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An ultra-thin incoming material packaging method and packaging structure

An ultra-thin, material-encapsulated technology, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of wafer warpage and fracture easily, and achieve the effect of reducing warpage or even fracture

Active Publication Date: 2020-07-21
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides an ultra-thin incoming material packaging method and packaging structure to solve the problem in the prior art that the wafer is prone to warping or even breaking during the manufacturing process

Method used

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  • An ultra-thin incoming material packaging method and packaging structure
  • An ultra-thin incoming material packaging method and packaging structure
  • An ultra-thin incoming material packaging method and packaging structure

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Embodiment Construction

[0069] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0070] See figure 1 , figure 1 It is a schematic flow chart of an ultra-thin incoming material packaging method provided in an embodiment of the present invention, and the ultra-thin incoming material packaging method includes:

[0071] S101: Provide an ultra-thin wafer, the ultra-thin wafer includes a first surface and a second surface opposite to each other, the first surface of the ultra-thin wafer is formed with a plurality of functional areas arranged in...

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Abstract

This application relates to an ultra-thin incoming material packaging method and a packaging method. In this packaging method, a single chip is formed in an ultra-thin wafer manufacturing process, and then flipped to a circuit board and covered with the first adhesive tape, and then the carrier board and the bonding board are debonded. An accommodating cavity is formed between the ultra-thin wafer and the first adhesive tape and the circuit board for accommodating a single chip, thereby providing protection for the single chip during transportation. In subsequent use, the carrier board can be taken away from the circuit board while tearing off the first adhesive tape, so that the subsequent process can be performed conveniently. That is to say, the risk of warping or even breaking of ultra-thin incoming materials during the wafer manufacturing process is reduced by bonding the carrier plate. At the same time, the single chip can be protected during transportation, and the subsequent use will not affect other processes. conduct.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor devices, in particular to an ultra-thin incoming material packaging method and packaging structure. Background technique [0002] As we all know, packaging technology is actually a technology for packaging chips, which is necessary for chips. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, packaged chips are also easier to install and transport. Therefore, packaging technology is a very critical part of the integrated circuit industry. [0003] With the increasing integration of chips, the current mainstream of packaging technology has developed into three-dimensional packaging technology (3DPackage). Among them, the advantage of three-dimensional packaging is that it can increase the density of interconnection lines and reduce the over...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/488H01L21/683
CPCH01L21/6836H01L24/11H01L24/16H01L24/81H01L24/97H01L2224/11002H01L2224/16227H01L2224/16238H01L2224/81005H01L2224/97H01L2224/16225
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP
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