High-heat conductivity coefficient graphite heat-radiation adhesive tape

A high thermal conductivity, thermally conductive adhesive technology, applied in the direction of adhesives, film/flake adhesives, non-metallic elements, etc., can solve the problems of limiting the application scope of graphite heat sinks, increasing the thermal conductivity of graphite heat sinks, and having limited effects. Achieve the effect of favoring graphite cutting, reducing the probability of graphite cracking, and improving performance and life.

Active Publication Date: 2014-09-03
斯迪克新型材料(江苏)有限公司
View PDF9 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although these methods can partially improve the thermal conductivity of graphite materials, the effect is limited. The thermal conductivity is generally lower than 600, while the thermal conductivity of a graphite single crystal surface can reach 2200. It can be seen that the thermal conductivity of graphite heat sinks has a large theoretical value. upside
In addition, because graphite is easy to form a layered crystal structure, and there is no ordered structure between layers, it has significant anisotropy, that is, the axial thermal conductivity is often only a few tenths of that of the face. Application range of heat sink

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-heat conductivity coefficient graphite heat-radiation adhesive tape
  • High-heat conductivity coefficient graphite heat-radiation adhesive tape
  • High-heat conductivity coefficient graphite heat-radiation adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: A graphite thermal tape with high thermal conductivity comprises a graphite layer 1, the upper surface of the graphite layer 1 is covered with a metal layer 4, the lower surface of the graphite layer 1 is coated with a thermally conductive adhesive layer 2, and a The molded film 3 is pasted on the other surface of the thermally conductive adhesive layer 2; the graphite layer 1 is obtained by the following process, which includes the following steps:

[0033] Step 1. Add triethylamine to the polyamic acid solution, stir well and apply it on the organic substrate layer;

[0034] Step 2, under the protection of nitrogen, keep the temperature at 80°C for 0.95 hours;

[0035] Step 3, place in an oven in a vacuum environment, keep the temperature at 100°C for 1.05 hours, then raise the temperature to 300°C, keep the temperature at 0.9 hours and then cool naturally, so as to obtain a polyimide film;

[0036] Step 4. Under the protection of an inert gas, the poly...

Embodiment 2

[0041] Embodiment 2: A graphite heat dissipation adhesive tape with high thermal conductivity, comprising a graphite layer 1, the upper surface of the graphite layer 1 is covered with a metal layer 4, the lower surface of the graphite layer 1 is coated with a thermally conductive adhesive layer 2, a release The molded film 3 is pasted on the other surface of the thermally conductive adhesive layer 2; the metal layer 4 is composed of an aluminum layer 41 and a copper layer 42 laminated, and the copper layer 42 is located between the aluminum layer 41 and the graphite layer 1;

[0042] The graphite layer 1 is obtained by the following process, which process comprises the following steps:

[0043] Step 1. Add ethylene glycol to the polyamic acid solution, stir well and apply it on the glass substrate layer;

[0044] Step 2, under the protection of nitrogen, keep the temperature at 80°C for 1 hour;

[0045] Step 3, place in an oven in a vacuum environment, keep the temperature at 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-heat conductivity coefficient graphite heat-radiation adhesive tape. The high-heat conductivity coefficient graphite heat-radiation adhesive tape comprises a graphite layer. A metal layer is coated on an upper surface of the graphite layer. A heat-radiation adhesive layer is coated on a lower surface of the graphite layer. The graphite layer is prepared by adding ethylene glycol or triethylamine into a polyamide acid solution, heating to a temperature of 300 DEG C to obtain a polyimide film, heating the polyimide film to a temperature of 250 DEG C, heating to a temperature of 1200 DEG C to obtain a pre-sintered carbonized film, rolling the pre-sintered carbonized film by a roller mill, heating to a temperature of 2400 DEG C, heating to a temperature of 2900 DEG C to obtain a mainly sintered graphite film, and rolling the mainly sintered graphite film. The high-heat conductivity coefficient graphite heat-radiation adhesive tape has high heat conduction performances in vertical and horizontal directions, avoids adhesive tape local overheating and realizes uniformity of adhesive tape heat conduction performances.

Description

technical field [0001] The invention relates to a graphite heat dissipation adhesive tape with high thermal conductivity, which belongs to the technical field of adhesive tapes. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C01B31/04C01B32/205
Inventor 金闯杨晓明李炜罡
Owner 斯迪克新型材料(江苏)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap