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Adhesive for UV viscosity-reducing film and UV viscosity-reducing film thereof

A technology of adhesives and mucous membranes, applied in the direction of film/sheet adhesives, conductive adhesives, polymer adhesive additives, etc., can solve the problem that the adhesive layer does not have antistatic properties, and the process is complicated problems, to achieve excellent antistatic properties, simple process, and improve the effect of cross-linking

Inactive Publication Date: 2020-04-24
HEFEI LUCKY SCI & TECH IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Chinese patent document CN201610156835.5 discloses a heat-resistant UV viscosity-reducing adhesive composition and a UV-viscosity-reducing protective film prepared by the composition. A primer is coated on the surface of a PET substrate, and the primer is used as a PET substrate. The connection layer between the UV adhesive layer and the UV adhesive layer solves the problem of UV adhesive debonding from the substrate during high-temperature baking, but the peeling force before UV is lower than 20N / 25mm, and the adhesive layer does not have antistatic properties , and needs to be undercoated, the process is cumbersome
This invention uses PO film as the base material to expand the application range of UV adhesive tape, but the process is cumbersome, the peeling force before UV is lower than 20N / 25mm, and the adhesive layer does not have antistatic properties

Method used

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  • Adhesive for UV viscosity-reducing film and UV viscosity-reducing film thereof
  • Adhesive for UV viscosity-reducing film and UV viscosity-reducing film thereof
  • Adhesive for UV viscosity-reducing film and UV viscosity-reducing film thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Weigh 10g methyl methacrylate, 20g vinyl acetate, 8g n-octyl acrylate, 10g butyl acrylate, 1.2g hydroxyethyl acrylate, 0.5g hydroxypropyl methacrylate, 0.8g hydroxyethyl acrylate, 1g formazan Hydroxypropyl acrylate, 1.5g diacetone acrylamide, 0.8g N,N-dimethylacrylamide to prepare acrylate resin, the preparation method of acrylate resin is the same as CN108611033A.

[0032] Weigh 40g of prepared acrylate resin, 37.5g of ethyl acetate, 12.5g of acetone and mix evenly, then add 5g of triallyl isocyanate, 8g of terpene resin, 2g of petroleum resin, 0.5g of zinc oxide with a particle size of 80nm, 1g Benzoin dimethyl ether, 1g 2-hydroxy-2-methyl-1-phenylacetone, 1g 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2g hexamethylene diisocyanate trimer Stir and mix evenly to obtain an adhesive for UV mucous-reducing film.

[0033] Coat the adhesive for UV adhesive film on the non-antistatic layer of polyester film with a thickness of 50 μm, put it in an oven at 100°C for 2 min...

Embodiment 2

[0035] Weigh 15g methyl methacrylate, 18g vinyl acetate, 5g n-octyl acrylate, 8g butyl acrylate, 0.5g hydroxyethyl acrylate, 0.8g hydroxypropyl methacrylate, 1g hydroxyethyl acrylate, 0.5g formazan Hydroxypropyl acrylate, 1.2g diacetone acrylamide, 1.2g N,N-dimethylacrylamide to prepare acrylate resin, the preparation method of acrylate resin is the same as CN108611033A.

[0036] Weigh 50g of the prepared acrylate resin, 29.2g of ethyl acetate, 8.3g of acetone and mix evenly, then add 2.5g of triallyl isocyanate, 5g of 1,3-diallyl urea, 9g of terpene resin, 3g of petroleum resin , 0.8g of zinc oxide with a particle size of 50nm, 1g of tin oxide with a particle size of 40nm, 2.5g of 2-hydroxy-2-methyl-1-phenylacetone, 1g of hexamethylene diisocyanate trimer, 1.8g The isophorone diisocyanate trimer is stirred and mixed evenly to obtain an adhesive for UV film reduction.

[0037] Coat the adhesive for UV adhesive film on the non-antistatic layer of optical-grade polyester film w...

Embodiment 3

[0039] Weigh 20g methyl methacrylate, 10g vinyl acetate, 7g n-octyl acrylate, 6g butyl acrylate, 1g hydroxyethyl acrylate, 1g hydroxypropyl methacrylate, 0.5g hydroxyethyl acrylate, 1.2g methyl Hydroxypropyl acrylate, 0.8g of diacetone acrylamide, and 1.5g of N,N-dimethylacrylamide are used to prepare acrylate resin, and the preparation method of acrylate resin is the same as that of CN108611033A.

[0040] Weigh 30g of prepared acrylate resin, 24g of ethyl acetate, 6g of acetone and mix evenly, then add 5g of triallyl isocyanate, 5g of 1,3-diallyl urea, 7.9g of terpene resin, 3.1g of petroleum resin, 1g of tin oxide with a particle size of 20nm, 1.5g of benzoin dimethyl ether, 0.5g of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and 1.5g of isophorone diisocyanate trimer were stirred and mixed Evenly, an adhesive for UV mucous-reducing film is obtained.

[0041] Coat the adhesive for UV adhesive film on the non-antistatic layer of optical-grade polyester film with a thicknes...

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Abstract

The invention discloses an adhesive for a UV viscosity-reducing film and the UV viscosity-reducing film thereof. The adhesive is prepared from the following raw materials in parts by mass: 30-60 partsof acrylate resin, 8-12 parts of tackifying resin, 5-10 parts of a polyfunctional monomer, 0.5-3 parts of an antistatic agent, 2-3 parts of a photoinitiator, 1.5-4 parts of a curing agent and 25-50 parts of a solvent. According to the UV viscosity-reducing film, the stripping force before UV illumination is larger than 25 N / 25 mm, the stripping force after UV illumination is lower than 0.1 N / 25 mm, no residual adhesive is left, the viscosity-reducing film has excellent antistatic performance, and the resistance of the adhesive layer is 109 ohms or below.

Description

technical field [0001] The invention relates to the technical field of films, in particular to an adhesive for UV mucous-reducing film and a UV mucous-reducing film thereof. Background technique [0002] In the processing of large-scale integrated circuits and electronic devices, semiconductor chips are essential basic materials. Semiconductor chips are processed by single crystal silicon wafers, which are referred to as wafers for short. In the process of cutting and polishing the wafer, in order to ensure that the wafer does not scatter and there is no glue residue, a special protective film is required to bond and fix the wafer. The peeling force of the protective film used for fixing needs to be strictly controlled. In order to fix the wafer before, the peeling force of the protective film is required to be as large as possible (higher than 20N / 25mm). After processing, in order to avoid device damage when the protective film is torn off, the peeling force is required to...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06C09J11/08C09J9/02C09J7/25C09J7/30
CPCC09J4/06C09J9/02C09J11/04C09J11/06C09J11/08C09J2467/006C09J7/255C09J7/30C09J2301/122C09J2301/314
Inventor 安佳丽周守发牛正富祝亮胡程鹏王辉
Owner HEFEI LUCKY SCI & TECH IND
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