132 results about "Chip formation" patented technology

A metal workpiece is cut by rotating the workpiece while pressing the cutting edge of a cutting insert thereagainst for removing a chip from the workpiece. A first liquid jet is directed from a first nozzle toward an upper surface of the cutting insert for creating an hydraulic wedge between the cutting insert and the chip, and a second liquid jet is directed from a second nozzle toward a target point disposed above the upper surface of the cutting insert to engage and deflect the chip upwards and backwards.

A tool for chip-forming machining is made by passing first and second compounds through first and second coaxial dies, respectively, whereby the first material forms a center core of the tool, and the second material forms an outer rod of the material. The material of the core is tougher and less wear-resistant than the material of the outer rod. The coaxial first and second compounds are passed through a shaping die and then through a flute-forming structure which forms chip flutes in the outer rod.

The present invention relates to a turning insert that comprises a generally rectangularly shaped body having a front end surface with a main cutting edge at the intersection between the front end surface and an upper land area. A chipforming area is provided in the forward portion of the upper surface and is shaped in the form of a number of distinctly provided recesses and ridges in order to promote improved chip control and to obtain narrower chips in grooving operations.

[Problem] To provide a high precision and simple method for manufacturing semiconductor chips in semiconductor chip manufacturing that carries out back surface grinding of a semiconductor wafer which is used in a flip chip mounting process and has bump electrodes and simultaneously or in a process thereafter carries out chip formation without using underfilling, and also to provide a surface protective tape for thin-film grinding used in that method. [Solution] This manufacturing method for semiconductor chips grinds the back surface of a semiconductor wafer after formation of a modified layer within a wafer with bump electrodes, which has bumps for electrodes, on the semiconductor wafer on which a semiconductor circuit has been formed, and carries out division into individual chips in a batch. This method for manufacturing semiconductor chips has a step for applying surface protective tape for thin-film grinding in which a bonding film is laminated on an adhesive layer in an adhesive tape that has an adhesive layer on a base material film to the side of a semiconductor wafer on which a semiconductor circuit is formed on the bonding film side after formation of the modified layer and before the back surface of the semiconductor wafer is ground, and a step for creating a state in which only the bonding film bonds to the chips when the chips are picked up after back surface grinding of the semiconductor wafer or when transferred to a tape used for pick-up. The surface protective tape for thin-film grinding used therein is also provided.

An assembly of components for forming upon consolidation of the components a cutting insert for use in chipforming and material removal from a workpiece wherein the cutting insert receives coolant from a coolant source. The assembly comprises a cavity member that presents opposite first and second rake surfaces and a flank surface. The cavity member further presents a first cutting edge at the juncture of the first rake surface and the flank surface. The cavity member further has a first depression in the first rake surface that is generally adjacent to the first cutting edge. The cavity member has a first cavity channel in communication with the first depression. The assembly also has a first core member that has a first core channel and a first flange wherein when the components are assembled, the first core channel is adjacent to the first cavity channel and the first flange is adjacent to the first depression. The assembly also has a second core member which has a second flange containing a fifth notch and the second core member further containing a fifth notch channel opening into the fifth notch. When the components are assembled, the fifth notch is adjacent to the second rake surface and the fifth notch channel is adjacent to the first cavity channel. Upon consolidation of the components, the cavity member, the first core member and the second core member join together so that the first depression and the first flange define a first fluid spray chamber, and the first cavity channel and the first core channel and the fifth notch channel join together to form a fifth internal fluid passageway, which provides fluid communication from the fifth notch adjacent to the second rake surface to the first fluid spray chamber adjacent to the first rake surface.

A cutting insert for grooving and parting as well as profiling and longitudinal turning of metallic work-pieces, includes a shaft part and at least one cutting head. There is a front end surface at the front end of the cutting insert, and a rear end surface at the rear end of the cutting insert. The shaft part includes a top side, a bottom side and side surfaces extending between the tope and bottom two sides. The cutting head carries a cutting edge defined by the intersection between a chip surface and a clearance surface. The cutting edge has a circular shape and has mainly a constant curvature between the ends thereof. The chip side of the cutting head is provided with a first chip-forming device placed immediately inside the cutting edge.

Improved modular manifold (40) for heating and sanitary systems, comprising tubular manifold modules (21; 50, 51, 60, 61; 70, 71, 80) having integrally formed End coupling means (22, 23; 53, 54), and or only a tap (4), or a tap (4) and a regulating tap (3) for respectively receiving the pipes and switchgear of the split circuit ( 62). A metal preform (1) is provided for producing said manifold module (21; 50, 51, 60, 61; 70, 71, 80) by hot pressing and chip forming machining steps. Plastic manifold modules (21; 50, 51, 60, 61; 70, 71, 80) may also be injection molded.

The invention discloses a CVD diamond grinding wheel with an ordered micro-structured surface and a making method thereof. The grinding wheel is characterized in that a layer of diamond film is deposited on the outer circumferential face of a grinding wheel hub, a large number of staggered in-order micro grinding units are machined on the whole outer circumferential face of the diamond film, and the top ends of the grinding units are in kidney shapes. The making method is characterized in that through the chemical vapor deposition that is CVD, the diamond film is deposited on the outer circumference face of the grinding wheel hub, a pulse laser beam is adopted to machine the large number of micro grooves with the same geometric dimensioning in the outer circumference face of the whole diamond film, and the large number of micro grinding units are formed; the grinding units are arranged in a staggered and in-order manner, the top face of each grinding unit is in a kidney shape, according to the grinding wheel, the effective sharpening number of the grinding wheel during grinding can be improved, the chip formation efficiency and the surface material removal rate are improved, the cutting performance is improved, the surface machining quality and the cutting efficiency can be improved, the holding force of the grinding wheel hub to the grinding units can be increased, and the service life of the grinding wheel can be obviously prolonged.

This invention moderates the difficulty in chip formation or packaging which accompanies thinning of a semiconductor region where an integrated circuit is formed. An integrated circuit chip manufacturing method includes a first bonding step of bonding a first support member to a first surface of a semiconductor substrate which has the first surface and a second surface and has a semiconductor region including an integrated circuit on a first surface side thereof, a thinning step of removing a second surface-side portion of the semiconductor substrate bonded to the first support member to leave the semiconductor region, thereby thinning the semiconductor substrate, a second bonding step of bonding a second support member to the second surface side of the thinned semiconductor substrate, and a chip forming step of forming chips by cutting the semiconductor region.

A double-sided milling cutting insert has usable upper and lower faces. The upper face has a polygonal shape with curved edges. The lower face has a rotationally symmetrical relation to the upper face. Flank faces connect edges of the upper face to corresponding edges of the lower face. Upper cutting edges are formed on one of the edges of the upper face. The upper chip-forming portions have rake faces inclined downwardly from the upper cutting edges inwardly of the cutting insert and a plurality of protrusions arranged along inner boundaries of the rake faces for deflecting chips. When the cutting insert is mounted on the cutting tool, a width of the rake face of the upper chip-forming portion adjacent to an edge portion forming a main cutting edge gradually increases in a direction going away from a rotational axis of the cutting tool.

An indexable cutting insert includes a top surface, a bottom surface and a plurality of side surfaces. Each side surface includes a first pair of chip grooves, and a second pair of chip grooves. A planar corner surface is disposed between each side surface. A corner radius extends between the top and bottom surfaces and the planar corner surface. A plurality of primary wiper cutting edges are formed at an intersection between each of the first pair of chip grooves and the the top and bottom surfaces. A plurality of secondary roughing cutting edges are formed at an intersection between each corner radius and each of the first pair of chip forming grooves. A plurality of wiper cutting edges are formed at an intersection between each planar corner surface and each of the second pair of chip forming grooves. A milling cutter is also disclosed.

The invention discloses a device and a method for monitoring the tool state in a cutting process and chip formation. The device comprises a tool and an AE signal collector which are mounted on a toolholder, a workpiece, a test platform and a data acquisition system, wherein the tool holder includes a main clamp holder, a sub-clamp-holder and a heat-insulating damping pad, the tool and the heat-insulating damping pad are arranged side by side between the main clamp holder and the sub-clamp-holder, the sub-clamp-holder is locked on the main clamp holder in the forward direction through connecting bolts penetrating through the heat-insulating damping pad, the sub-clamp-holder reversely and tightly abuts against the main clamp holder through an adjusting bolt, and the AE signal collector is mounted on the sub-clamp-holder; and a first piezoelectric force transducer is arranged on the flank surface of the tool, a second piezoelectric force transducer is arranged on the rake face of the tool, a surface strain meter is mounted on the main clamp holder, and a high speed CCD camera is mounted above the tool. According to the device and the method for monitoring the tool state in the cutting process and the chip formation, AE signal has high acquisition precision, good independence and high relevance.

The present invention provides a LED chip and a formation method thereof. The method comprises: providing a first substrate which is provided with a front end structure consisting of a first semiconductor layer, an active layer and a second semiconductor layer from up to down, wherein the front structure has a zone 1 and a zone 2; forming a groove at the zone 1, wherein the groove penetrates the second semiconductor layer and the active layer; forming a connection conducting layer at the zone 1 around the groove and at the surface of the top of the second semiconductor layer; forming an insulation layer covering the connection conducting layer and the side wall of the groove and exposing the first semiconductor layer at the bottom of the groove and the surface of the top of the second semiconductor layer of the zone 2; performing the bonding processing to allow the insulation layer, the first semiconductor layer at the bottom of the groove and the second semiconductor layer of the zone 2 to combine with a second substrate through a bonding body; removing the first substrate; etching the front end structures of the zone 1 and the part of the zone 2 to respectively correspondingly expose part of the bonding body and the connection conducting layer; and forming an electrode layer at the surfaces of the connection conducting layer and the bonding body. The LED chip formation method can reduce the chip packaging complexity on a LED chip board.

A spade drill insert and drilling tool assembly is provided wherein the spade drill insert body comprises curved cutting edges and a lip groove having a trough substantially parallel to a plane formed through each adjacent curved cutting edge, which provides a significant improvement in chip formation during cutting operations.

A software structure which when adapted in an apparatus is capable of virtual manufacturing of transmission elements for example gear means with chip formation, the software structure comprising a start module for loading the source file in a main editor-file that contains the computer program, an input module for providing input parameters that are essential for the configuration of a product and a cutting tool, a product design module for evolving the parameters for the manufacturing of the product; and a virtual manufacturing module having at least three sub-modules one each for tool generation, visualisation of machining operation, and disassembly of the product from the machine bed.

A cutting insert for use in a chipforming material removal operation that includes a cutting insert body, which has a seating surface, a flank face, and a corner cutting region at the intersection of a peripheral edge and the flank adjacent corresponding corners thereof. The cutting insert body contains a central aperture. The seating surface contains a coolant delivery trough, which has a radial orientation toward a corresponding corner cutting region. The coolant delivery trough has a radial outward end terminating at the peripheral edge and a radial inward end opening into the central aperture. There are a pair of lateral topographic regions wherein the one lateral topographic region is along one side of the coolant delivery trough and the other lateral topographic region is along other side of the coolant delivery trough.

Disclosed is a single-lip drill comprising a drill head (11) that is provided with a blade (12) which is embodied on said drill head. The blade encompasses a cutting edge (19) for machining a workpiece (16) in a cutting manner. At least one chip-forming device (21) which shapes chips (22) cut by the cutting edge is associated with the cutting edge. The chip-forming device is provided with a positive cutting angle (gamma) such that the mechanical and thermal stress can be reduced in the area of the blade (12). In addition, the chip-forming device can comprise a functional coating (29a, 29b) which is made especially of hard material and is applied after providing the drill with the exterior shape thereof.

A method of generating ejection pattern data for a plurality of nozzles for use in selectively ejecting functional liquid droplets from the nozzles is to draw on ore more one chip-forming area on a workpiece. The method includes a pixel-setting step of setting pixel information concerning an array of pixels in the chip-forming areas, a chip-setting step of setting chip information concerning an array of the chip-forming areas on the workpiece, a nozzle-setting step of setting nozzle information concerning an array of the nozzles, and a data-generating step of generating the ejection pattern data for the nozzles from the pixel information, the chip information, and the nozzle information, based on a positional relationship between the workpiece and the functional liquid droplet ejection head. The ejection pattern data are easily and quickly generated for the nozzles arranged in an array in the plurality of functional liquid droplet ejection heads.

A process for semiconductor device production which comprises: a preparation step in which a substrate for element mounting (108) equipped with a plurality of package areas (114) separated by dicing regions (112) is prepared; a mounting step in which semiconductor chips (116) are mounted respectively on the package areas (114) of the substrate for element mounting (108); a molding step in which the semiconductor chips (116) are simultaneously encapsulated by molding with an encapsulating epoxy resin composition; and a chip formation step in which the resultant structure is diced along the dicing regions (112) to separate the individual encapsulated semiconductor chips (116). The encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a hardener, (C) a silicone resin, (D) an inorganic filler, and (E) a hardening accelerator, wherein the silicone resin (C) is a branched silicone resin that is a methylphenyl-type thermoplastic silicone resin and has repeating structural units represented by general formulae (a), (b), (c), and (d). (In the formulae, symbol * indicates a bond with the Si atom contained in a repeating structural unit of another or the same kind; and R1a, R1b, R1c, and R1d are each a methyl or phenyl group and may be the same as or different from one another. The content of Si-bonded phenyl groups is 50 mass% or higher of the molecule, and the content of Si-bonded OH groups is less than 0.5 mass% of the molecule.) The formulae is shown in the specification.

A groove-type through hole passing through a silicon layer and a first interlayer insulating film is formed in a region around a chip formation region including a photodiode. In the groove-type through hole, a wall-like wall-type conductive pass-through portion corresponding to the groove-type through hole is formed. An electrode pad is in contact with the wall-type conductive pass-through portion. The electrode pad is electrically connected to a first interconnection through the wall-type conductive pass-through portion.