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113results about How to "Avoid physical contact" patented technology

Polymer supported electrodes

Methods and devices arising from the practice thereof for making and using battery electrodes formed onto ion permeable, electrically non-conductive substrates, preferably battery separators are disclosed herein. Electrodes are formed onto substrates using a variety of methods including, but not limited to, spray coating and electrophoretic deposition. Electrically conductive layers may be applied to the electrode coating layer side opposite or adjacent to the substrate to act as current collectors for the battery. Multilayer devices having alternating layers of conductive layers, electrode layers and substrates, wherein the conductive layers may be in electrical communication with other conductive layers to form a battery.
Owner:MOLECULAR NANOSYST

High sensitivity amperometric biosensor with side-to-side hybrid configuration

An amperometric glucose biosensor comprises a sensing electrode and a reference electrode arranged in a side-by-side parallel configuration on an electrically insulating sheet. A passive cover electrode is placed over the side-by-side sensing electrode and reference electrode so that the active surface of the passive cover electrode opposes the active surfaces of the side-by-side electrodes. Physical contact between the passive covering electrode and the side-by-side electrodes is prevented by insulating spacers. The sensing electrode comprises a conductive graphite track coated with a formulation comprising a redox mediator and enzyme and the reference electrode is a parallel track comprising an Ag / AgCl formulation while the passive cover electrode comprising a conductive graphite track coated with a formulation comprising the same redox mediator as used in the sensing electrode but not including an enzyme. An opening either located in the middle or at one side of the passive cover electrode allows a liquid test sample to be introduced into the sensor. The biosensor of the present invention exhibits a sensitivity and response time equal to or surpassing that of the simple face-to-face configuration while can be efficiently manufactured and permit use with conventional electrical connectors.
Owner:KS BIOMEDIX LTD

Multi-chip stacking method to reduce voids between stacked chips

A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.
Owner:WALTON ADVANCED ENG INC

Hot isostatic pressing forming method used for improving part surface quality

ActiveCN105436505AImprove creep deformation efficiencyHigh degree of densificationCeramic coatingHigh pressure
The invention discloses a hot isostatic pressing forming method used for improving the part surface quality. The hot isostatic pressing forming method comprises the following steps that three-dimensional models of a wrapping sleeve and a shape control die core are designed according to the shape and size of a formed part; the stainless steel wrapping sleeve and the carbon steel shape control die core are manufactured according to the manufactured three-dimensional models; a ceramic coating is sprayed on the surface of the shape control die core through a physical vapor deposition (PVD) method; the shape control die core is fixed in the wrapping sleeve, and the wrapping sleeve is filled with powder and shaken to be compacted; the wrapping sleeve is subjected to air exhausting and heating treatment, sealing welding is conducted when the vacuum degree in the wrapping sleeve reaches a certain degree; the wrapping sleeve is subjected to hot isostatic pressing treatment through a technique that the temperature is increased at first and then the pressure is increased so as to make the powder be tightened and compacted under the action of the high temperature and the high pressure; and the wrapping sleeve and the shape control die core are removed to obtain the final part. According to the hot isostatic pressing forming method, the carbon steel die core with the coating serves as the shape control die core, and element diffusion between carbon steel cores and the powder can be effectively prevented; element segregation of the alloy surface due to diffusion is avoided, and the alloy surface quality is improved.
Owner:HUAZHONG UNIV OF SCI & TECH

Power supply system and method for a movable vehicle within a structure

A power supply system and method for a vehicle movable within a structure is provided. The power supply system includes at least one energy source arranged at a fixed location within the structure to transmit energy within the structure, and a receiver, arranged on the vehicle to receive the energy transmitted from the energy source, being configured to convert the energy to electrical power and / or thrust.
Owner:HYPERLOOP TECH INC

Multi-chip stacking method to reduce voids between stacked chips

A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a dielectric layer and a FOW adhesive (film over wire) adhesive are attached onto a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.
Owner:WALTON ADVANCED ENG INC

Heat-pipe-type alkali-metal vapor laser device

The invention belongs to the technical field of lasers, and discloses a heat-pipe-type alkali-metal vapor laser device which is used for solving the problem that vapor coagulates on windows in an existing alkali-metal vapor laser device. A gain unit is designed to be of a heat pipe structure. A left window and a right window are arranged at the two ends of a pipe shell and sealed. The center of the pipe shell is sleeved with a heater. A left refrigerator and a right refrigerator are symmetrically arranged at equidistant positions of the two ends of the heater. The space between the left refrigerator and the heater is filled with a left thermal insulation material layer, and the space between the right refrigerator and the heater is filled with a right thermal insulation material layer. The pipe shell is lined with a liquid absorption core, and the liquid absorption core extends from the left end of the left refrigerator to the right end of the right refrigerator in the length direction. A left inflation inlet is formed between the left window and the left refrigerator and is adjacent to the left window, and a right inflation inlet is formed between the right window and the right refrigerator and is adjacent to the right window. A resonant cavity is of an L-shaped structure formed by an output mirror, a totally-reflecting mirror and a polarization beam splitter, the output mirror is arranged above the polarization beam splitter, and the totally-reflecting mirror is arranged on the right of the polarization beam splitter. The gain unit is placed between the polarization beam splitter and the totally-reflecting mirror.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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