31results about How to "Process does not affect" patented technology

The present invention provides a method of forming a non-planar transistor. First, a substrate is provided, on which an active area and a peripheral area are defined. A plurality of ultra-shallow trench isolations are formed in the active region bonded to the substrate. Portions of each ultra-shallow trench isolation are then removed to expose portions of sidewalls of the substrate. A conductive layer is formed on the active area and the peripheral area on the base, and covers part of the sidewall of the base. The conductive layer is patterned such that the conductive layer forms gates of planar transistors in the peripheral region and at least one gate of non-planar transistors in the active region. Source / drain are formed on both sides of the gate of the non-planar transistor.

The invention relates to a heavy oil recovery device and method, in particular to a device and method for continuously injecting light oil to realize heavy oil cold recovery. The technical solution is: connect the injection double-layer isolation pipe at the lower end of the oil well pump barrel, connect the injection suction splitter at the lower end of the double-layer isolation pipe, and set a suction floating ball in the inner cavity of the injection double-layer isolation pipe, and inject the suction shunt The lower end of the injector is connected to the injection diluter, the lower part of the inner cavity of the injection suction splitter is provided with a multifunctional constant pressure isolation plate, and the upper part of the inner cavity of the packer is equipped with a packer seat seal fixed pressure plate, and a Oil pump plunger. The beneficial effects are: there is no risk of scalding during construction, and because the heavy oil cold recovery process is adopted, the risk of blockage of the oil pipeline due to the temperature drop of the extracted heavy oil in the gathering and transportation is also avoided; the dilution source Continuous injection is possible with light oil, which is more plentiful and less expensive than chemically diluted sources.

The invention relates to a stuffed fried dough twist capable of inhibiting absorption of sucrose and regulating fat metabolism after eating. The stuffed fried dough twist comprises fried dough twist sticks, sesame strips and stuffing, wherein a ratio of a mass of the fried dough twist sticks and the sesame strips to a mass of the stuffing is 9 to (1-8). According to the stuffed fried dough twist disclosed by the invention, L-arabinose of a certain proportion is added into the stuffed fried dough twist, therefore the stuffed fried dough twist can inhibit decomposition of the sucrose and synthesis of fats. As for a manufacturing technique, an organic acid is creatively added to be used as a food processing auxiliary, so that a condition is created for exertion of functions of the L-arabinose, quality of a finished stuffed fried dough twist is improved, a production technique is simplified, and a production cost is reduced. According to the manufacturing method of the stuffed fried dough twist capable of inhibiting absorption of sucrose and regulating fat metabolism after eating disclosed by the invention, characteristics of being sweet, crisp, not getting soft after being kept for a long time, and the like of the stuffed fried dough twist are retained, so that a consuming crowd of the stuffed fried dough twist is increased and a market void is filled.

The invention relates to air, coal and material graded low-nitrogen combustion equipment and process as well as a cement clinker sintering system. The air, coal and material graded low-nitrogen combustion equipment comprises a decomposition furnace, a tertiary air valve, a cyclone barrel, a rotary kiln and an overturning valve, and is characterized by further comprising a high-temperature-resisting air locking spiral conveyor, a Roots blower, an additionally-arranged tertiary air valve and a material distribution valve, wherein the decomposition furnace is provided with a tertiary air inlet and a separated new tertiary air inlet; a tertiary air general pipeline is connected with the tertiary air inlet of the decomposition furnace through the tertiary air valve; a tertiary air branch pipeline is arranged on the tertiary air general pipeline passing through the tertiary air valve; the additionally-arranged tertiary air valve is arranged on the tertiary air branch pipeline; the tertiary air branch pipeline is connected with the separated new tertiary air inlet through the additionally-arranged tertiary air valve; a region between the lower end face of a cone body of the decomposition furnace and the lower edge of the tertiary air inlet is a reduction decomposition region; and a region between the lower edge of the tertiary air inlet and the lower edge of the separated new tertiary air inlet is a reduction inhibition region.

The invention relates to a type 2 diabetic patient edible saccharose included stuffed fried dough twist. The stuffed fried dough twist comprises a fried dough twist flour strip, a sesame strip and stuffing. The mass ratio of the fried dough twist flour strip to the sesame strip is 9: (1-8). L-arabinose of certain proportion is added in the stuffed fried dough twist, so that decomposition of saccharose can be inhibited, a novel stuffed fried dough twist product which contains saccharose and is capable of inhibiting the rising of blood glucose and suitable for being eaten by diabetic patients is produced. As for the production process, lactic acids are added creatively to be used as food processing aids, so that conditions are created for the development of the function of L-arabinose, the stuffed fried dough twist product quality is improved, the production process is simplified, and the production cost is reduced. A production method of the stuffed fried dough twist maintains the characteristics that the stuffed fried dough twist is fragrant and sweet, soft-resistant for long-time storage and the like; the product enjoying people are increased, and the market blank is filled.

An embodiment is a method comprising: forming a first gate over a substrate, the first gate having first gate spacers on opposing sidewalls; forming a first hard mask layer over the first gate ; forming a second hard mask layer over the first hard mask layer, the second hard mask layer having a material composition different from that of the first hard mask layer; forming a first dielectric adjacent to and over the first gate layer; etch a first opening through the first dielectric layer to expose a portion of the substrate, at least a portion of the second hard mask layer is exposed in the first opening; fill the first opening with a conductive material; and remove the second hard mask layer masking layer and removing the conductive material and portions of the first dielectric layer overlying the first hard mask layer to form first conductive contacts in the remaining first dielectric layer. The invention also provides a self-aligned contact scheme, a semiconductor structure and a forming method thereof.

The invention relates to a stuffed twist with a low GI value, that is, a stuffed twist with a low glycemic index, comprising twist noodles, sesame sticks and fillings, the ratio of the quality of the twist noodles to the sesame sticks and the quality of the stuffing is 12: 1‑8.5. The twisted doughnuts of the present invention replace part of the wheat flour with soybean flour with a low GI value, do not add sucrose, and add an appropriate proportion of isomalt and stevia. While avoiding the consumption of sucrose by diabetic patients, it can effectively alleviate the hidden worry of GI value increase due to starch hydrolysis in flour, and has a double insurance effect on the inhibition of blood sugar increase. The preparation method of the stuffed twist with low glycemic index provided by the present invention retains the characteristics of the traditional twist, which is sweet and crisp, and does not stick after a long time. It is suitable for people with diabetes and people who have low GI dietary requirements and pay attention to nutrition and health. The audience of the product is the first in the improvement of domestic sugar alcohol food technology.

The invention relates to a comprehensive electroplating wastewater treatment method. The electroplating wastewater is divided into six brand-new classes, a chemical and biochemical combined process is adopted, a separate system drainage pipe network is adopted, the electroplating wastewater is divided into ink wastewater, complex wastewater, pretreatment wastewater, cyanogen-containing wastewater, chromium-containing wastewater and common electroplating wastewater, the six classes of wastewater respectively flows into respective underground adjusting tank through the pipe network, and is treated by respective process, and the effluent is discharged after reaching a standard. Because of the scientific water separating and stepwise pretreatment of a front-end chemical treatment part, different pollutants are respectively removed in different process sections according to characteristics, crossed enrichment and mutual reaction of the different pollutants are reduced to the greatest extent, and the pressure of microorganisms in the biochemical process is reduced. Treatment facilities for the six classes of wastewater are mutually connected and relatively dependent, and when inlet water quality fluctuates, a corresponding section is only required to be adjusted, the whole process is not influenced, the management is scientific and orderly, and operational risks are reduced.

The invention discloses an implementation method and device of a plugin. The implementation method of the plugin comprises the following step of arranging a plugin engine outside the progress of a main program, wherein the plugin engine is provided with the progress independent from the main program to start the plugin when the main program needs to invoke the plugin. As the progress of the plugin is independent from the main program, the plugin cannot cause any influence on the main program per se when the progress of the plugin collapses due to the quality of the plugin per se.

A method for trimming a hard mask layer provides a substrate, a hard mask layer, and a three-layer stack layer on the substrate. The three-layer stack includes a top photoresist, a silicon-containing layer, and a bottom photoresist. The top photoresist, the silicon-containing layer, the bottom photoresist and the hard mask layer are sequentially patterned, and then a trimming process is performed on the hard mask layer. Since the underlying photoresist of the present invention is thin and is worn out during etching, photoresist line collapse does not occur.

The invention relates to a formation method of a memory device. The method includes the following steps that: a multi-layer overlapped composite layer is formed on the surface of a substrate, the surface of the composite layer is provided with a mask layer, the composite layers include insulating layers and device layers arranged on the surfaces of the insulating layers; a strengthened layer is formed on a part of the side wall surface of the mask layer, and the strengthened layer exposes the top surface and a part of the side wall surface of the mask layer; with the strengthened layer adopted as a mask, the exposed side wall surface of the mask layer is etched, so that a part of the surface of the composite layer at the top is exposed; with the mask layer and the strengthened layer adopted as a mask, the exposed composite layer is etched, the etching thickness of the composite layer is greater than or equal to the thickness of a single device layer; the steps in which the side wall of the mask layer and the composite layer are etched are repeated for once or by a plurality of times until the size of the projection pattern of the plurality of device layers is gradually decreased from the bottom layer to the top layer along at least one direction, so that the plurality of device layers can form a steeped structure which is shrunk gradually from the bottom layer to the top layer. The memory device formed by the method of the invention has the advantages of low space occupancy rate, high bit density and low bit cost.

The invention discloses a drilling device and a drilling method for rotary disc type bearing. The drilling device comprises a base, a base plate and a mounting plate, wherein the base plate is weldedto the top of the base, and a through hole is formed in the middle end of the interior of the base plate; and a first motor is installed at the middle end of the top of the base, a longitudinally-arranged bearing rod is fixedly arranged at the top of the first motor, and the top of the bearing rod penetrates upwards from the interior of the through hole. A longitudinally-arranged first electric telescopic column is arranged on one side of the bottom of the mounting plate, the top of the first electric telescopic column is fixedly connected with a clamping buckle, and one side of the clamping buckle is fixedly connected with the outer bottom end of the bearing rod. A fixing frame is mounted at one end of the bottom of the mounting plate, and three sets of drill bits are uniformly mounted atthe bottom of the fixing frame. The drilling device is convenient and rapid to use, can be processed according to different disc-type bearings, and can adapt to disc-type bearings with different sizes, the drilling disc type bearing is convenient and rapid to mount, high in working efficiency and cleaner and sanitary.

The invention provides a method and a device for controlling processes of abnormal pages. The method comprises the following steps: acquiring a page address list of the abnormal pages, wherein the abnormal pages comprise pages which cause a browser to be broken down and / or jammed; judging whether a page address which a user requests to access is in the page address list; and if yes, creating a page independent subprocess by a browser host process and rendering a page corresponding to the page address which the user requests to access by the page independent subprocess. According to the invention, the normal use of the browser can be protected from influences when the user accesses the high risk page.

An embodiment of the present invention provides a method for processing a process in a container, the method is used on a physical machine, and multiple containers are deployed on the physical machine, and the physical machine includes a watchdog driver, including: the watchdog driver The first operation instruction of the first container is received through the device file dev, the first operation instruction includes a first process identifier PID, and the first PID indicates that the first operation instruction is the first in the first container. issued by the process; according to the first PID, determine the first namespace namespace corresponding to the first container; according to the first namespace, delete all processes in the first container. Therefore, by determining the namespace of the container, the watchdog driver can delete all the processes in a specific container without affecting the processes in other containers, and realize the process processing at the container granularity.

This application relates to an ultra-thin incoming material packaging method and a packaging method. In this packaging method, a single chip is formed in an ultra-thin wafer manufacturing process, and then flipped to a circuit board and covered with the first adhesive tape, and then the carrier board and the bonding board are debonded. An accommodating cavity is formed between the ultra-thin wafer and the first adhesive tape and the circuit board for accommodating a single chip, thereby providing protection for the single chip during transportation. In subsequent use, the carrier board can be taken away from the circuit board while tearing off the first adhesive tape, so that the subsequent process can be performed conveniently. That is to say, the risk of warping or even breaking of ultra-thin incoming materials during the wafer manufacturing process is reduced by bonding the carrier plate. At the same time, the single chip can be protected during transportation, and the subsequent use will not affect other processes. conduct.