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Inductor structure used for printed circuit board embedding technology and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied to directions containing printed inductance and printed electrical components, which can solve problems such as instability and low inductance, and achieve increased inductance, reduced occupied area, and improved miniature degree of effect

Active Publication Date: 2017-01-11
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the technical problem of low and unstable inductance value existing in the existing embedded magnetic core inductance structure, the present invention provides an inductance structure for printed circuit board PCB embedding technology and a manufacturing method thereof

Method used

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  • Inductor structure used for printed circuit board embedding technology and manufacturing method thereof
  • Inductor structure used for printed circuit board embedding technology and manufacturing method thereof
  • Inductor structure used for printed circuit board embedding technology and manufacturing method thereof

Examples

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Effect test

Embodiment 1

[0044] An inductance structure used in printed circuit board embedding technology, including a first conductive coil 101 and a second conductive coil 102 respectively etched on the top and bottom surfaces of a double-sided copper-clad substrate and a magnetic core located in the two wire coils 7. The inner ends of the first conductive coil 101 coincide with the inner ends of the two conductive coils in the vertical projection formed by the plane where the second conductive coil 102 is located, and the inner ends of the first conductive coil 101 and the inner ends of the second conductive coil 102 A first pad 201 and a second pad 202 are respectively provided, and the first conductive coil 101 and the second conductive coil 102 are arranged between the first pad 201 and the second pad 202 The via hole 301 is connected, and the inner wall of the via hole 301 is coated with a uniform metal layer such as ( image 3 As shown), the non-copper-clad region 1 601 and the non-copper-cla...

Embodiment 2

[0050] A method for manufacturing an inductance structure used in printed circuit board embedding technology, characterized in that it comprises the following steps:

[0051] Step A: After pattern transfer is performed on the top and bottom surfaces of the double-sided copper-clad substrate, the first conductive coil 101 and the second conductive coil 102 are obtained by etching, wherein: the first conductive coil 101 is formed on the plane where the second conductive coil 102 is located In the vertical projection of , the inner ends of the two conductive coils overlap and the single-turn coil in one conductive coil and the single-turn coil in the other conductive coil are arranged alternately from inside to outside to form a tight winding structure;

[0052] Step B: using a numerical control drilling machine to drill a via hole for communication between the first conductive coil 101 and the second conductive coil 102 prepared in step A, and then metallize the inner wall of the...

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Abstract

The invention provides an inductor structure used for a printed circuit board embedding technology, and belongs to the technical field of printed circuit integrated elements. According to the structure and the method, the inductance and the stability of the inductor in a usage process are increased through improvement of structures of magnetic cores and the surrounding mode of coils; according to the inductor structure, the occupied area of the copper coils on a PCB substrate can be reduced, the dimension micromation degree of inductor elements is improved, and the prepared inductor is advantaged by small size and high performance; and the inductor structure used for the printed circuit board embedding inductance technology is mainly formed by employing processes such as the pattern transfer technology, interlayer hole penetration, windowing processing, electroplating and electroless plating, and hot pressing layering etc., the manufacturing method is simple, the controllability is high, the inductor structure is compatible with the conventional process of the printed circuit board technology, and the integration degree of the elements of the printed circuit can be improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit integrated components, in particular to an inductance structure used in printed circuit board embedding technology and a manufacturing method thereof. Background technique [0002] The development trend of miniaturization and thinning of multi-functional electronic information products requires that printed circuit products equipped with components and realize electrical transmission show a higher degree of integration. internal. In addition to reducing the area occupied by the components on the board and reducing the three-dimensional size of electronic information products, the printed circuit board with integrated components can realize the minimum distance transmission of electrical signals because the components are embedded in the printed circuit board. It eliminates the attenuation problem of the printed circuit signal to the greatest extent and improves the integrity of signal tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/16
CPCH05K1/165
Inventor 何雪梅何为陈苑明王守绪周国云王翀申桃
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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