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Differential inductor

A differential inductor and coil technology, applied in the field of differential inductors, can solve the problem of low quality factor Q value of differential inductors, and achieve the effects of increasing thickness, reducing connection resistance and improving Q value.

Active Publication Date: 2015-07-29
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a differential inductor for solving the problem of low quality factor Q of differential inductors in the prior art

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Embodiment Construction

[0038] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0039] see Figure 4 to Figure 7 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides a differential inductor which at least comprises a first port, a second port and a bottom coil. Inner and outer metal coils of the bottom coil are in cross connection through a plurality of first diagonal connectors. A top metal coil is formed right above the outmost metal coil of the bottom coil. The top metal coil is connected in parallel with the bottom coil through the first port, the second port and a plurality of contacts. Only the outmost metal layers of the top metal coil and the bottom coil are stacked, and the top metal coil and the bottom coil share all the metal coils of the bottom coil except the outmost metal coil. According to the inductor of the invention, the top metal coil and the bottom coil are connected in parallel, and only the outmost metal layers are stacked, so that the coupling capacitance is reduced; the thickness of the joint is increased, the energizing capability of the coils is improved, and the loss is reduced; and the Q value of the inductor can be integrally improved by more than 15% through joint action of the top metal coil and the bottom coil.

Description

technical field [0001] The invention belongs to the field of semiconductors and relates to a differential inductor. Background technique [0002] At present, a large number of passive devices are included in integrated circuits, among which on-chip inductors are a very important one, and on-chip inductors are one of the important components of radio frequency CMOS / BiCMOS integrated circuits. In typical wireless products, inductive components have a significant impact on the overall RF performance. Therefore, the design and analysis of these inductive components have also been extensively studied. As the core component of the RF circuit, the inductor can usually affect the overall performance of the entire circuit. At present, on-chip inductors with high quality factors are widely used in RF circuit modules such as voltage-controlled oscillators and low-noise amplifiers. The Q value of the inductance quality factor is the main parameter to measure the inductance device, wh...

Claims

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Application Information

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IPC IPC(8): H01L23/522H01F17/00H01F27/28
Inventor 刘凌程仁豪王西宁
Owner SEMICON MFG INT (SHANGHAI) CORP
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