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Thinning headphone socket and mobile terminal

A technology for earphone sockets and mobile terminals, applied in electrical components, coupling devices, circuits, etc., can solve the problems of excessive thickness of mobile terminals and large thickness of earphone sockets, achieve small thickness, realize thin design, and meet the effect of thinning

Active Publication Date: 2013-09-25
威海爱来福半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a thinned earphone socket and a mobile terminal, which can solve the technical problems that the mobile terminal is too thick and the thickness of the earphone socket of the mobile terminal is large in the prior art

Method used

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  • Thinning headphone socket and mobile terminal
  • Thinning headphone socket and mobile terminal
  • Thinning headphone socket and mobile terminal

Examples

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Embodiment Construction

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0023] see figure 2 and image 3 , figure 2 It is the front view of the thinned earphone socket of the present invention, image 3 A top view of the thinned earphone jack of the present invention.

[0024] Such as figure 2 As shown: the thinned earphone jack 20 of this embodiment includes a main body 21 and an earphone jack 22 , and the earphone jack 22 is pierced through the main body 21 . The thinned earphone jack...

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Abstract

The invention provides a thinning headphone socket which comprises a body portion and a headset jack. The body portion is provided with a disconnected area and can reduce a space occupying a mobile terminal in thickness. In addition, the invention further provides the mobile terminal using the thinning headphone socket. The thinning headphone socket is small in thickness, and meets the requirements for thinning of the mobile terminal.

Description

technical field [0001] The invention relates to the technical field of mobile communication equipment, in particular to a thinned earphone jack and a mobile terminal using the thinned earphone jack. Background technique [0002] Now, mobile terminal products such as mobile phones are becoming more and more popular. For the convenience of carrying, mobile terminal products with small size, thinner, light weight, novel and beautiful appearance are more popular among users. [0003] Using earphones to talk and listen to music is an indispensable function of the mobile terminal, and an earphone socket adapted to earphones is a necessary structure of the mobile terminal. figure 1 It is a view of the structural part of the earphone inserted into the earphone jack of the prior art. Such as figure 1 As shown, the earphone 11 is an earphone style commonly used in the market, and the earphone 11 is inserted into the earphone socket 10 of the mobile terminal. The earphone socket 10 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/502
Inventor 陈建全魏金平李百科
Owner 威海爱来福半导体科技有限公司
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