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42results about How to "Avoid glue residue" patented technology

Printing strippable protective ink, and preparation method and application thereof

The invention discloses a printing strippable protective ink, and a preparation method and application thereof. The ink comprises the following components in parts by weight: 50-80 parts of thermoplastic film-forming resin, 20-50 parts of low-viscosity plasticizer, 1-10 parts of filler and pigment, and 1-3 parts of functional assistant. The printing strippable protective ink has 100% solid rate, does not volatilize any solvent, is a green environment-friendly material, and satisfies the increasingly higher ecological environmental requirements. The ink has the advantages of no irritating smell, moderate viscosity and no voids, is not sticky to the printing screen, and is easy for printing operation; the ink can form a film by thermosetting at medium / low temperature, so the energy consumption is low; the thermosetting film has high flexibility, favorable heat resistance, favorable insulativity and favorable acid / alkali resistance, and effectively solves the influence on the resistance when etching the circuit on a transparent conductive film with acid and alkali in the touch screen manufacturing process; and after the conductive film protecting technique is finished in the touch screen manufacturing process, the protective ink layer can be easily stripped, and does not leave any residue, thereby effectively solving the problem of protection of the conducting film in the existing touch screen manufacturing process.
Owner:PANYU NANSHA YAN TIN CHEM

Adhesive for UV viscosity-reducing film and UV viscosity-reducing film thereof

The invention discloses an adhesive for a UV viscosity-reducing film and the UV viscosity-reducing film thereof. The adhesive is prepared from the following raw materials in parts by mass: 30-60 partsof acrylate resin, 8-12 parts of tackifying resin, 5-10 parts of a polyfunctional monomer, 0.5-3 parts of an antistatic agent, 2-3 parts of a photoinitiator, 1.5-4 parts of a curing agent and 25-50 parts of a solvent. According to the UV viscosity-reducing film, the stripping force before UV illumination is larger than 25 N / 25 mm, the stripping force after UV illumination is lower than 0.1 N / 25 mm, no residual adhesive is left, the viscosity-reducing film has excellent antistatic performance, and the resistance of the adhesive layer is 109 ohms or below.
Owner:HEFEI LUCKY SCI & TECH IND

Process film production method for process of stable adhesion after high temperature, and product thereof

The invention discloses a process film production method for a for process of stable adhesion after a high temperature, and a product thereof. A substrate in the process film is a PET, PO, PVC or PP optical film with a thickness of 25-200 [mu]m, and one side of the optical film is subjected to corona treatment; and a pressure-sensitive adhesive layer is a UV viscosity reducing adhesive layer, andcomprises 0.1-5% of a photoinitiator having an absorption wavelength of 200-400 nm and 0.5-10% of nanocrystall beads, and the pressure-sensitive adhesive is applied to the corona surface of the substrate, and is covered with a release film, the peeling strength before UV is 500-5000 g / 25 mm, and the peeling strength after UV is 0-100 g / 25 mm. The peel strength is stable when the process film is used in a high temperature environment, so the problem that the peeling strength of the UV viscosity reducing adhesive film in the high temperature environment is greatly increased is solved, the residual glue phenomenon is avoided, the stability of the technology process is increased, and the yield and the efficiency are improved. The product is mainly applied to the processing process of a film group at present.
Owner:上海精珅新材料有限公司

Servo gluing quantification machine

The invention discloses a servo gluing quantification machine. The servo gluing quantification machine comprises a servo electric cylinder, a support and a glue cylinder, wherein the servo electric cylinder is fixedly connected with the glue cylinder through the support; the glue cylinder is provided with a glue feeding cavity with an upper opening; a throat sealing metal piece is mounted at the upper part of the glue feeding cavity in a sealed manner and provided with a vertical shaft hole; a piston rod is mounted in the vertical shaft hole; a dynamic sealing piece for sealing a gap between the piston rod and the vertical shaft hole is mounted in the vertical shaft hole; the diameter of the piston rod is smaller than the inner diameter of the glue feeding cavity; a glue feeding port communicated with the glue feeding cavity is formed in the bottom of the glue cylinder; a glue feeding valve is mounted in the glue feeding port; a push rod of the servo electric cylinder is coaxially arranged above the piston rod; a glue discharging cavity is formed in the glue cylinder, and the upper part of the glue discharging cavity is communicated with the glue feeding cavity through communicating holes; a glue discharging port communicated with the glue discharging cavity is formed in the bottom of the glue cylinder; a glue discharging valve is mounted in the glue discharging port. The servogluing quantification machine has beneficial effects as follows: first-in first-out of glue is guaranteed by adopting an isovolumetric replacement principle, and the problem of glue stacking or glueresidues in the glue cylinder is solved.
Owner:YANTAI KEPAI INTELLIGENT TECH CO LTD

Manufacturing method of copper block-embedded circuit board

The invention discloses a manufacturing method of a copper-block-embedded circuit board, and relates to the technical field of printed circuit board manufacturing. The thickness of the embedded copper block is controlled to be smaller than that of the circuit board, the height difference prevents glue from flowing to the board surface of the circuit board after lamination, and the phenomenon of residual glue on the board surface is avoided; copper reduction treatment is carried out on the upper and lower surfaces of the circuit board, so that the thickness of the circuit board is smaller than that of the embedded copper block, and the height difference enables the upper and lower surfaces of the embedded copper block to protrude out of the circuit board, so that the upper and lower surfaces of the embedded copper block are subjected to glue removal; finally, the upper and lower board surfaces of the circuit board and the upper and lower surfaces of the embedded copper block are subjected to board grinding treatment to remove colloid on the upper and lower surfaces of the embedded copper block, and meanwhile it is guaranteed that the upper and lower board surfaces of the circuit board are flush with the upper and lower surfaces of the embedded copper block. According to the manufacturing method, the glue removing efficiency is improved, and meanwhile, the board surface of the copper block embedded circuit board is prevented from being deformed and damaged.
Owner:DONGGUAN SHENGYI ELECTRONICS

A kind of manufacturing method of buried copper block circuit board

The invention discloses a method for manufacturing a copper-buried circuit board, and relates to the technical field of printed circuit board manufacturing. The present invention firstly controls the thickness of the buried copper block to be smaller than the thickness of the circuit board, and the height difference prevents the colloid from flowing to the board surface of the circuit board after lamination, avoiding the phenomenon of residual glue on the board surface; Copper reduction treatment makes the thickness of the circuit board smaller than that of the buried copper block, and the height difference makes the upper and lower surfaces of the buried copper block protrude from the circuit board, so as to facilitate the cleaning of the upper and lower surfaces of the buried copper block; finally, the upper and lower surfaces of the circuit board The board surface and the upper and lower surfaces of the buried copper block are uniformly ground to remove the colloid on the upper and lower surfaces of the buried copper block, and at the same time ensure that the upper and lower surfaces of the circuit board are flush with the upper and lower surfaces of the buried copper block. The above manufacturing method not only improves the glue removal efficiency, but also avoids the deformation and damage of the board surface of the buried copper circuit board.
Owner:DONGGUAN SHENGYI ELECTRONICS

Wafer processing method and wafer obtained by the wafer processing method

The present invention provides a wafer processing method and a wafer obtained by the wafer processing method. The wafer processing method comprises a solvent cleaning step before a random appropriate processing step is performed, wherein a wafer can be properly kept and residual adhesive after stripping of a binding sheet is prevented in the processing step. The wafer processing method of the invention comprises the steps of: a binding sheet binding step for binding the wafer on the binding strip which is provided with a substrate and an adhesive layer with radiating-ray curable adhesive; a radiating ray irradiating step of irradiating radiating ray on the adhesive layer of the binding sheet for processing the wafer; the cleaning step of cleaning the wafer by the solvent; and a processing step of processing the wafer. In the wafer processing method of the invention, the radiating ray irradiating step is performed before the cleaning step.
Owner:NITTO DENKO CORP
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