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Communication module

A module and ceramic body technology, applied in the direction of antenna support/installation device, etc., can solve the problems of large area and occupation, and achieve the effect of reduced size and high inductance value

Inactive Publication Date: 2016-12-07
INPAQ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the near-field communication antenna and the integrated circuit chip of the known communication module are arranged separately, and therefore occupy a considerable area

Method used

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Embodiment Construction

[0051] The following is a specific example to illustrate the implementation of the "communication module" disclosed in the present invention. The following implementation will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the present invention. technology category.

[0052] figure 1 It shows a three-dimensional exploded schematic diagram of a communication module according to an embodiment of the present invention, figure 2 A three-dimensional exploded schematic diagram showing another perspective of the communication module according to an embodiment of the present invention. In more detail, figure 1 The angle of view shows the upper surface of each layer of the communication module of this embodiment and the units located on the upper surface, figure 2 The angle of view of the present embodiment shows the lower surface of each layer of the communication module and the units located ...

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Abstract

An embodiment of the invention discloses a communication module. The communication module comprises a magnetic core structure, and a first ceramic body layer and a second ceramic body layer which are arranged on the opposite two sides of the magnetic core structure, and at least one integrated circuit chip, wherein the magnetic core structure comprises a coil conductor pattern; the first ceramic body layer comprises multiple first welding pad electrodes; the second ceramic body layer comprises multiple second welding pad electrodes; each first welding pad electrode comprises a first feeding welding pad electrode, a second feeding welding pad electrode and multiple dummy welding pad electrodes; the first feeding welding pad electrode and the second feeding welding pad electrode are electrically connected with the coil conductor pattern of the magnetic core structure; and the integrated circuit chip is arranged on the second ceramic body layer, wherein the integrated circuit chip comprises at least one jointing pad which is jointed with a part of the second welding pad electrodes. By adoption of the technical scheme provided by the embodiment of the communication module, the dimension of the communication module can be greatly reduced; and the communication module can be widely applied to wearable products.

Description

technical field [0001] The present invention relates to a communication module, and in particular to a sensing system for wireless communication. Background technique [0002] Mobile phones or any type of mobile communication devices have become the equipment that modern people carry with them. In the past, the main functions of mobile communication devices were limited to functions known to the general public such as making calls, sending short messages, or surfing the Internet wirelessly. However, with the advancement of technology, and due to the portable nature of mobile phones, the industry has begun to conceive of integrating some functions that meet the needs of daily life into mobile phones, such as contactless smart cards. The so-called non-contact smart card is to enable the chip installed in the card to function through the proximity sensing method. At present, there are many occasions where contactless smart cards are used in daily life, such as contactless cre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/24
Inventor 郑智宇宇恩佐郑志宏苏志铭
Owner INPAQ TECH
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