88results about How to "Delay light decay" patented technology

A light emitting device (LED) employs one or more conductive multilayer reflector (CMR) structures. Each CMR is located between the light emitting region and a metal electrical contact region, thereby acting as low-loss, high-reflectivity region that masks the lossy metal contact regions away from the trapped waveguide modes. Improved optical light extraction via an upper surface is thereby achieved and a vertical conduction path is provided for current spreading in the device. In an example vertical, flip-chip type device, a CMR is employed between the metal bottom contact and the p-GaN flip chip layer. A complete light emitting module comprises the LED and encapsulant layers with a phosphor. Also provided is a method of manufacture of the LED and the module.

An inter-layer insulating film and a gate insulating film which are positioned on the optical path of light from an organic EL element to be externally emitted, for example, located under a transparent electrode, are removed. Because SiO2 films having a refractive index which differs significantly from refractive indexes of other films are used for these films, there was a problem of light attenuation in these layers. Such light attenuation can be reduced by removing these layers located in the region through which light from the organic EL element passes.

The present invention provides a method for constructing an LED bulb (102) with high interchangeability and universality, an integral LED bulb (102) and a lamp. A silver paste printed circuit (4) is embedded on a heat conductive bracket (3) sintered by a nonmetal heat conductive material and provided with a cooling fin, and then an LED chip is welded on the silver paste printed circuit (4) or a drive chip is further welded thereon to form the LED bulb (102). The bulb may operate independently, so that the LED bulb (102), the lamp and a lighting control product are independently produced and used, which greatly reduces manufacturing links of LED lighting products, improves mass production and facilitates the industrialization of LED energy-saving lighting products.

The optical connector includes a holder unit, a first optical fiber fixedly supported by the holder unit and having an inclined end face, a first collimating lens spaced from the inclined end face, a mounting unit supported relative to the holder unit, a second optical fiber disposed opposite the first collimating lens and having an inclined end face, a second collimating lens disposed between the first collimating lens and the second optical fiber and spaced from the inclined end face of the second optical fiber, wherein an optical transmission system comprising the first optical fiber and the first collimating lens is symmetric to an optical transmission system comprising the second optical fiber and the second collimating lens with respect to a plane perpendicular to the optical axis.

The invention relates to a RGB colour-mixing LED rotary lamp based on a micro heat pipe. The RGB colour-mixing LED rotary lamp based on the micro heat pipe comprises a heat dissipation base, RGB-LED light sources, a heat conducting pipe and a heat dissipation device, wherein the heat dissipation base is of a hollow sphere structure, one end of the heat conducting pipe is located in the heat dissipation base, the other end of the heat conducting pipe is connected with the heat dissipation device, and the heat dissipation device is located outside the heat dissipation base; a plurality of lamp holes are formed in the outer surface of the heat dissipation base, the quantity of the RGB-LED light sources is equal to that of the lamp holes, and the RGB-LED light sources are arranged in the lamp holes respectively. According to the RGB colour-mixing LED rotary lamp based on the micro heat pipe disclosed by the invention, the integrally-packaged RGB-LED light sources are used, and capable of providing abundant lamp light colour changes, and due to three-dimensional lamp packaging, the light beam visual angles of the lamps are expanded. The efficient heat dissipation material of a heat dissipation film is added on the surface of the heat dissipation base of the lamp, and the heat conducting pipe is used for dissipating heat, and capable of rapidly dissipating the heat generated by the high-power RGB-LED light sources, thus prolonging the service lives of the lamps and delaying the light attenuations of the RGB-LED light sources.

A light source device is disclosed and includes a reflective cup, a light-emitting chip, and a light transmissive substrate. The reflective cup has an opening. The light-emitting chip has a light-emitting layer, a first light-emitting surface, and a second light-emitting surface. The first and second light-emitting surfaces are opposite right to a first side and a second side of the light-emitting layer. The light-emitting chip is disposed inside the reflective cup, such that light emitted from the first and second sides emits out of the light-emitting chip through the first and second light-emitting surfaces respectively to be reflected by the reflective cup to be emitted out of the reflective cup through the opening. Therefore, the light extraction efficiency of the light-emitting chip can be improved.

A keyboard device includes at least an illuminant element, at least a pressing key element and a light guide element. The pressing key element includes a keycap reciprocating along a first axial direction when being pressed and a recovering component attached to the keycap for supporting and pushing back the keycap when not pressed. The light guide element is located at one side of the recovering component. The light guide element includes at least a light-incident part and a light-emitting part. The light-incident part is used for receiving light emitted from the illuminant element. The light-emitting part emits light along a second axial direction to the recovering component so that the recovering components guide light to the keycap, wherein the second axial direction is different to the first axial direction.

The optical connector includes a holder unit, a first optical fiber fixedly supported by the holder unit and having an inclined end face, a first collimating lens spaced from the inclined end face, a mounting unit supported relative to the holder unit, a second optical fiber disposed opposite the first collimating lens and having an inclined end face, a second collimating lens disposed between the first collimating lens and the second optical fiber and spaced from the inclined end face of the second optical fiber, wherein an optical transmission system comprising the first optical fiber and the first collimating lens is symmetric to an optical transmission system comprising the second optical fiber and the second collimating lens with respect to a plane perpendicular to the optical axis.

The invention discloses a COB (Chip On Board) packaged LED (Light Emitting Diode) light source. The LED light source comprises a substrate, an electrode, an LED chip and a fluorescent glue, wherein the electrode is arranged on the substrate; the LED chip is arranged on a positive surface of the substrate and is electrically connected with the electrode; the fluorescent glue covers the LED chip; and the substrate is a transparent substrate, and the heat dispersion of the transparent substrate is good. According to the COB packaged LED light source and a manufacturing method thereof provided by the invention, the substrate is changed from an opaque substrate into a cooling transmitting substrate with high efficiency, so that the COB packaged LED light source can shine 360 degrees, an emitting angle and a luminous range of a product are extended, and a lighting effect of the light source is improved. In addition, a substrate material is good in heat dissipation performance and fast in heat dispersion velocity, so that the condition that the fluorescent glue is subjected to aging failure in a high-temperature working environment is avoided, the service life of the fluorescent glue is prolonged, and the thermal resistance and lumens depreciation of the product is reduced. Therefore, the COB packaged LED light source and the manufacturing method can be suitable for a COB packaging technology with high power.

The invention discloses an LED streetlamp illumination light adjusting system based on a DC remote power supply. The LED streetlamp illumination light adjusting system comprises a DC remote power supply (central office terminal) device and a plurality of LED streetlamp control devices, wherein the DC remote power supply device performs AC / DC conversion on the AC mains supply to generate a constant-voltage and constant-current high voltage direct current suspended to ground, and transmits the high voltage direct current to the LED streetlamp control devices by means of power cables; each LED streetlamp control device is connected with the corresponding LED streetlamp; and each LED streetlamp control device provides a constant-voltage and constant-current direct current to the corresponding LED streetlamp for driving LED lamp beads to emit light, and controls luminous flux of the corresponding LED streetlamp for adjusting light. The LED streetlamp illumination light adjusting system performs AC / DC conversion on the unstable and unreliable AC mains supply to generate the constant-voltage and constant-current high voltage direct current suspended to ground, transmits the direct current to the LED streetlamps by means of the power cables, and performs remote light adjustment on the LED streetlamps by adopting the PLC remote light adjusting technology, thereby achieving the purposes of saving energy, reducing consumption, decreasing cost and expense of operation and maintenance, reducing light attenuation and prolonging service life.

The present invention provides a LED flat-plate type multi-chip high power light source comprising a heat dissipating substrate, a reflecting cover mounted on the heat dissipating substrate, LEDs mounted on the heat dissipating substrate and in the reflecting cover, a circuit board embedded in the heat dissipating substrate connecting to the LEDs, and the circuit board also connecting to a socket set in the heat dissipating substrate. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance.

The invention relates to a method for preparing hydrogen, in particular to a method for preparing hydrogen by using photosynthetic bacteria. The method takes a light emitting diode (LED) as a light source to radiate the photosynthetic bacteria, so that the hydrogen is produced. An LED lamp is adopted to be taken as a photosynthetic bacteria hydrogen producing source, and an LED spectral band has the advantages of long service life, slow light decay, convenient installation and easy control, and can provide stable and even light source for the photosynthetic bacteria. Furthermore, as the LED is little in electric power consumption, the cost for producing hydrogen is saved. Compared with an electric incandescent lamp, the LED lamp with monochromatic source has remarkable promoting effect on increasing the hydrogen volume produced from the photosynthetic bacteria.

The invention discloses heat-conducting silicone grease and a manufacturing method thereof. The heat-conducting silicone grease can be applied onto an LED (light-emitting diode) lamp by coating to improve heat dissipation efficiency, and is manufactured from the following raw materials in percentage by weight: 10 to 20 percent of nano-modified heat-conducting filler, 10 to 15 percent of nitride powder, 40 to 50 percent of oxide filler, 5 to 20 percent of silicone oil and 5 percent of assistant; the manufacturing process of the heat-conducting silicone grease is as follows: weighing needed silicone oil and assistant according to weight percentage, placing into a stainless steel mixing tank for heating, so as to enable the silicone oil and assistant to disperse at high speed, heating to raise the temperature to 50 to 80 DEG C, adding a proper amount of nano-modified heat-conducting filler, nitride powder, and oxide filler, performing high-speed stirring, then starting a vacuum machine to perform vacuum pumping while stirring, after the stirring and vacuum pumping are performed for 60min, placing the heat-conducting silicone grease in the stainless mixing tank onto a grinder for grinding to enable the heat-conducting silicone grease to be finer and more uniform, and package can be performed after grinding.

A glue for packaging a light emitting diode (LED) is described and includes a first set of compositions and a second set of compositions mixed based on a predetermined weight ratio. The first set of compositions is poly(dimethyl siloxane), and the second set of compositions includes a copolymer of dimethyl siloxane, methyl hydrogen siloxane, and vinyl siloxane. The copolymer in the second set of compositions has a weight percentage from about 94% to 99%, dimethyl siloxane in the copolymer has a weight percentage from about 84% to 90%, methyl hydrogen siloxane in the copolymer has a weight percentage from about 4% to 9%, and vinyl siloxane in the copolymer has a weight percentage from about 2% to 7%. A use of the glue for packaging a LED is also described.

The invention relates to a solid-state fluorescent carbon quantum dot with a variable luminous color and a preparation method thereof. The carbon quantum dot is prepared by a reaction of resorcinol dihydrate as a carbon source, urea as a nitrogen source, and water as a solvent under microwave heating at a power of 250-500 W. The prepared carbon quantum dot can emit bright fluorescence with an adjustable color in a solid state, an emission peak spans from 508 nm to 635 nm, the entire visible spectrum is covered, especially the carbon quantum dot can emit long-wavelength fluorescence, and thereby the carbon quantum dot is suitable for preparing white light emitting diodes as a phosphor.

A new concept of the LCD light-switching optical filter allowing for very high, electrically controlled, continuously variable light attenuation (up to ≧100,000) optimized / symmetrized for the light incidence along the normal to the LCD plane is proposed. The new LCD light-switching optical filter also exhibits very low light attenuation dependence for the oblique incidence of light within a limited cone of angles off the normal incidence direction in compliance with the international safety and quality regulation EN 379 for personal protection equipment.According to the invention the problem is solved by specific, novel modification of the general principle of highly twisted nematic LCDs, allowing for the adaptation of the light transmission / driving voltage characteristics to specific requirements of the driving electronics as well as “symmetrizing” the overall optical birefringent properties, which in turn results in a high degree of their angular compensation.

A LED lamp structure includes a light emitting module and a lamp holder. The lamp holder has a plurality of air guiding slots and the through holes. During operation of the LED lamp, the free convection of ambient air is allowed from the air guiding slot to the through hole to dissipate the generated heat and decrease the working temperature of the LED lamp. The structure is simple and easy to manufacture. Furthermore, the easy-to-process material is utilized to make the mass production be easy. Also, the cost has certainly decreased.

A white light emitting diode (LED) and the packing method thereof are described. The white LED includes a supporting frame, a LED chip, glue for mixing phosphor powder, and phosphor powder, wherein the glue for mixing phosphor powder comprises a first set of compositions and a second set of compositions, the first set of compositions comprises polydimethyl-siloxane, and the second set of compositions comprises the copolymer having dimethyl-siloxane, methyl hydrogen siloxane and vinyl-siloxane wherein the copolymer has a weight percentage from about 94% to 99%, the dimethyl-siloxane has a weight percentage from about 84% to 90%, the methyl hydrogen siloxane has a weight percentage from about 4% to 9%, and the vinyl-siloxane has a weight percentage from about 2% to 7%.

A glue for packaging a light emitting diode (LED) is described and includes a first set of compositions and a second set of compositions mixed based on a predetermined weight ratio. The first set of compositions is poly(dimethyl siloxane), and the second set of compositions includes a copolymer of dimethyl siloxane, methyl hydrogen siloxane, and vinyl siloxane. The copolymer in the second set of compositions has a weight percentage from about 94% to 99%, dimethyl siloxane in the copolymer has a weight percentage from about 84% to 90%, methyl hydrogen siloxane in the copolymer has a weight percentage from about 4% to 9%, and vinyl siloxane in the copolymer has a weight percentage from about 2% to 7%. A use of the glue for packaging a LED is also described.

The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protective rubber ring mounted at the front side of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protective rubber ring, the heat dissipating substrate being provided with two through holes penetrating its front side and rear side, in each of the two through holes separately provided with a pin connected to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the rear side of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a insulator. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly.

An integrated circuit structure includes a semiconductor chip including a front surface and a back surface; a via extending from the back surface of the semiconductor chip into the semiconductor chip, wherein the via is light transparent; and a photon detector in the semiconductor chip and exposed to the via.

The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protecting rubber ring mounted at the obverse of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protecting rubber ring, the heat dissipating substrate being provided with two through holes impenetrating its obverse and inverse, in each of the two through holes separately provided with a pin connecting to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the inverse of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a dielectric. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly.

The invention relates to a high-power LED street light which consists of an electric part, a heat transfer part, an optical part and a supporting and preventing part, wherein the electric part comprises a power supply, an LED chip and a thermoelectric isolation device; the heat transfer part comprises a radiating substrate with an internal radiating channel, an aluminum radiating body also provided with an internal radiating channel, a tubule and a thermoelectric isolation device; the radiating channel in the radiating substrate and the radiating channel in the aluminum radiating body are communicated through the tubule to form a radiating loop, and a heat transfer medium is filled in the radiating loop; the optical part comprises LED grains on the LED chip, chip silica gel, fluorescent powder and a lens according to an optical path; the supporting and preventing part comprises a plastic cover, a mesh cover and a fastening piece; the aluminum radiating body is arranged in the plastic cover, and the mesh cover is arranged at an opening part of the plastic cover; the lens is fixed on the radiating substrate by using a clamp; the radiating substrate, the power supply and the LED chip are respectively arranged in a larger space between the aluminum radiating body and the mesh cover; the LED chip is tightly adhered to the radiating substrate and positioned at the side near to the mesh cover; and the power supply is positioned at the side close to the aluminum radiating body. According to the high-power LED street light, high-efficiency heat transfer is a core technology, thereby bringing a corresponding matched design of the power supply and a power supply circuit.

The invention discloses a multi-purpose flat plate lamp. The multi-purpose flat plate lamp comprises a lamp bead installment layer, a diffusion plate, a printed light-guiding plate and a reflective sheet, wherein the lamp bead installment layer, the diffusion plate, the printed light-guiding plate and the reflective sheet are sequentially arranged in an overlapped mode. The reflective sheet is attached to the bottom of the printed light-guiding plate, and optical membrane capable of ensuring that permeated delaying light becomes soft is overlapped between the diffusion plate and the printed light-guiding plate. Compared with the prior art, because the optical membrane is additionally arranged on the multi-purpose flat plate lamp on the basis of the structure of an ordinary flat plate lamp, luminance brightness of a light source is dropped, but the effective light distance is increased to ensure that light effect is guaranteed within the distance, and meanwhile color rendering indexes are increased. Furthermore, because a heat dissipation body is arranged on an aluminum frame of the multi-purpose flat plate lamp, service life of a power source is prolonged and light weakening of a light-emitting diode (LED) light bead is delayed.

A device for transmitting light signals includes two electrode plates, a spacing structure, a cladding fluid, and a core fluid. The spacing structure, the cladding and core fluids are disposed between the electrode plates. The refractive index of the core fluid is higher than that of the cladding fluid. The core fluid is located on an electrode of one of the electrode plates, and its shape corresponds to the shape of that electrode. The shape and position is changeable and programmable by the electrodes of one of the electrode plates. The core fluid is further surrounded by the cladding fluid, forming an optical waveguide. Via these arrangements, the interface between the core and cladding fluids is much smoother than that between a fluid and a solid, so that the light signals are less likely to scatter while transmitted, in the core fluid. Therefore, the attenuation and reduction of the intensity of the light signals can be decreased. A method for transmitting light signals is also provided.

The invention relates to an LED lighting unit with high thermal diffusivity and an adjustable light distribution light fitting applying the lighting unit. The invention relates the LED lighting unit which comprises a lamp body, an LED light source, an LED drive circuit board, a light transmission housing plate, a cover plate of the lamp body and end covers at the two sides of the lamp body; wherein, a plurality of LED light sources are arranged in the lamp body in array, the LED drive circuit board is arranged in the lamp body which is also provided with a plurality of rows of lattice-shaped heat conducting reinforcing rods that can effectively educe the LED light sources and the heat generated by the drive circuit board, and a revolving joint is arranged outside the end covers at the two sides of the lamp body; the adjustable light distribution light fitting comprises a mounting rack which is provided with a device that is fixedly connected a carrier and a device that is connected with the revolving joint of the LED lighting unit with high thermal diffusivity in an adjustable way. The LED lighting unit can ensure the service performance and the service life of the light fitting, improves the production efficiency and meets the requirements for distribution light in most of the time. The adjustable light distribution light fitting has convenient assembly, good universality, high installation efficiency, convenient maintenance and adjustable lighting angle.

The invention provides a transflective liquid crystal display device which can provide a display with good visibility, and a method of producing the same. A method of producing a liquid crystal display device in which a step of forming an inner polarizing layer of a transflective liquid crystal panel to perform a displaying operation in a transmission mode and a reflection mode includes making the direction of extension of openings, or through holes, formed in a reflective layer to reflect incident light and the direction of exerting stress to apply a material of the inner polarizing layer are the same when the material of the inner polarizing layer is applied while exerting a stress thereupon.

The invention discloses an LED illuminating lamp with a bud bulb, which comprises the bulb, an inner lampshade shell and light source integration modules, wherein the bulb comprises a lamp shell and a light-transmission lampshade, and the inner lampshade shell is positioned in the bulb. The inner lampshade shell is an inverted polygonal frustum with a vent hole on the lower end face, conical surfaces of the inner lampshade shell are arrayed in the light-transmission lampshade in a distributed manner, and a light source hole is arranged on each conical surface of the inner lampshade shell. An air inlet corresponding to the inner lampshade shell is arranged on the lower portion of the light-transmission lampshade, so that a through pneumatic convection channel is formed between the air inlet and an air outlet arranged on the lamp shell. The number of the light source integration modules is the same as that of the conical surfaces of the inner lampshade shell, and each light source integration module is mounted on the corresponding conical surface of the inner lampshade shell in such manner than an LED light source is embedded into each light source hole of the inner lampshade shell and a plurality of radiating fins are positioned on the inner side of the conical surface, so that the direction of radiating slots formed among the radiating fins on each light source integration module is the same as that of the pneumatic convection channel.

The invention discloses an electronic endoscope and a surgical robot. The electronic endoscope comprises an image acquisition part, a driving mechanism, a joint assembly and an outer heat conduction flexible pipe, wherein the image acquisition part comprises a housing, a light source disposed in the housing, and a connecting part disposed at one end, far away from the light source, of the housing;the joint assembly is connected with the connecting part and the driving mechanism, and the joint assembly is used for bending under the driving action of the driving mechanism to drive the image acquisition part to move; the outer heat conduction flexible pipe is connected with the housing and wraps the joint assembly so as to conduct heat generated by the light source. Good heat dissipation canbe provided for the light source of the electronic endoscope, so that the problem of light attenuation is reduced.

A light emitting device (LED) employs one or more conductive multilayer reflector (CMR) structures. Each CMR is located between the light emitting region and a metal electrical contact region, thereby acting as low-loss, high-reflectivity region that masks the lossy metal contact regions away from the trapped waveguide modes. Improved optical light extraction via an upper surface is thereby achieved and a vertical conduction path is provided for current spreading in the device. In an example vertical, flip-chip type device, a CMR is employed between the metal bottom contact and the p-GaN flip chip layer. A complete light emitting module comprises the LED and encapsulant layers with a phosphor. Also provided is a method of manufacture of the LED and the module.