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A heat conduction device and terminal equipment

A technology for terminal equipment and thermal interface materials, which is applied in lighting and heating equipment, structural components of electrical equipment, and decoration through conduction and heat transfer, and can solve problems such as affecting heat dissipation and excessive temperature rise of mobile phones.

Active Publication Date: 2020-12-22
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As mobile phones become more and more intelligent, their main frequency upgrades will generate more heat. Excessive heat will cause the temperature rise of the mobile phone to be too high, which will affect the heat dissipation.

Method used

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  • A heat conduction device and terminal equipment
  • A heat conduction device and terminal equipment
  • A heat conduction device and terminal equipment

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Embodiment Construction

[0062] In order to facilitate the understanding of the heat conduction device provided in the embodiment of the present application, the application scenarios of the heat conduction device provided in the embodiment of the present application will be described first below. The heat conduction device can be installed in terminal devices such as mobile phones, tablet computers, and PDAs , and dissipate the heat generated by heating elements such as chips in the terminal equipment in the terminal equipment. Wherein, the heating element includes but not limited to central processing unit (central processing unit, CPU), artificial intelligence (artificial intelligence, AI) processor, system on chip (system on chip, SoC), power management unit, or other devices that need heat dissipation . The specific arrangement of the heat conduction device in the terminal device will be described in detail below in conjunction with the accompanying drawings, so as to understand the process of th...

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Abstract

The application provides a heat conduction device and a terminal device. Involved in the field of heat dissipation. The heat conduction device includes a first cover plate and a second cover plate, the first cover plate and the second cover plate are sealed and connected, wherein: the first cover plate is provided with a plurality of grooves, and a support is formed between two adjacent grooves part; the groove is formed with a liquid flow channel and a gas flow channel, the liquid flow channel is filled with a liquid working medium, the liquid flow channel is connected with the gas flow channel, the liquid working medium evaporates into a gas and enters the gas flow channel, and the gas condenses into a liquid into the fluid flow channel. When the heat conduction device is applied to terminal equipment, the first cover plate and the heating element of the terminal equipment can be placed close to each other, so that the heating element can be controlled by the vapor-liquid circulation of the liquid working medium in the liquid circulation channel and the gas circulation channel. Heat dissipation.

Description

technical field [0001] The present application relates to the technical field of heat dissipation equipment, in particular to a heat conduction device and terminal equipment. Background technique [0002] As mobile phones become more and more intelligent, their main frequency upgrades will generate more heat. Excessive heat will cause the temperature rise of the mobile phone to be too high, which will affect the heat dissipation. In order to solve the heat dissipation problem of the mobile phone, a vapor chamber (VC) is usually provided in the mobile phone. [0003] Vapor chamber is a vacuum cavity with fine structure inside and injected with working fluid. At present, the commonly used material is copper, and the working medium is pure water. The working principle of VC includes four steps: conduction, evaporation, convection, and solidification. The heat generated by the heat source enters the plate through heat conduction. , when the steam in the plate diffuses from th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/2039F28D15/0233F28D15/046F28D2021/0029H05K5/0017H05K7/2099
Inventor 孙永富施健杨杰靳林芳孙振
Owner HUAWEI TECH CO LTD
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