A liquid
processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a
wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining
pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a
drying-liquid supplying mechanism that supplies an
organic solvent for
drying a
wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the
drying-liquid supplying mechanism to supply an
organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an
organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.