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Molding power inductance element and manufacturing method thereof

A technology of power inductor and manufacturing method, applied in electrical components, transformer/inductor parts, inductor/transformer/magnet manufacturing, etc., can solve problems such as lack of molding pressure, and achieve miniaturized inductor design and high space utilization. , the effect of less leakage flux

Active Publication Date: 2020-08-07
SHENZHEN SUNLORD AUTOMOTIVE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, there is a lack of an integrated molded inductor with low molding pressure and simple process.

Method used

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  • Molding power inductance element and manufacturing method thereof
  • Molding power inductance element and manufacturing method thereof
  • Molding power inductance element and manufacturing method thereof

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Embodiment Construction

[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by the embodiments of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0032] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the connection can be used for both fixing function and circuit communication function.

[0033] It is to be understood that the terms "length", "width", "top", "bottom", "front"...

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Abstract

The invention provides a plastic molding power inductance element and a manufacturing method thereof. The plastic molding power inductance element comprises a conductor, a magnetic core and a magneticplastic packaging layer, wherein the conductor comprises a base part subjected to insulation treatment, a side edge enclosing part subjected to insulation treatment and an electrode part which are integrally formed, the base part and the side edge enclosing part are assembled together with the magnetic core in a gapless fit manner, and the magnetic plastic packaging layer wraps the conductor andthe magnetic core in a gapless manner. According to the invention, the method is used for manufacturing the plastic molding power inductance element; the plastic packaging layer completely wraps the prefabricated magnetic core and the part, except the electrodes, of the conductor and is of an integrally-formed structure, so that leakage flux is small; and when the equivalent magnetic conductivityreaches more than 60, the equivalent saturation magnetic flux density can reach more than 0.55 T, the space utilization rate is high, and the design of a miniaturized inductor is facilitated.

Description

technical field [0001] The invention relates to the technical field of plastic molding, in particular to a plastic molding power inductive element and a manufacturing method. Background technique [0002] The one-piece inductors in electronic components are in short supply in automotive electronics, artificial intelligence, 5G and other fields due to their ultra-thin body, superior high-current characteristics, and ultra-high stability. In the production process of traditional powder integrated molding inductors, the coil spot welding technology is mainly used, which may cause false welding and missing welding. In addition, in the molding process, the coil and solder joints are pressed by cold pressing or hot pressing, and the pressure is as high as Above 900MPa, solder joints, coil film, and insulating layer of magnetic powder are easily damaged, and open circuits and short circuits are prone to occur. [0003] In the high-reliability molding process in the prior art, the ...

Claims

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Application Information

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IPC IPC(8): H01F17/04H01F27/255H01F27/26H01F27/28H01F27/29H01F27/30H01F27/34H01F41/00H01F41/02
CPCH01F17/04H01F27/255H01F27/263H01F27/2847H01F27/292H01F27/306H01F27/346H01F41/00H01F41/0246H01F2017/048
Inventor 王莹莹余鑫树夏胜程李有云
Owner SHENZHEN SUNLORD AUTOMOTIVE ELECTRONICS CO LTD
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