129results about How to "Thermal conductivity" patented technology

A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g., a liquid metal).

A porous polymer sheet or membrane is provided with a thin coating of an electrically non-conductive ceramic composition and the coating conforms to all surfaces, including the pore surfaces, of the membrane. Such a coated membrane serves well, for example, as an intra-cell separator in a lithium ion battery. The coating increases the mechanical properties and thermal stability of the separator in battery operation and retains electrolyte. The coating may be formed by a two-step vapor-phase process in which atoms of one or more metals such as aluminum, calcium, magnesium, titanium, silicon and/or zirconium are deposited in a conformal layer on a workpiece surface. The metal atoms may then be reacted with ammonia, carbon dioxide, and or water to form their respective non-conductive nitrides, carbides, and/or oxides on the surface. The two-step process is repeated as necessary to obtain a ceramic material coating of desired thickness.

An integrated heat sink article composed of a heat collection member and at least one heat dissipation member integral to the heat collection member, wherein the heat collection member is configured to be in thermal contact with a heat source, collects heat from the heat source, and dissipates heat through the at least one heat dissipation member, and further wherein the heat sink is formed of a nano graphene platelet-reinforced composite having nano graphene platelets or sheets (NGPs) as a first reinforcement phase dispersed in a matrix material and the first reinforcement phase occupies a weight fraction of 1-90% based on the total composite weight. Preferably, these NGPs, alone or in combination with a second reinforcement phase, are bonded by an adhesive and constitute a continuous 3-D network of electron- and phonon-conducting paths.

A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g., a liquid metal).

An electrostatic chuck 108 is provided on a lower electrode 106 provided inside a processing chamber 102 of an etching apparatus 100, and a conductive inner ring body 112a and an insulating outer ring body 112b are encompassing the outer edges of a wafer W mounted on the chuck surface. The temperatures of the wafer W and the inner and outer ring bodies 112a and 112b are detected by first third temperature sensors 142, 144 and 146. A controller 140 controls the pressure levels of He supplied to the space between the center of the wafer W and the electrostatic chuck 108 via first gas outlet ducts 114 and to the space between the outer edges of the wafer W and the electrostatic chuck 108 via second gas outlet ducts 116 and the quantity of heat generated by a heater 148 inside the outer ring body 112b based upon the information on the temperatures thus detected so that the temperatures of the wafer W and the inner ring body 112a are set roughly equal to each other.

An electronic apparatus having a structure for protecting a flexible printed circuit (FPC) and a chip thereon is described, including a metal backplate, a first circuit and a second circuit respectively on the front side and the back side of the backplate, a metal frame plate at the periphery of the backplate, at least one FPC with at least one chip thereon, a metal screen plate, and at least one insulating elastic ring disposed around the FPC. The FPC has a first end connected to the first circuit and a second end connected to the second circuit over the frame plate, and the screen plate is disposed on the frame plate screening the FPC and the chip. The inner periphery of the insulating elastic ring closely contacts with the chip, and the outer periphery of the ring closely contacts with the frame plate and the screen plate.

A carbon fiber composite sheet comprising a pitch-based carbon fiber web and a matrix resin, wherein

• • carbon fibers constituting the pitch-based carbon fiber web have a crystallite size in the hexagonal net plane direction of 5 nm or more and a thermal conductivity in the thickness direction of 1 W/(m·K) or more.

This carbon fiber composite sheet is used for radio shielding and heat conduction.

Isocyante-based polymer foams containing functionalized nano-scale materials in which the functional groups are OH, NH₂, COOH or NCO groups. The incorporation of such functionalized nano-scale materials into the isocyanate-based polymer foams provides foams with improved properties such as insulation values, mechanical properties and flame retardancy performance properties, including but not limited to k-factor and dimensional stability.

Provided are designs for a plasma display module (PDM) that has a plasma display panel (PDP) and a chassis base with circuits mounted thereon. Heat dissipating layers and plane structures are formed between the PDP and the chassis base. The heat dissipating layer and the plane structure have novel shapes and sizes and are made out of specific materials or combinations of materials to improve the heat dissipating characteristics for the PDM. Preferably, a high-orientation graphite material having a high thermal conductivity is used for the heat dissipating layer. The plane structure is a highly conductive metal that is positioned between the graphite layer and the glass PDP to form a better contact to the PDP, to better draw heat away from the PDP and to allow for easy attachment and detachment of the graphite layer to the PDP.

The apparatus comprises a double walled vacuum insulated vessel defining a cryogen space for holding a cryogenic fluid, a pump assembly comprising a pump with a suction inlet disposed within the cryogen space, and at least one elongated member extending from the pump to a drive unit disposed outside the cryogen space. The elongated member comprises an elongated non-metallic section that has a thermal conductivity that is less than that of a structurally equivalent elongated stainless steel member of the same length. In preferred embodiments, the elongated member can be one or both of a drive shaft or a rigid structural member for supporting the pump and holding it in a fixed relationship to the drive unit. The method employs the apparatus to increase hold times for holding cryogenic fluids by reducing heat leak into the cryogen space.

Wafer treatment process and apparatus is provided with a wafer carrier arranged to hold wafers and to inject a fill gas into gaps between the wafers and the wafer carrier. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers.

A composition for thermal barrier coatings exhibiting improved thermal conductivity and toughness is provided. The composition is comprised of a base majority oxide, a first dopant oxide, at least one small rare earth oxide, at least one large rare earth oxide and at least one toughening oxide. Compared to traditional thermal barrier coatings, a composition of the present invention provides approximately twice the toughness one-third to one-half the thermal conductivity.

The invention relates to a waterproof coating, in particular to a waterproof coating of a carton, which comprises the following components in weight part: 30-120 parts of paraffin micro-emulsion, 50-90 parts of simethicone, and 4-8 parts of emulsifier. The waterproof coating is prepared according to a method as follows: (1) heating the paraffin micro-emulsion to 50-180 degree C; (2) adding simethicone and stirring for 0.5-3 hours; and (3) adding the emulsifier, stirring at a high speed for 10-40 minutes, and cooling to the room temperature. The waterproof coating of the carton, disclosed by the invention, has no pollution on the human body and the environment, can be combined with the base material firmly, and has excellent waterproof property.

A production method for a metallized substrate to produce a metallized substrate which comprises: a sintered nitride ceramic substrate; a titanium nitride layer formed on the sintered substrate; and a metal layer containing copper, silver and titanium formed on the titanium nitride layer. The method comprises: a step of layering a first paste layer containing copper powder and titanium hydride powder on the sintered nitride ceramic substrate, to produce a first layered body; a step of layering a second paste layer containing silver-copper alloy powder on the first paste layer of the first layered body, to produce a second layered body; and a step of firing the second layered body, to thereby form the titanium nitride layer and the metal layer on the sintered nitride ceramic substrate.

Provided is an improved cooler-integrated semiconductor module.

A semiconductor module (100) includes a plurality of cooling plates (12), and a plurality of flat-plate semiconductor packages (5) and flat-plate device packages (2). The semiconductor packages (5) each include a semiconductor element housed therein. The device packages (2) each include an electronic component housed therein, the electronic component being different in type from the semiconductor element housed in the semiconductor elements. The cooling plates (12) are laminated alternately with the semiconductor packages (5) or the device packages (2). Connecting tubes (13a, 13b) having refrigerant flowing therein are provided between the cooling plates (12) adjacent to each other.

The invention proposes a copper-based material with low thermal expansion and high thermal conductivity having good machinability and adaptability to nickel plating and also proposes a method for producing the same. The copper-based material is prepared through the steps of: adding 5 to 60% of iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering it at temperatures of 400 to 600° C.