48results about How to "Performance is not compromised" patented technology

A two-dimensional self-RAID method of protecting page-based storage data in a MLC multiple-level-cell flash memory device. The protection scheme includes reserving one parity sector across each data page, reserving one parity page as the column parity, selecting a specific number of pages to form a parity group, writing into the parity page a group parity value for data stored in the pages of the parity group. The parity sector represents applying a RAID technique in a first dimension. The group parity represents applying a RAID technique in a second dimension. Data protection is achieved because a corrupted data sector can likely be recovered by the two dimensional RAID data.

Formation of sidewalls on a gate structure in layers having a differential etch rate for certain etchants allows metallization and salicide formation annealing of a gate electrode and source/drain regions prior to shallow impurity implantation and impurity activation annealing at the location of a removable portion of a sidewall spacer establishing a gap between source/drain regions and remaining sidewalls of a gate structure. Therefore, diffusion of impurities to a greater depth and impurity deactivation during salacide formation annealing is avoided in a high performance semiconductor device such as a field effect transistor of extremely small dimensions.

The invention relates to a modular electric protection unit. The height of the unit is increased comparing with a standard height of the unit, thereby forming an additional volume (20) between a mechanism (19) and a terminal. The additional volume (20) is designed a member with a complementary electrical function. The maximum height U of the additional volume (20) is (((X-Z)/2)/3/4)-V, wherein the Z is a height of a nose (8) of the unit, the V is a height of a housing (38) of the terminal (13), the X is the minimum distance standardized between two rails, these heights are measured parallel to the rear surface of the apparatuses and perpendicularly with the longitudinal direction of rails.

The technology herein relates to an aircraft structure for being moveably mounted externally on an aircraft, the aircraft structure being an aerodynamic structure comprising a structural component providing structural strength and stiffness to the aircraft structure, the structural component comprising an integral fixing for moveably mounting the aerodynamic structure externally to the aircraft, and an integral fixing for attachment to an actuator for actuating movement of the aircraft structure with respect to the aircraft, and an aerodynamic surface component attached to one side of the structural component, the aerodynamic surface component providing an aerodynamic external surface of the aircraft structure. The technology herein also relates to a method of manufacturing the aircraft structure.

A method for producing a chemically prepared magenta toner composition according to one example embodiment includes combining and agglomerating a first polymer emulsion with a magenta colorant dispersion containing a single azo magenta pigment and a release agent dispersion to form toner cores. A borax coupling agent is added to the toner cores. A second polymer emulsion is combined and agglomerated with the toner cores having the borax coupling agent to form toner shells around the toner cores. The aggregated toner cores and toner shells are fused to form magenta toner particles. The single azo magenta pigment in the magenta pigment dispersion does not aggregate into clusters on the outer surface of the surface core.

The invention discloses a light leakage prevention adhesive tape for a narrow-frame backlight module. The adhesive tape comprises a panel edge covering adhesive tape body with an adhesive face and a panel fixing adhesive tape body with two adhesive faces, the panel fixing adhesive tape body is arranged on the adhesive face of the panel edge covering adhesive tape body to divide the adhesive face of the panel edge covering adhesive tape body into two sub-adhesive faces, and the two sub-adhesive faces and the two adhesive faces of the panel fixing adhesive tape body form two bent adhesive faces.The adhesive tape has the advantages that the problems of module line missing and side edge bright line abnormity are solved, and the labor cost is reduced.

The invention discloses an overflow softening agent for a chip molding compound. The main components of the overflow softening agent comprise an alcohol amine organic alkali, an amide and nitrogen methyl pyrrolidone solvent, an alcohol amine ether cellosolve and a glycol ether acetate wax remover. The low-temperature softening and removing agent has a good softening and removing effect on epoxy resin overflowing materials under the low-temperature condition, and meanwhile, can also dissolve Ba wax or polyethylene wax in the overflowing epoxy resin molding compound under the low-temperature condition of 60 DEG C +/-10 DEG C.

The embodiment of the invention discloses a flexible connection cable structure, a preparation method and a brain electrode device, the flexible connection cable structure comprises a sacrificial layer, a first insulating layer arranged on the sacrificial layer and comprising a first to-be-wired area, a first metal layer arranged on the first to-be-wired area and a first connection bonding pad, and the first metal layer and the first connection bonding pad are arranged at an interval. The first insulating layer comprises a first to-be-wired area, the second insulating layer is arranged on the first insulating layer and comprises a second to-be-wired area, the second insulating layer covers the first metal layer and the first connecting bonding pad, the second metal layer and the second connecting bonding pad are arranged in the second to-be-wired area and are arranged at intervals, and the third insulating layer is arranged on the second insulating layer. The third insulating layer covers the second metal layer and the second connecting bonding pad, and the third insulating layer is provided with openings in areas corresponding to the first connecting bonding pad and the second connecting bonding pad. Based on the embodiment of the invention, thousand-magnitude brain electrode signal connection can be realized under the processing capability of the flexible electronic circuit.