32results about How to "Play a role in adhesion" patented technology

The invention discloses an ultraviolet LED packaging structure comprising a packaging substrate, an LED chip arranged on the upper surface of the packaging substrate and a packaging lens packaged on the LED chip, wherein the upper surface of the packaging substrate is provided with a concave cup for accommodating the LED chip, electric-conducting through holes are arranged at the bottom of the concave cup and are filled with through hole electrodes connected with the LED chip, the number of the through hole electrodes is same as that of the electric-conducting through holes, the wall of the concave cup is further provided with a bonding structure for bonding the packaging lens, and the bonding structure comprises a local heating loop and a hermetic bonding substance covering outside the local heating loop. The LED packaging structure disclosed by the invention realizes hermetic packaging by the bonding structure and is particularly suitable for working under severe environments with high humidity and the like, and the local heating loop is electrified for local heating to prevent damage to the chip due to heating, so that the hermetic reliability of a device is realized. The invention simultaneously provides a wafer-grade packaging method of the ultraviolet LED packaging structure, the wafer-grade manufacturing method has a simple technological process, can be used for effectively increasing the production efficiency of devices and is beneficial to complete cost reduction.

The invention relates to a method for manufacturing a small solder ball, in which a substrate is reusable. The invention is characterized in: firstly, the reusable substrate is prepared by means of ICmanufacture process: a silicon wafer is used as a base, a metal conducting layer is sputtered from the front after heat oxidation treatment; secondly, the small solder ball is manufactured on the reusable substrate: a metal sacrificial layer is sputtered on the substrate to cover the opening of the conducting layer, thick photosensitive resist is coated and an electroplating window is photoetched, then solder is electroplated, the thick photosensitive resist is removed after electroplating, the solder is reflowed to form a solder ball, thereafter the metal sacrificial layer is corroded to beremoved, so that the solder ball can drop off completely from the reusable substrate, and finally the solder ball is collected. According to the invention, the manufacturing procedure is simple and consumes small energy, the process has good controllability, the bottleneck of low productivity is overcome; the manufactured solder ball has smooth surface, good sphericity and uniform size, with the smallest grain diameter being 0.15mm.

The invention relates to an antiskid and anti-seepage fog sealing layer technology which comprises the following steps of: 1, preparing for construction, namely 1) closing, cleaning and sweeping a construction road, 2) preparing materials and debugging equipment, and 3) detecting technical indexes; 2, debugging and spreading fog sealing layer machinery; 3, performing maintenance; 4, performing detection; 5, opening the traffic. The antiskid and anti-seepage fog sealing layer technology is characterized in that the material preparation in the step 1 comprises the following substeps of: a) selecting the following materials, namely 70# or 90# level-A road petroleum asphalt serving as matrix asphalt, a cation emulsifier, latex serving as a modifier, and an alcohol type anti-reflection agent; b) mixing modified emulsified asphalt, namely mixing the matrix asphalt, the emulsifier, water, the anti-reflection agent and the modifier according to the mass proportion of 482 to 18 to 500 to 1.6 to 4.4. According to the antiskid and anti-seepage fog sealing layer technology, severe damages of degranulation, water seepage and the like which are caused by long-time wheel heavy-duty traffic on the old pavement are effectively avoided; a good seepage prevention effect is achieved, and the antiskid effect of the pavement is enhanced at the same time.

The invention provides continuous polycarbosilane fiber spinning oil, and a preparation method and a use method thereof. The spinning oil is prepared from 2 to 9 percent of an ingredient A, 3 to 8 percent of an ingredient B, 1 to 6 percent of an ingredient C and the balance water, wherein the ingredient A is a mixed solution prepared from silicon oil and water according to a mass ratio of 1:(3 to 10); the ingredient B is a water solution of a smooth film forming agent; the ingredient C is a surfactant. The preparation method comprises the following steps that the three ingredients are mixed; operations of heating, stirring, cooling and ultrasonic treatment are performed; a finished product is obtained. The use method comprises the following steps that a spraying mode is used; the spinning oil is sprayed onto the surface of continuous polycarbosilane nascent fiber at the oiling rate being 0.1 to 5.0 percent. The spinning oil has the advantages that the stability is higher; in the continuous polycarbosilane fiber spinning, the effects of anti-static electricity, holding and bundling, fiber bonding prevention, broken end rate reduction and the like are achieved; in non-melting spinning, fiber melting and merging is not discovered; the smooth yarn withdrawal can be realized. The preparation method and the use method provided by the invention have the advantages that the process is simple, and the cost is low.