124results about How to "Simply formed" patented technology

An impact driver in which a drill mode can be selected without fail is provided. In a hammer case, a connecting sleeve is provided so as to be slidable back and forth. At the backward position, the connecting sleeve engages with only a first engaging tooth provided on the outer circumference of the hammer for rotating integrally. At the forward position, it engages with both the first engaging tooth of the hammer and a second engaging tooth of an anvil for rotating integrally with both of them, and thus a drill mode is obtained. Further, an operating bolt is provided in the hammer case to be inserted into a concave groove of the connecting sleeve through a guide groove formed in the hammer case. The operating bolt slides the connecting sleeve to the forward or backward position by its movement in the guide groove.

A method for manufacturing panels including a substrate on the basis of a pressed material mass, whereby it is started from a material mass to be densified, wherein the density of this material mass, in one or more densifying steps, is at least doubled. Prior to one or more of these densifying steps, a colorant is added to the material mass.

An impact driver in which a drill mode can be selected without fail is provided. In a hammer case, a connecting sleeve is provided so as to be slidable back and forth. At the backward position, the connecting sleeve engages with only a first engaging tooth provided on the outer circumference of the hammer for rotating integrally. At the forward position, it engages with both the first engaging tooth of the hammer and a second engaging tooth of an anvil for rotating integrally with both of them, and thus a drill mode is obtained. Further, an operating bolt is provided in the hammer case to be inserted into a concave groove of the connecting sleeve through a guide groove formed in the hammer case. The operating bolt slides the connecting sleeve to the forward or backward position by its movement in the guide groove.

An impact driver capable of boring and having an excellent usability is provided. An anvil(8) is arranged so as to slightly move in the axial direction. A first cam(29) having cam gears(30, 30 . . . ) is externally provided at the anvil so as to be integral with the anvil(8). At the rear of the first cam(29), a second cam(31) having cam gears(32, 32 . . . ) and further having cam gears(36, 36 . . . ) at its outer circumference is externally provided to the anvil(8) so as to be rotatable. At the backward position of the anvil(8), the cam gears(30, 32) contacts with each other. On the other hand, in the cylindrical portion(27) of the hammer case(5), an engaging pin(37) capable of engaging with an engaging gear(36) of the second cam(31) is provided. The engaging pin(37) can change its location by the rotative operation of a mode-change ring(40), whereby a percussion mode and a non-percussion mode is selected.

A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and / or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

Active otoplastics (3) with integrated earpieces (4) are to be acoustically optimized. There is provision here for forming a sound outlet (8) into the otoplastic in accordance with acoustic conditions. If the sound outlet (8) has the form of an exponential horn, this results in advantages for supply of high tones. The earpiece (4) can be secured with the aid of an adapter (5) into the otoplastic (3) so that it can be exchanged.

A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and / or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

An electroless plating step for forming external electrodes includes preparing a plating solution including a reducing agent and metal ions having a more electochemically positive deposition potential than the oxidation-reduction potential of the reducing agent, placing a laminate for a multilayer electronic component together with a conductive medium having catalytic activity for an oxidation reaction of the reducing agent in a vessel, and stirring the laminate and the conductive medium in the plating solution by rotation, shaking, inclination, or vibration. Electroless plating proceeds to connect each other plating deposits deposited on the ends of a plurality of internal electrodes.

Although an ink jet method known as a method of selectively forming a film of a high molecular species organic compound, can coat to divide an organic compound for emitting three kinds (R, G, B) of light in one step, film forming accuracy is poor, it is difficult to control the method and therefore, uniformity is not achieved and the constitution is liable to disperse. In contrast thereto, according to the invention, a film comprising a high molecular species material is formed over an entire face of a lower electrode connected to a thin film transistor by a coating method and thereafter, the film comprising the high molecular species material is etched by etching by plasma to thereby enable to selectively form a high molecular species material layer. Further, the organic compound layer is constituted by a material for carrying out luminescence of white color or luminescence of single color and combined with a color changing layer or a coloring layer to thereby realize full color formation.

A multibit electro-mechanical memory device comprises a substrate, a bit line on the substrate, a first interlayer insulating film on the bit line, first and second lower word lines on the first interlayer insulating film, the first and second lower word lines separated horizontally from each other by a trench, a spacer abutting a sidewall of each of the first and second lower word lines, a pad electrode inside a contact hole, first and second cantilever electrodes suspended over first and second lower voids that correspond to upper parts of the first and second lower word lines provided in both sides on the pad electrode, the first and second cantilever electrodes being separated from each other by the trench, and being curved in a third direction that is perpendicular to the first and second direction; a second interlayer insulating film on the pad electrode, first and second trap sites supported by the second interlayer insulating film to have first and second upper voids on the first and second cantilever electrodes, and first and second upper word lines on the first and second trap sites.

A board mounting type connector includes: a housing being made of a resin, the housing holding a plurality of terminals, each terminal being arranged in parallel and connected to a circuit board; and a metal fastening member being fixed to both ends of the housing in a widthwise direction of the housing in which the terminals are arranged, the metal fastening member being mounted to the circuit board, and each metal fastening member having an engaging portion which engages with a housing of a counterpart connector fitted into the board mounting type connector so that the connectors are engageable to each other in a fitted state.

In a method for producing a multilayer ceramic substrate, a green ceramic laminate includes green conductive patterns arranged on a plurality of ceramic green sheets and portions to be formed into a plurality of multilayer ceramic substrates. Boundary-defining conductive patterns are arranged on the ceramic green sheets and along boundaries of the multilayer ceramic substrates. The boundary-defining conductive patterns have firing shrinkage characteristics that are different from those of the ceramic green sheets. During firing of the green ceramic laminate, cavities adjacent to edges of the boundary-defining conductive patterns are formed. A sintered ceramic laminate is divided at edges passing through the cavities.