32results about How to "Play a role in adhesion" patented technology

The invention discloses sulfenyl anode of a lithium-sulfur rechargeable battery and a preparation method thereof. The sulfenyl anode is prepared by the steps of: equally mixing sulfenyl compound active material, cyclodextrin binder and carbon conductivity agent, coating the mixture on an aluminum foil current collector and obtaining the sulfenyl anode after drying and pressing. The coating thickness is 50 to 100 microns and the aluminum foil thickness is 20 to 30 microns; the mass ratio of the sulfenyl compound active material, the cyclodextrin binder and the carbon conductivity agent is 7 to8:0.6 to 1:0.6 to 1.5, wherein the sulfenyl compound active material is formed by the steps of: equally mixing carbon nano tube, sulfur and polyacrylonitrile according to the mass ratio of 0.1 to 0.2:6 to 8:1 and sintering the mixture in protection of inert gas at the temperature of 300 to 320 DEG C for insulation for 6 to 8 hours. By using the lithium-sulfur rechargeable battery with the sulfenylanode and lithium metal cathode, the reversible capacity of the sulfenyl compound active material reaches 680mAh.g<-1> under 0.1C multiplying power charge-discharge condition; and compared with the discharge capacity of second circulation, the discharge capacity after 100 times of circulation decreases less than 10 percent.

The invention discloses an ultraviolet LED packaging structure comprising a packaging substrate, an LED chip arranged on the upper surface of the packaging substrate and a packaging lens packaged on the LED chip, wherein the upper surface of the packaging substrate is provided with a concave cup for accommodating the LED chip, electric-conducting through holes are arranged at the bottom of the concave cup and are filled with through hole electrodes connected with the LED chip, the number of the through hole electrodes is same as that of the electric-conducting through holes, the wall of the concave cup is further provided with a bonding structure for bonding the packaging lens, and the bonding structure comprises a local heating loop and a hermetic bonding substance covering outside the local heating loop. The LED packaging structure disclosed by the invention realizes hermetic packaging by the bonding structure and is particularly suitable for working under severe environments with high humidity and the like, and the local heating loop is electrified for local heating to prevent damage to the chip due to heating, so that the hermetic reliability of a device is realized. The invention simultaneously provides a wafer-grade packaging method of the ultraviolet LED packaging structure, the wafer-grade manufacturing method has a simple technological process, can be used for effectively increasing the production efficiency of devices and is beneficial to complete cost reduction.

The invention firstly aims to provide an LED electrode structure. A first Ni layer, an Al layer, a Cr layer, a second Ni layer and an Au layer are sequentially included from the surface layer of a GaN layer, and through holes are formed in the first Ni layer. The Al layer is designed to be closely next to the first Ni layer and can reflect the light transmitted to a P electrode and an N electrode to the inside of a chip, the reflected light is emitted out from the inside of the chip again, and therefore the external quantum efficiency of an LED chip is improved. Cr can achieve an adhesion effect and also can prevent Al metal atoms from diffusing towards the Ni layer and the Au layer above the electrodes, and the stability of the electrodes is improved. The design of the through holes can reduce the absorption to the light of the first Ni layer, the light-emitting efficiency is maximally improved, and the good contact of the Al layer and the surface of GaN can also be guaranteed. The invention secondarily aims to provide a manufacturing method of the LED electrode structure. The manufacturing method is simple, concise and suitable for mass production. The adhesivity between film layers is very good, and the stability of the entire electrode is good.

The invention relates to a method for manufacturing a small solder ball, in which a substrate is reusable. The invention is characterized in: firstly, the reusable substrate is prepared by means of ICmanufacture process: a silicon wafer is used as a base, a metal conducting layer is sputtered from the front after heat oxidation treatment; secondly, the small solder ball is manufactured on the reusable substrate: a metal sacrificial layer is sputtered on the substrate to cover the opening of the conducting layer, thick photosensitive resist is coated and an electroplating window is photoetched, then solder is electroplated, the thick photosensitive resist is removed after electroplating, the solder is reflowed to form a solder ball, thereafter the metal sacrificial layer is corroded to beremoved, so that the solder ball can drop off completely from the reusable substrate, and finally the solder ball is collected. According to the invention, the manufacturing procedure is simple and consumes small energy, the process has good controllability, the bottleneck of low productivity is overcome; the manufactured solder ball has smooth surface, good sphericity and uniform size, with the smallest grain diameter being 0.15mm.

The invention discloses a super-long ultrathin alloy cutter and a manufacturing method thereof, and belongs to the field of cutting tools and manufacturing processes thereof, aiming at solving the problems of complex processing technology and high cost of an existing super-long ultrathin cutter. The cutter disclosed by the invention comprises a cutter body and a blade, wherein one end of the cutter body is provided with a blade groove; the blade is fixed in the blade groove; and an end diagonal cutter of the blade and an inclined plane on which the cutter body end face is positioned are on the same plane, which can effectively improve the cutting quality. The method disclosed by the invention comprises the steps of blanking, coarse straightening, groove milling, welding, heat treatment, secondary coarse straightening, rough machining, fine grinding, diagonal cutter opening, fine straightening and the like, improves the product quality of the super-long ultrathin alloy cutter, and prolongs the service life.

The invention relates to an antiskid and anti-seepage fog sealing layer technology which comprises the following steps of: 1, preparing for construction, namely 1) closing, cleaning and sweeping a construction road, 2) preparing materials and debugging equipment, and 3) detecting technical indexes; 2, debugging and spreading fog sealing layer machinery; 3, performing maintenance; 4, performing detection; 5, opening the traffic. The antiskid and anti-seepage fog sealing layer technology is characterized in that the material preparation in the step 1 comprises the following substeps of: a) selecting the following materials, namely 70# or 90# level-A road petroleum asphalt serving as matrix asphalt, a cation emulsifier, latex serving as a modifier, and an alcohol type anti-reflection agent; b) mixing modified emulsified asphalt, namely mixing the matrix asphalt, the emulsifier, water, the anti-reflection agent and the modifier according to the mass proportion of 482 to 18 to 500 to 1.6 to 4.4. According to the antiskid and anti-seepage fog sealing layer technology, severe damages of degranulation, water seepage and the like which are caused by long-time wheel heavy-duty traffic on the old pavement are effectively avoided; a good seepage prevention effect is achieved, and the antiskid effect of the pavement is enhanced at the same time.

The invention provides continuous polycarbosilane fiber spinning oil, and a preparation method and a use method thereof. The spinning oil is prepared from 2 to 9 percent of an ingredient A, 3 to 8 percent of an ingredient B, 1 to 6 percent of an ingredient C and the balance water, wherein the ingredient A is a mixed solution prepared from silicon oil and water according to a mass ratio of 1:(3 to 10); the ingredient B is a water solution of a smooth film forming agent; the ingredient C is a surfactant. The preparation method comprises the following steps that the three ingredients are mixed; operations of heating, stirring, cooling and ultrasonic treatment are performed; a finished product is obtained. The use method comprises the following steps that a spraying mode is used; the spinning oil is sprayed onto the surface of continuous polycarbosilane nascent fiber at the oiling rate being 0.1 to 5.0 percent. The spinning oil has the advantages that the stability is higher; in the continuous polycarbosilane fiber spinning, the effects of anti-static electricity, holding and bundling, fiber bonding prevention, broken end rate reduction and the like are achieved; in non-melting spinning, fiber melting and merging is not discovered; the smooth yarn withdrawal can be realized. The preparation method and the use method provided by the invention have the advantages that the process is simple, and the cost is low.