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Inductor, inductor package, conversion circuit and processing method

A technology of inductors and packaging layers, applied in the field of computers, can solve problems such as small inductance value, and achieve the effect of improving inductance value and realizing effective layout.

Pending Publication Date: 2022-06-21
平头哥上海半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inductance value of single-layer wiring combined with multi-phase inductance in the prior art is relatively small

Method used

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  • Inductor, inductor package, conversion circuit and processing method
  • Inductor, inductor package, conversion circuit and processing method
  • Inductor, inductor package, conversion circuit and processing method

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Embodiment Construction

[0033] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and detailedly described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the embodiments of the present invention shall fall within the protection scope of the embodiments of the present invention.

[0034] The specific implementation of the embodiments of the present invention will be further described below in conjunction with the accompanying drawings of the embodiments of the present invention.

[0035] Figure 1A is a schematic side view of an inductor according to various embodiments of the inventio...

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Abstract

The embodiment of the invention provides an inductor, an inductor package, a conversion circuit and a processing method. The inductor comprises a first wiring layer provided with at least one section of first wiring; the second wiring layer is provided with at least one section of second wiring; the substrate is arranged between the first wiring layer and the second wiring layer; a first connection end and a second connection end; wherein the at least one section of first wire and the at least one section of second wire penetrate through the substrate and are connected in series to form a winding wire, and the winding wire is arranged between the first connecting end and the second connecting end. In the scheme of the embodiment of the invention, the at least one section of the first wire and the at least one section of the second wire are positioned on different wire layers, so that effective arrangement of the winding wire formed by penetrating through the substrate in series is realized, and the inductance value of the inductor is improved.

Description

technical field [0001] The embodiments of the present invention relate to the field of computer technology, and in particular to an inductor, an inductor package, a conversion circuit and a processing method. Background technique [0002] With the development of integrated circuit technology, the operating voltage of the chip is getting lower and lower, and the power consumption is getting higher and higher. Therefore, higher requirements are put forward for the performance and integration of the power supply system. [0003] The structure and properties of inductors play an important role in the design of integrated circuits. However, the inductance value of single-layer wiring combined with multi-phase inductance in the prior art is relatively small. Contents of the invention [0004] In view of this, embodiments of the present invention provide an inductor, an inductor package, a conversion circuit, and a processing method to at least partially solve the above problems...

Claims

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Application Information

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IPC IPC(8): H01L23/64H01L21/50H02M1/00
CPCH01L23/645H01L21/50H02M1/00
Inventor 张伟范文锴胡勇倪芸
Owner 平头哥上海半导体技术有限公司
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