Ultraviolet curable adhesive sheet

A technology of adhesive sheets and ultraviolet rays, which is applied in the direction of adhesive types, ester copolymer adhesives, film/sheet adhesives, etc., can solve the problems of wafer surface contamination and adhesion, and prevent adhesive residue , cost reduction, excellent light peeling effect

Pending Publication Date: 2021-08-06
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In an adhesive sheet having an adhesive layer formed using an ultraviolet-curable adhesive, fine particles adhere to the surface of the adherend in the peeling process after ultraviolet irradiation, causing contamination of the wafer surface.

Method used

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  • Ultraviolet curable adhesive sheet
  • Ultraviolet curable adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0096] Preparation of Adhesive Base Polymer Solution

[0097] 100 parts by weight of 2-ethylhexyl acrylate, 25.5 parts by weight of acryloylmorpholine, 18.5 parts by weight of 2-hydroxyethyl acrylate, 0.2 parts by weight of a polymerization initiator (benzoyl peroxide (BPO)), and The solvent (toluene) was mixed, thereby preparing a monomer composition. Put this monomer composition into a 1L round-bottom detachable flask equipped with a detachable lid, a separatory funnel, a thermometer, a nitrogen introduction tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade for polymerization. In the experimental apparatus, nitrogen substitution was performed at room temperature for 6 hours while stirring. Thereafter, while blowing nitrogen gas, the mixture was kept at 60° C. for 8 hours while stirring to perform polymerization to obtain a resin solution.

[0098] After cooling the obtained resin solution to room temperature, 2-isocyanatoethyl methacrylate (man...

manufacture example 2

[0099] Preparation of intermediate layer base polymer

[0100] 50 parts by weight of butyl acrylate, 50 parts by weight of ethyl acrylate, 5 parts by weight of acrylic acid, and 0.1 part by weight of azobisisobutyronitrile were polymerized in toluene under a nitrogen atmosphere at 60°C for 6 hours to obtain a weight average molecular weight of 65 million acrylic resins.

Embodiment 1

[0102] (Preparation of Adhesive Layer Forming Composition)

[0103] In 100 parts by weight of the polymer solution obtained in Production Example 1, 2 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name: Coronate L) and 1 part by weight of a photopolymerization initiator (manufactured by IGM Resins, trade name: Omnirad 127, 2-hydroxyl-1-{4-[4-(2-hydroxyl-2-methyl-propionyl)-benzyl]-phenyl}-2-methyl-propane-1-one) 3 parts by weight and carry out Stirring was carried out to obtain an ultraviolet curable adhesive composition.

[0104] (Preparation of Intermediate Layer Forming Composition)

[0105] To 100 parts by weight of the acrylic resin obtained in Production Example 2, 1 part by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name: Coronate L), 1 part by weight of a photopolymerization initiator (manufactured by IGM Resins, trade name: Omnirad 127 , 2-hydroxyl-1-{4-[4-(2-hydroxyl-2-methyl-propionyl)-benzyl]-pheny...

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Abstract

Provided is an ultraviolet-curable adhesive sheet having low contamination to the surface of an adhered object. The ultraviolet-curable adhesive sheet according to the present invention comprises a substrate and an adhesive layer. The number of particles having a particle size of less than 1.5 [mu] m on the surface of the silicon wafer to which the adhesive layer is attached after the ultraviolet-curable adhesive sheet has been peeled off after the ultraviolet irradiation test is less than 100.

Description

technical field [0001] The present invention relates to an ultraviolet curable pressure-sensitive adhesive sheet. More specifically, it relates to an ultraviolet curable pressure-sensitive adhesive sheet suitable for semiconductor wafer processing. Background technique [0002] Large scale integration (LSI) has been used in various applications such as personal computers, smartphones, and automobiles. In recent years, the miniaturization and high functionality of LSI have been advanced, and the surface structure of wafers has become increasingly complex. In addition, wire bonding is used as a method of connecting a semiconductor package and an integrated circuit. A wire made of gold (Au) is used as the bonding wire used in the wire bonding. In recent years, from the viewpoint of cost, there has been a change to silver (Ag) wires or copper (Cu) wires. These metal wires are more difficult to connect to the wafer surface than gold, and require a higher-strength bonding proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J7/25C09J7/50C09J133/08H01L21/683
CPCC09J133/066C09J2203/326C09J2433/003C09J2467/006C09J7/255C09J7/30C09J7/50H01L21/6836H01L2221/68327H01L2221/68386C09J11/06C09J7/20C09J7/385C09J2301/312C09J2301/416
Inventor 龟井胜利林美希
Owner NITTO DENKO CORP
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