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Method for manufacturing high-heat-conductivity molybdenum-copper-nickel alloy

A technology of high thermal conductivity and nickel alloy, which is applied in the field of manufacturing high thermal conductivity molybdenum-copper-nickel alloy, can solve the problems of poor wettability of solder and poor heat dissipation ability, and achieve vacuum airtightness, which is beneficial to ensure working reliability and material dense and even effect

Active Publication Date: 2013-01-16
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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Problems solved by technology

[0003] Conventional fixed-expansion alloys such as Kovar can meet the requirements for expansion coefficient, but their heat dissipation ability is poor, so they cannot be used in these occasions; and molybdenum-copper alloys, tungsten-copper alloys, etc., are not ideal for welding due to their poor wettability to solder. There are restrictions on the use of components such as energy transmission windows with high reliability requirements

Method used

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  • Method for manufacturing high-heat-conductivity molybdenum-copper-nickel alloy

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Embodiment Construction

[0028] The method of making high thermal conductivity molybdenum-copper-nickel alloy includes:

[0029] 1) Mixing process: Weigh the mixed powder with a mass ratio of Mo powder: Cu powder: Ni powder = 80:10:10, and stir it on a centrifugal ball mill for 4 hours;

[0030] 2) Pressing process: Put the mixed powder evenly stirred into the pressing mold, set the pressure on the hydraulic press to 10-50t, and press the blank;

[0031] 3) Vacuum sintering process: Put the stamped blank into a vacuum furnace for high-temperature sintering. The temperature curve of high-temperature sintering is:

[0032] Heat up to (800±50)°C within 1 hour, keep warm for 0.5-1.5 hours;

[0033] Then heat up to (1250±10) °C within 1 hour and keep warm for 0.5-1.5 hours;

[0034] Then cool to room temperature within 2 hours;

[0035] 4) Copper immersion process: Melt the oxygen-free copper in a hydrogen atmosphere furnace, put the blank after vacuum sintering into the molten copper for immersion, and...

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Abstract

The invention discloses a method for manufacturing high-heat-conductivity molybdenum-copper-nickel alloy. The method includes steps of firstly, mixing: weighing mixed powder of Mo (molybdenum) powder, Cu(copper) powder and Ni (nickel) powder to stir on a centrifugal ball mill for 4 hours; secondly, pressing: placing the mixed powder stirred uniformly into a pressing die for blank pressing; thirdly, sintering in vacuum: placing pressed blank into a vacuum furnace to sinter at a high temperature; fourthly, impregnating copper: melting oxygen-free copper in a hydrogen atmosphere furnace, placing the blank sintered in vacuum to impregnate in melted copper liquid; fifthly, turning: turning the impregnated blank according to the requirements, removing surplus copper layers on the surface; and sixthly, scouring: impregnating turned parts into solution to scour, washing the parts by tap water, and dewatering and drying the parts by alcohol. The molybdenum-copper-nickel alloy manufactured by the above method can be used for metal ceramic structures of high-power traveling wave tubes such as energy transmission windows and collector electrodes and key parts having high requirements for heat radiation.

Description

technical field [0001] The invention relates to the field of microwave vacuum devices, in particular to a method for manufacturing molybdenum-copper-nickel alloy with high thermal conductivity. Background technique [0002] Some key components of high-power traveling wave tubes are in a high temperature state during operation, such as energy transmission windows, collectors, etc., so there are extremely high requirements on the thermal conductivity of materials, and only materials with high thermal conductivity can transmit their heat in time out, so as to ensure the reliability of the whole tube work. Moreover, these parts are all metal-ceramic structures, and the expansion coefficient of the metal materials used must be close to that of ceramics, so as to facilitate brazing. [0003] Conventional fixed-expansion alloys such as Kovar can meet the requirements for expansion coefficient, but their heat dissipation ability is poor, so they cannot be used in these occasions; a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C27/04C22C1/04
Inventor 吴华夏周秋俊曹振玲吴磊程海
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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