the cold shield, the second-stage bellows (21), and the second-stage flange seat (22) that forms a thermal connection with the superconducting coil; the flange seat of the refrigerator (3) is connected with the primary flange seat (12) through the primary bellows (11), and between the primary flange seat (12) and the secondary flange seat (22) through the secondary bellows (21 ) connection; it has the characteristics of low conduction heat leakage, high vacuum sealing performance, high thermal connection efficiency, and long life of the refrigerator.