Shielding piece and electronic equipment

Abstract

The invention provides a shielding piece and electronic equipment. Relates to the technical field of electronic equipment. The shielding member comprises a conductive metal film and an adhesive. Wherein the conductive metal film comprises a base body and conductive protrusions, the base body and the conductive protrusions are of an integrally-formed structure, and the conductive protrusions are arranged on at least one surface of the base body. The adhesive is arranged between every two adjacent conductive protrusions, the shielding part can be bonded to the structural part through the adhesive, and when the adhesive is bonded to the structural part, the conductive protrusions make contact with the structural part to conduct electricity, so that the shielding effect on the structural part is achieved. In addition, the base body and the conductive protrusions of the shielding piece are of an integrally-formed structure, impedance of the shielding piece can be reduced, and therefore the shielding effect of the shielding piece is improved.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a shield and electronic equipment. Background technique [0002] As the functions of mobile phones and other electronic devices become more and more abundant, the frequency bands covered by antennas of mobile phones and other electronic devices continue to increase, and there are more and more demands for electrical connection schemes inside mobile phones and other electronic devices to achieve grounding. At present, conductive adhesive copper foil is usually used in electronic equipment such as mobile phones to ground the electronic equipment to remove clutter signals, thereby achieving the effect of shielding clutter. [0003] Traditional conductive adhesive copper foil usually includes copper foil and conductive adhesive coated on one or both sides of the copper foil, and the conductive adhesive is filled with conductive fillers. According to the conduc...

AI Technical Summary

Problems solved by technology

In addition, during high-frequency conduction, there is a contact nonlinearity between the conductive filler and the conductive filler, and between the conductive filler and the copper foil to introduce the problem of passive internal modulation (PIM), thereby generating clutter and affecting the communication signal. Radiated spurious emission (RSE) regulatory testing affecting terminal equipment

In order to reduce the contact nonlinear problem of copper foil, it is necessary to optimize and reduce the contact ratio and contact path of the conductive filler inside the conductive adhesive layer, but this method will lead to an increase in the impedance of the conductive adhesive copper foil

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