70results about How to "Low thermal expansion coefficient" patented technology

The present invention provides a process for preparing an aluminum-titanate-based sintered body comprising the step of firing, at 1250 to 1700° C., a formed product prepared from a raw material mixture containing 100 parts by weight of a mixture of TiO2 and Al2O3 in a weight ratio of TiO2:Al2O3=40:60 to 60:40, and 1 to 15 parts by weight of an alkali feldspar represented by the formula:(NaxK1-x)AlSi3O8 wherein 0<=x<=1. According to the process of the present invention, it is possible to obtain an aluminum-titanate-based sintered body in which inherent properties of an aluminum titanate, i.e., a low coefficient of thermal expansion and high corrosion resistance are maintained, the mechanical strength thereof is improved, and which can be stably used even under high temperature conditions.

Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.

The present invention provides a process for preparing an aluminum-titanate-based sintered body comprising the step of firing, at 1250 to 1700° C., a formed product prepared from a raw material mixture containing 100 parts by weight of a mixture of TiO2 and Al2O3 in a weight ratio of TiO2:Al2O3=40:60 to 60:40, and 1 to 15 parts by weight of an alkali feldspar represented by the formula:(NaxK1-x)AlSi3O8 wherein 0≦x≦1.According to the process of the present invention, it is possible to obtain an aluminum-titanate-based sintered body in which inherent properties of an aluminum titanate, i.e., a low coefficient of thermal expansion and high corrosion resistance are maintained, the mechanical strength thereof is improved, and which can be stably used even under high temperature conditions.

A machine for processing optical work pieces having a work piece spindle for the work piece driving rotationally about a work piece rotation axis. At least one processing unit has a tool that can machine the work piece and an adjusting mechanism causes a relative movement between the work piece spindle and tool to selectively enable loading, unloading and processing of the work piece. The adjusting mechanism has a linear drive unit and a swivel drive unit that are stacked on each other to rotate the swivel drive unit and the work piece spindle about a swivel axis that is perpendicular to the work piece rotation axis, and has the linear drive unit move the work piece spindle along a linear axis that can be perpendicular to one of the swivel axis and the work piece rotation axis and parallel to or aligned with the other axis.

Provided is a non-hydrolytic transparent composite composition having excellent transparency and heat resistance, and a low thermal expansion coefficient. Particularly, the transparent composite composition includes a glass filler dispersed in a crosslinked transparent resin produced by a non-hydrolytic reaction. The non-hydrolytic transparent siloxane resin is a resin having Si—O (siloxane) bonds, a resin having at least one kind of heterometal bonds, including Si—O bonds, or the resin further containing other ingredients. When the transparent siloxane resin produced by a non-hydrolytic reaction forms a composite in combination with the glass filler, the composite realizes high transparency and heat resistance, as well as a low thermal expansion coefficient. Therefore, the transparent composite composition is useful as a substrate for thin film transistor (TFT) devices, display devices and optical devices.

Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.

The present invention provides a metal-graphite composite material favorable to two-dimensional diffusion of heat and having a high thermal conductivity in two axial directions, and a production method therefor. The metal-graphite composite material of the present invention includes: 20 to 80% by volume of a scaly graphite powder; and a matrix selected from the group consisting of copper, aluminum and alloys thereof, wherein the scaly graphite powder in which a normal vector to a scaly surface thereof is tilted at 20° or higher with respect to a normal vector to a readily heat-conducting surface of the metal-graphite composite material is 15% or less relative to a whole amount of the scaly graphite powder, and the metal-graphite composite material has a relative density of 95% or higher.

The invention provides a modified maleimide resin composition, which is prepared from epoxy siloxane-modified maleimide prepolymer, thermosetting resin, and inorganic filler; maleimide compound and aromatic amine compound react in advance, so that maleimide-modified aromatic amine compound is prepared, epoxy siloxane is then added into the maleimide-modified aromatic amine compound to react, and thereby the epoxy siloxane-modified maleimide prepolymer is obtained. The invention further provides a prepreg prepared from the modified maleimide resin composition and a laminate prepared by laminating the prepregs. The modified maleimide resin composition and the prepreg and the laminate prepared therefrom which are provided by the invention have the advantages of low thermal expansibility, highbinding property, high heat resistance, excellent reactivity, low moisture absorption rate and high flame-retardant property, can be applied in the field of IC (integrated circuit) packages, such asCSP (Chip Scale Package), PoP and SIP (System in Package), and have a broad application prospect.

Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g / cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.

A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.

The present invention provides a substrate for flexible displays, a method for producing the same, and a flexible display. The substrate for flexible displays comprises a resin composition layer containing an inorganic layered compound and a resin, wherein the amount of the inorganic layer compound is not less than 10 weight % and not more than 70 weight % based on the total amount of the resin and the inorganic layer compound. The method for producing a substrate for flexible displays comprises applying a mixture of a solvent, an inorganic layer compound, and a resin to a plate, drying the mixture, and peeling off the resulting layer from the plate. The display comprises the above substrate for flexible displays and electrodes.

The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.