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70results about How to "Low thermal expansion coefficient" patented technology
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Glass for anodic bonding
InactiveUS20100029460A1Low thermal expansion coefficientDecorative surface effectsAnodic bondingOxide
Owner:NIPPON SHEET GLASS CO LTD
Method for producing aluminum titanate sintered object
InactiveUS20030015829A1Reduction factorImprove corrosion resistanceCeramic shaping apparatusTitanium compoundsBarium titanateThermal expansion
The present invention provides a process for preparing an aluminum-titanate-based sintered body comprising the step of firing, at 1250 to 1700° C., a formed product prepared from a raw material mixture containing 100 parts by weight of a mixture of TiO2 and Al2O3 in a weight ratio of TiO2:Al2O3=40:60 to 60:40, and 1 to 15 parts by weight of an alkali feldspar represented by the formula:(NaxK1-x)AlSi3O8 wherein 0<=x<=1. According to the process of the present invention, it is possible to obtain an aluminum-titanate-based sintered body in which inherent properties of an aluminum titanate, i.e., a low coefficient of thermal expansion and high corrosion resistance are maintained, the mechanical strength thereof is improved, and which can be stably used even under high temperature conditions.
Owner:OHCERA CO LTD
Transparent composite compound
ActiveUS20100178478A1Good physical propertiesHigh light transmittanceGroup 4/14 element organic compoundsGlass/slag layered productsHeat resistanceAdditive ingredient
Provided is a non-hydrolytic transparent composite composition having excellent transparency and heat resistance, and a low thermal expansion coefficient. Particularly, the transparent composite composition includes a glass filler dispersed in a crosslinked transparent resin produced by a non-hydrolytic reaction. The non-hydrolytic transparent siloxane resin is a resin having Si—O (siloxane) bonds, a resin having at least one kind of heterometal bonds, including Si—O bonds, or the resin further containing other ingredients. When the transparent siloxane resin produced by a non-hydrolytic reaction forms a composite in combination with the glass filler, the composite realizes high transparency and heat resistance, as well as a low thermal expansion coefficient. Therefore, the transparent composite composition is useful as a substrate for thin film transistor (TFT) devices, display devices and optical devices.
Owner:KOREA ADVANCED INST OF SCI & TECH
Metal-graphite composite material having high thermal conductivity and production method therefor
InactiveUS20100207055A1Improve thermal conductivityReliable bonding stateSemiconductor/solid-state device detailsConductive materialAlloyCopper
The present invention provides a metal-graphite composite material favorable to two-dimensional diffusion of heat and having a high thermal conductivity in two axial directions, and a production method therefor. The metal-graphite composite material of the present invention includes: 20 to 80% by volume of a scaly graphite powder; and a matrix selected from the group consisting of copper, aluminium and alloys thereof, wherein the scaly graphite powder in which a normal vector to a scaly surface thereof is tilted at 20° or higher with respect to a normal vector to a readily heat-conducting surface of the metal-graphite composite material is 15% or less relative to a whole amount of the scaly graphite powder, and the metal-graphite composite material has a relative density of 95% or higher.
Owner:SHIMANE PREFECTURAL GOVERNMENT MATSUE
Cladding Material and Its Manufacturing Method, Press-Forming Method, and Heat Sink Using Cladding Material
ActiveUS20090258248A1Improve thermal conductivityLow thermal expansion coefficientSemiconductor/solid-state device detailsSolid-state devicesThermal expansionHeat sink
Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.
Owner:TSUSHIMA EIKI
Method for producing aluminum titanate sintered object
InactiveUS7011788B2Reduction factorImprove corrosion resistanceCeramic shaping apparatusTitanium compoundsThermal expansionAlkali feldspar
Owner:OHCERA CO LTD
Hardenable reaction resin system
ActiveUS20050096423A1Increased mechanical resistanceIncrease thermal resistanceMaterial nanotechnologyGroup 4/14 element organic compoundsEpoxyNanoparticle
Owner:SEG AUTOMOTIVE GERMANY GMBH
Glass plate to be tempered
InactiveUS20140242391A1Low coefficient of thermal expansionImprove scratch resistanceGlass/slag layered productsGlass tempering apparatusThermal expansionHigh surface
To provide a glass plate to be tempered, which has a low thermal expansion coefficient at relatively low temperature, and which can have a sufficiently high surface compression stress by a conventional heat tempering process, even when it is thin. A glass plate to be tempered, which contains B2O3 in a range of from 12.5 to 35 mol % in its composition, the difference [X−Y] between the total content X of compounds selected from MgO, CaO, BaO, Na2O and K2O in the composition and the content Y of B2O3 in the composition being within a range of from −5 to 10 mol %, and which is to be tempered by heating and quenching.
Owner:ASAHI GLASS CO LTD
Machine for the processing of optical work pieces, specifically of plastic spectacle lenses
ActiveUS20090011688A1Precise height adjustmentEliminate needLathesRevolution surface grinding machinesRotational axisEyewear
A machine for processing optical work pieces having a work piece spindle for the work piece driving rotationally about a work piece rotation axis. At least one processing unit has a tool that can machine the work piece and an adjusting mechanism causes a relative movement between the work piece spindle and tool to selectively enable loading, unloading and processing of the work piece. The adjusting mechanism has a linear drive unit and a swivel drive unit that are stacked on each other to rotate the swivel drive unit and the work piece spindle about a swivel axis that is perpendicular to the work piece rotation axis, and has the linear drive unit move the work piece spindle along a linear axis that can be perpendicular to one of the swivel axis and the work piece rotation axis and parallel to or aligned with the other axis.
Owner:SATISLOH AG
Method of preparing resin composition for optical film by using continuous bulk polymerization and methods of preparing optical film and polarizing plate using the resin composition
ActiveUS20140000801A1Excellent optical property and heat resistanceLow thermal expansion coefficientOptical articlesPolarising elementsSolventPolarizer
Provided is a method of preparing a resin composition for an optical film. The method includes forming a four-component copolymer by reacting an alkyl(meth)acrylate-based monomer, an acrylate-based monomer containing a benzene ring, and a (meth)acrylic acid monomer by using a continuous bulk polymerization method; and forming a resin composition for an optical film by removing unreacted monomer and solvent from a reaction product in a devolatilizer.
Owner:LG CHEM LTD
Prepreg, multilayer printed wiring board and electronic parts using the same
InactiveUS20080261472A1Improve machinabilityHigh mechanical strengthSynthetic resin layered productsPrinted circuit aspectsThermal dilatationPolymer science
A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %.
Owner:HITACHI CHEM CO LTD
Resin composition, resin sheet, prepreg, laminate, multilayer printed wiring board, and semiconductor device
InactiveUS20110205721A1Low coefficient of thermal expansionHigh glass transition temperatureSynthetic resin layered productsLaminationPolymer scienceDevice material
Disclosed is a resin composition having a low thermal expansion coefficient and a high glass transition temperature used for the insulating layer of a multilayer printed wiring board, capable of forming an insulating layer having fine roughened shapes and imparting sufficient plating peel strength. Also disclosed are a resin sheet, a prepreg, a laminate, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition is a resin composition comprising (A) an epoxy resin, (B) a cyanate ester resin, (C) an aromatic polyamide resin containing at least one hydroxyl group and (D) an inorganic filler, as essential components.
Owner:SUMITOMO BAKELITE CO LTD
Machine for the processing of optical work pieces, specifically of plastic spectacle lenses
ActiveUS7975356B2Minimal costEliminate needLathesOptical surface grinding machinesEngineeringSpectacle lenses
Owner:SATISLOH AG
Transparent composite compound
ActiveUS8372504B2Low thermal expansion coefficientIncrease resistanceGroup 4/14 element organic compoundsGlass/slag layered productsHeat resistanceDisplay device
Owner:KOREA ADVANCED INST OF SCI & TECH
Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
InactiveUS20130112459A1Low coefficient of thermal expansionHigh elastic modulusFilm/foil adhesivesSynthetic resin layered productsInorganic fillerComposite material
A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing at least two glass substrate layers and at least one inner cured resin layer existing between the adjacent two glass substrate layers, wherein the inner cured resin layer comprises a cured product of an inner resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.
Owner:HITACHI CHEM CO LTD
Cladding material and its manufacturing method, press-forming method, and heat sink using cladding material
ActiveUS7951467B2Improve thermal conductivityLow thermal expansion coefficientSemiconductor/solid-state device detailsSolid-state devicesThermal expansionThermal transmittance
Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.
Owner:TSUSHIMA EIKI
Metal-graphite composite material having high thermal conductivity and production method therefor
InactiveUS8501048B2Improve thermal conductivityReliable bonding stateSemiconductor/solid-state device detailsConductive materialHeat conductingAlloy
The present invention provides a metal-graphite composite material favorable to two-dimensional diffusion of heat and having a high thermal conductivity in two axial directions, and a production method therefor. The metal-graphite composite material of the present invention includes: 20 to 80% by volume of a scaly graphite powder; and a matrix selected from the group consisting of copper, aluminum and alloys thereof, wherein the scaly graphite powder in which a normal vector to a scaly surface thereof is tilted at 20° or higher with respect to a normal vector to a readily heat-conducting surface of the metal-graphite composite material is 15% or less relative to a whole amount of the scaly graphite powder, and the metal-graphite composite material has a relative density of 95% or higher.
Owner:SHIMANE PREFECTURAL GOVERNMENT MATSUE
Resin composition for optical film and optical film using the same
ActiveUS20140036363A1Improve heat resistanceHigh transparencyPolarising elementsChemistryImage display
Provided are a resin composition for an optical film including an alkyl(meth)acrylate unit, a benzyl(meth)acrylate unit, a (meth)acrylic acid unit, and a unit expressed by Chemical Formula I, an optical film, a polarizing plate, and an image display device using the resin composition.
Owner:LG CHEM LTD
Modified maleimide resin composition and prepreg and laminate prepared therefrom
The invention provides a modified maleimide resin composition, which is prepared from epoxy siloxane-modified maleimide prepolymer, thermosetting resin, and inorganic filler; maleimide compound and aromatic amine compound react in advance, so that maleimide-modified aromatic amine compound is prepared, epoxy siloxane is then added into the maleimide-modified aromatic amine compound to react, and thereby the epoxy siloxane-modified maleimide prepolymer is obtained. The invention further provides a prepreg prepared from the modified maleimide resin composition and a laminate prepared by laminating the prepregs. The modified maleimide resin composition and the prepreg and the laminate prepared therefrom which are provided by the invention have the advantages of low thermal expansibility, highbinding property, high heat resistance, excellent reactivity, low moisture absorption rate and high flame-retardant property, can be applied in the field of IC (integrated circuit) packages, such asCSP (Chip Scale Package), PoP and SIP (System in Package), and have a broad application prospect.
Owner:SHENGYI TECH SUZHOU
Wiring board manufacturing method
InactiveUS20060112544A1High densityLow coefficient of thermal expansionSemiconductor/solid-state device detailsSolid-state devicesElectrical and Electronics engineeringEngineering
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.
Owner:FUJITSU LTD
Heater for fixing device
ActiveUS20140353303A1Maintain liquidityReduce fluidityOhmic-resistance heating detailsElectrographic process apparatusAlkali freeAlkali metal oxide
A heater for fixing devices includes a glass substrate, a heating element, electrode patterns connected to the heating element, a first protective layer, and a second protective layer. The glass substrate is made of an alkali-free glass. The first protective layer is formed by firing a mixture of a first glass powder and a first filler. The first glass powder contains no alkali metal oxide and has a lower softening point than the glass substrate. The first filler has a lower thermal expansion coefficient than the alkali-free glass for the glass substrate. The second protective layer is made of a material that does not contain the first filler contained in the first protective layer.
Owner:ALPS ALPINE CO LTD
Curable Silicone Composition And Cured Product Thereof
ActiveUS20140288235A1Small coefficient of thermal expansionLow coefficient of thermal expansionHydrosilylationThermal expansion
A curable silicone composition comprising: (A) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —R1R2SiO)m—, wherein R1 is a C1-6 alkyl group or the phenyl group, R2 is a C2-10 alkenyl group, and m is a positive number from 5 to 50; (B) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —(R3HSiO)n—, wherein R3 is a C1-6 alkyl group or the phenyl group and n is a positive number from 10 to 100; and (C) a hydrosilylation reaction catalyst, cures to form a cured product that has a small thermal expansion coefficient.
Owner:DOW TORAY CO LTD
Prepreg, metal-clad laminate, and printed circuit board
ActiveUS20130126218A1Improve drilling processabilityLow thermal expansion coefficientSynthetic resin layered productsThin material handlingThermal dilatationPolymer science
Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g / cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.
Owner:RESONAC CORPORATION
Stainless steel substrate for solar cell having superior insulating properties and low thermal expansion coefficient and method of producing the same
ActiveUS20160079455A1Maintain conversion efficiencyPromote formationFinal product manufactureSolid state diffusion coatingPhysical chemistrySolar cell
Provided is a stainless steel substrate for a solar cell, the stainless steel substrate including, by mass %, Cr: 9% to 25%, C: 0.03% or less, Mn: 2% or less, P: 0.05% or less, S: 0.01% or less, N: 0.03% or less, Al: 0.005% to 5.0%, Si: 0.05% to 4.0%, and a remainder including Fe and unavoidable impurities, in which an oxide film containing (i) Al2O3 in an amount of 50% or more or containing (i) Al2O3 and (ii) SiO2 in a total amount of 50% or more is formed on a surface of stainless steel having a composition which contains Al: 0.5% or more and / or Si: 0.4% or more and satisfies the following expression (1).Cr+10Si+Mn+Al>24.5 (1)
Owner:NIPPON STEEL STAINLESS STEEL CORP
Optical filtering module and optical devices using such optical filtering module
InactiveUS20020126955A1Easy and time saving alignment operationAvoid collisionCoupling light guidesPhysicsWavelength range
There are disclosed an optical filtering module and various optical devices using the filtering module. The optical filtering module has an optical filter for transmitting, attenuating or reflecting light having a certain wavelength range, a first optical system having an optical fiber for guiding light to be transferred to the optical filter, a second optical system having an optical fiber for guiding light transferred from the optical filter, the second optical system being opposingly arranged to the first optical system while interposing the optical filter therebetween and an outer cylindrically shaped glass holder for holding therein the optical filter, the first optical system and the second optical system secured thereto.
Owner:HOYA CORP
Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
InactiveUS20130180760A1Low thermal expansion coefficientHigh elastic modulusFilm/foil adhesivesSynthetic resin layered productsMaterials scienceInorganic filler
A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.
Owner:HITACHI CHEM CO LTD
Substrate for flexible displays
ActiveUS7579054B2Sufficient flexibilityLow thermal expansion coefficientLiquid crystal compositionsPhotosensitive materialsDisplay deviceSolvent
Owner:SUMITOMO CHEM CO LTD
Wiring board manufacturing method
InactiveUS7377030B2High wiring densityLow thermal expansion coefficientSemiconductor/solid-state device detailsSolid-state devicesEngineeringPower strip
Owner:FUJITSU LTD
Resin composition, prepreg and laminate
ActiveUS20140017502A1Low coefficient of thermal expansionImprove drillabilitySynthetic resin layered productsPrinted circuit aspectsSolid componentMohs scale of mineral hardness
It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.
Owner:MITSUBISHI GAS CHEM CO INC
Substrate for Flexible Displays
ActiveUS20070224366A1Sufficient flexibilityLow thermal expansion coefficientLiquid crystal compositionsFinal product manufactureSolventFlexible display
The present invention provides a substrate for flexible displays, a method for producing the same, and a flexible display. The substrate for flexible displays comprises a resin composition layer containing an inorganic layered compound and a resin, wherein the amount of the inorganic layer compound is not less than 10 weight % and not more than 70 weight % based on the total amount of the resin and the inorganic layer compound. The method for producing a substrate for flexible displays comprises applying a mixture of a solvent, an inorganic layer compound, and a resin to a plate, drying the mixture, and peeling off the resulting layer from the plate. The display comprises the above substrate for flexible displays and electrodes.
Owner:SUMITOMO CHEM CO LTD
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