A deposition mask according to an embodiment includes a metal plate having a first surface and a second surface, the metal plate including iron and nickel, having a thickness of 15 [mu] m to 30 [mu] m, the metal plate including a first surface layer having a depth of 20% or less of the thickness of the metal plate and a second surface layer having a depth of 20% or less of the thickness of the metal plate, when the diffraction intensities with respect to the (111), (200) and (220) crystal planes of the first surface layer are defined as I (111), I (200) and I (220), respectively, the ratios of the diffraction intensities of I (220), I (200) and I (220) are defined by Formula 1, Formula 2 and Formula 3, respectively, [Formula 1] A = I (220) / (I (200) + I (220) + I (111)) [Formula 2] B = I (200) / (I (200) + I (220) + I (111)) [Formula 3] C = I (111) / (I (200) + I (220) + I (111)) A is greater than the values of B and C, the value of B is greater than the value of C, and when the ratio of B to A (B / A