124results about How to "Simply formed" patented technology

An impact driver capable of boring and having an excellent usability is provided. An anvil(8) is arranged so as to slightly move in the axial direction. A first cam(29) having cam gears(30, 30 . . . ) is externally provided at the anvil so as to be integral with the anvil(8). At the rear of the first cam(29), a second cam(31) having cam gears(32, 32 . . . ) and further having cam gears(36, 36 . . . ) at its outer circumference is externally provided to the anvil(8) so as to be rotatable. At the backward position of the anvil(8), the cam gears(30, 32) contacts with each other. On the other hand, in the cylindrical portion(27) of the hammer case(5), an engaging pin(37) capable of engaging with an engaging gear(36) of the second cam(31) is provided. The engaging pin(37) can change its location by the rotative operation of a mode-change ring(40), whereby a percussion mode and a non-percussion mode is selected.

Active otoplastics (3) with integrated earpieces (4) are to be acoustically optimized. There is provision here for forming a sound outlet (8) into the otoplastic in accordance with acoustic conditions. If the sound outlet (8) has the form of an exponential horn, this results in advantages for supply of high tones. The earpiece (4) can be secured with the aid of an adapter (5) into the otoplastic (3) so that it can be exchanged.

Disclosed herein is an image-transfer medium, comprising an ink vehicle-absorbing layer, which is subjected to a release treatment, and coloring material-retaining layer.

Although an ink jet method known as a method of selectively forming a film of a high molecular species organic compound, can coat to divide an organic compound for emitting three kinds (R, G, B) of light in one step, film forming accuracy is poor, it is difficult to control the method and therefore, uniformity is not achieved and the constitution is liable to disperse. In contrast thereto, according to the invention, a film comprising a high molecular species material is formed over an entire face of a lower electrode connected to a thin film transistor by a coating method and thereafter, the film comprising the high molecular species material is etched by etching by plasma to thereby enable to selectively form a high molecular species material layer. Further, the organic compound layer is constituted by a material for carrying out luminescence of white color or luminescence of single color and combined with a color changing layer or a coloring layer to thereby realize full color formation.

In lower structures for vehicle front pillars, there are paired right and left side sills arranged in lower portions on both sides of a vehicle, respectively; an outer portion, in a vehicle width direction, of each side sill is formed of an outer reinforcement for a side sill; a inner panel for the side sill is arranged on an inner side, in the vehicle width direction, of each side sill; the front pillars are formed so as to stand on front ends of the side sills, respectively; outer panels for side bodies cover outer reinforcements for the respective front pillars and parts of the respective side sills; each outer reinforcement for side sill is segmented, in the vehicle front and rear direction, into three parts, that is to say, first to third components positioning sequentially from a front of the vehicle; strengths of the first to third components are set to be higher sequentially in this order; and the first, second, and third components are joined and integrated together.

A board mounting type connector includes: a housing being made of a resin, the housing holding a plurality of terminals, each terminal being arranged in parallel and connected to a circuit board; and a metal fastening member being fixed to both ends of the housing in a widthwise direction of the housing in which the terminals are arranged, the metal fastening member being mounted to the circuit board, and each metal fastening member having an engaging portion which engages with a housing of a counterpart connector fitted into the board mounting type connector so that the connectors are engageable to each other in a fitted state.