Mainboard cooling structure for cellphone, and cellphone

Abstract

The invention discloses a mainboard cooling structure for a cellphone, and the cellphone, and relates to the technical field of electronic product cooling. The structure comprises a graphite flake, a mainboard, a chip, and a shielding support fixed on the mainboard. The graphite flake comprises a graphite base body and a double-faced adhesive layer. The chip is disposed on the mainboard, and is located in an internal cavity formed by the mainboard and the shielding support. The graphite flake also comprises an electromagnetic shielding layer, and the electromagnetic shielding layer is disposed between the graphite base body and the double-faced adhesive layer. A side surface of the double-faced adhesive layer is attached to the surfaces of the chip and the shielding support. The invention also discloses the cellphone with the above structure. According to the invention, the graphite flake with a function of electromagnetic shielding is directly pasted on the surfaces of the shielding support and the chip, thereby achieving the thin design of the cellphone mainboard, reducing the thermal resistance between the graphite flake and the chip, improving the cooling effect of the cellphone mainboard, prolonging the service life of the cellphone, and reducing the production cost of the cellphone.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation structure for a mainboard of a mobile phone and a mobile phone with the heat dissipation structure for the mainboard of the mobile phone. Background technique [0002] As electronic products such as mobile phones gradually turn to the development trend of thinner and lighter, the power consumption of chips is increasing, and the heat dissipation problem of electronic products is becoming more and more prominent. In order to improve the heat dissipation of electronic products, graphite sheets are widely used in the design of electronic products. [0003] The existing heat dissipation structure of the mobile phone motherboard is as follows: figure 1 As shown, specifically, the graphite sheet includes a graphite substrate 7' and a double-sided adhesive layer 6', the main board 1' is provided with a chip 2', and the shielding part i...

AI Technical Summary

Problems solved by technology

[0004] However, the heat dissipation structure of the mobile phone motherboard is not conducive to the thin design of electronic products, and the assembly process involves the bonding of the graphite sheet and the shielding cover 5ˊ, which cannot guarantee a good fit between the graphite sheet and the chip 2ˊ, which affects the heat dissipation of the mobile phone motherboard Effect, shortening the service life of the mobile phone motherboard

[0005] Based on the above, there is an urgent need for a new heat dissipation structure for mobile phone motherboards to solve the existing problems in the existing heat dissipation structure of mobile phone motherboards, which are not conducive to the thin design of mobile phones. Poor effect, short service life, etc.

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