An ultra-thin incoming material packaging method and packaging structure
An ultra-thin, material-encapsulated technology, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of wafer warpage and fracture easily, and achieve the effect of reducing warpage or even fracture
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[0069] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0070] See figure 1 , figure 1 It is a schematic flow chart of an ultra-thin incoming material packaging method provided in an embodiment of the present invention, and the ultra-thin incoming material packaging method includes:
[0071] S101: Provide an ultra-thin wafer, the ultra-thin wafer includes a first surface and a second surface opposite to each other, the first surface of the ultra-thin wafer is formed with a plurality of functional areas arranged in...
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