The present application discloses a circuit substrate, which is suitable for setting circuit elements. The two sides of the thickness of the circuit substrate are respectively the first side and the second side. A first blind hole, the circuit substrate includes n wiring layers, the n wiring layers are stacked, and an insulating layer is provided between two adjacent wiring layers to separate the wiring layers on adjacent sides, Along the direction from the first side to the second side, the first layer of the multi-layer wiring layer is the first wiring layer, the last layer of the multi-layer wiring layer is the nth wiring layer, and the first blind hole penetrates at least the first wiring layer. A wiring layer, which penetrates to the (1+m)th wiring layer, and the circuit element installed in the first blind hole is connected to the (1+m)th wiring layer, wherein, m is a positive integer, and n is greater than 1 positive integer, and m<n. According to the circuit substrate of the present application, the structure is simple, which is conducive to reducing the thickness of the circuit board and realizing the thinning design of the circuit board.