50results about How to "Raise the sensory value" patented technology

The invention discloses a method for preparing low-loss powder for integrally formed inductors. The mixed powder material is mixed with the first powder material, the second powder material and the third powder material. The first powder material is carbonyl iron powder , D50 is 6-7um, mass percentage 20-40%, the second powder is carbonyl iron powder, D50 is 3-4um, mass percentage is 30-40%, the third powder is iron silicon powder or amorphous powder, D50 10 ~ 15um, mass percentage 30 ~ 40%; after phosphating the mixed powder, add the glue solution into the phosphating mixed powder, stir evenly to form a slurry, dry it after granulation, and dry it at 90 ~ Bake at 120°C for 1 to 2 hours, after natural cooling, add zinc stearate at 0.2 to 0.5% of the mass of the mixed powder, stir well and sieve, take 40 to 300 mesh particles, and obtain the integrated molded inductor. Low-loss powder: the powder prepared by the present invention is a high-sensitivity, low-loss powder, and the integrally formed inductance processed by using the powder has low loss and high efficiency.

The invention discloses a power inductance element formed by molding. The power inductance element comprises a prefabricated magnetic core, a coil and a magnetic plastic package layer, wherein the coil is placed on the prefabricated magnetic core; the magnetic plastic package layer is formed by molding and is used for covering the magnetic core and the coil; and an electrode connected with the coil is exposed. The invention also discloses a method for manufacturing the power inductance element formed by molding. The method comprises the following steps of: a, prefabricating the magnetic core and placing the coil on the prefabricated core; and b, covering the magnetic plastic package layer on the magnetic core and the coil by virtue of molding and exposing the electrode connected with the coil. The power inductance product has the advantages of thinning, miniaturization and high reliability.

The invention discloses a laminated sheet type filter and a preparation method thereof, belonging to the technical field of electron component. The filter is formed by compounding a laminated sheet type capacitance and a laminated sheet type magnetic core inductance, wherein the laminated sheet type capacitance is laminated and sintered by multiple layers of ferrite diaphragms of which the surface is printed with conductor wires, composite medium material is arranged between the terminal electrode contained by the laminated sheet type capacitance and a ground electrode, and the composite medium material comprises ferrite material and columnar ceramic arrays distributed in the ferrite material. The preparation method comprises the following steps: burdening, casting, pulping, forming arrays / interconnecting holes, filling ceramics / conductor paste, printing conduction band, laminating, equalizing pressure of hot water, cutting, burning, blocking and the like. The invention increases the equivalent dielectric constant in common ferrite structure by adding the columnar ceramic array structure in the capacitance part of the laminated sheet type filter, improves Q value and capacity and effectively lowers the off frequency of the filter and improves the out of band rejection characteristic of the filter.

The present invention provides an inductor. The inductor comprises a core substrate; a wire periodically reciprocally laid on the chip substrate by taking a straight line on the chip substrate as an axle wire, wherein the two ends of the wire are respectively provided with leading-out terminals. The technical problems are solved that an inductor uses many magnetic materials for loading, a large induction value cannot be achieved in the broadband application, the core volume is large and the magnetic loss is large in the prior art. The inductor can use few magnetic materials to reduce the high-frequency magnetic loss, can optimize the high-frequency performance, can greatly reduce the inductor size through adoption of a special coiling method, is convenient to integrate, achieves broadbandinduction on the chip and can be suitable for large-scale production.

The invention discloses a cylindrical inductor and a manufacturing method thereof. The cylindrical inductor includes: an enameled wire wound into a hollow cylindrical structure, and the enameled wire has two lead ends after winding; therefore, the cylindrical inductor can be independent of Because of the support of the magnetic core, the amount of magnetic material used can be reduced. In addition, the hollow cylindrical structure of the enameled wire is filled with special soft magnetic materials; the cured resin is arranged on the surface of the enameled wire and used to fix the enameled wire. Since the soft magnetic material filled inside the enameled wire has the characteristics of small magnetic flux and low loss, it can improve the inductance of the columnar inductance, and can be used in the bandwidth of 200KHz~40GHz to realize the application of uF class inductance and expand the application range of inductance. technical effect.

The present invention provides a differential inductor, at least comprising: a first port, a second port and a bottom coil; the inner and outer metal coils of the bottom coil are connected in a crossing manner through a number of first oblique connecting pieces; the bottom coil A top layer metal coil is formed directly above the outermost metal coil of the coil; the top layer metal coil is connected in parallel with the bottom layer coil through the first port, the second port, and several contacts; the top layer metal coil Only the outermost metal coil is stacked between the coil and the bottom coil and shares all the metal coils in the bottom coil except the outermost metal coil. In the inductor of the present invention, the top-layer coil and the bottom-layer coil are connected in parallel and only the outermost metal coil is stacked, which reduces the coupling capacitance; at the same time, the thickness of the connection is increased, which improves the power-carrying capacity of the coil and reduces loss; the two work together to achieve overall Boost the inductor Q by more than 15%.

A manufacturing method and structure of a miniaturized three-dimensional inductor with a magnetic core, comprising the following steps: 1) making at least one microgroove structure on a magnetic substrate; 2) making a plurality of through holes on a hidden frame substrate, and Fill the metal material in the through hole; 3) Cut the hidden frame substrate to form a number of hidden frames with metal materials, and embed the hidden frame in the micro-groove structure and fix it; 4) On the front and back of the magnetic substrate The first planar interconnection structure and the second planar interconnection structure are manufactured respectively, and the first planar interconnection structure and the second planar interconnection structure are respectively electrically connected with the metal material of the recessive frame to form at least one inductance winding. The invention realizes a miniaturized inductance device with high capacity.

The invention provides an inductance structure used in printed circuit board embedding technology and its manufacturing method, which belongs to the technical field of printed circuit integrated components. The invention improves the structure of the magnetic core and the winding method of the coil to improve the inductance value and the stability of the inductance during use; the inductance structure provided by the invention can reduce the occupied area of ​​the copper coil on the PCB substrate, improve the miniaturization of the size of the inductance element, and make the inductance structure small in size and high in performance; the present invention mainly The inductance structure used in the embedded inductance technology of printed circuit boards is formed by using graphic transfer technology, interlayer through holes, window opening treatment, electroplating and chemical plating, and hot-pressed layering. The manufacturing method is simple and highly controllable. Compatible with the process of the existing printed circuit board technology, it is beneficial to improve the integration degree of printed circuit components.

The invention relates to an antenna structure for a communication module and a fabrication method thereof. The antenna structure comprises a first magnetic substance layer, a second magnetic substance layer, a third magnetic substance layer, a fourth magnetic substance layer, a fifth magnetic substance layer, a sixth magnetic substance layer and a seventh magnetic substance layer which are sequentially arranged, wherein the third magnetic substance layer, the fourth magnetic substance layer and the fifth magnetic substance layer are internally provided a coil-shaped conductor pattern so as to form a magnetic core structure; the first magnetic substance layer is provided with a plurality of bonding pad electrodes, the seventh magnetic substance layer is provided with a plurality of second bonding pad electrodes, the first bonding pad electrodes comprise a first feed-in bonding pad electrode, a second feed-in bonding pad electrode and a plurality of dummy bonding pad electrodes; the third magnetic substance layer, the fourth magnetic substance layer and the fifth magnetic substance layer all have first magnetic permeability, the first magnetic substance layer, the second magnetic substance layer, the sixth magnetic substance layer and the seventh magnetic substance layer all have second magnetic permeability, and the first magnetic permeability is greater than or equal to the second magnetic permeability. The antenna structure adopts materials with high magnetic permeability in the magnetic substance layers containing the magnetic core structure, so that an inductance value of a small-size antenna can be improved.