49results about How to "Improve drilling processability" patented technology

The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.

The invention relates to the technical field of machining of a motor component, in particular to a drilling device for a motor casing. The drilling device comprises a base, an electric telescopic rod,a drill bit, a clamping mechanism, a rotating column, a rotating shaft and an anti-loosening mechanism, wherein the electric telescopic rod is fixedly arranged on the top of the left side of the base; a drilling motor for driving the drill bit to rotate is fixedly arranged on the lower surface of the middle part of a supporting carrier plate; the rotating column is rotatably arranged at the middle of a carrier plate of the base in a penetration manner; and the clamping mechanism for clamping and fixing the motor casing is fixedly arranged on the top end of the rotating column. The drilling device has the advantages of simple operation, stable structure, convenience for clamping and fixing of the motor casing, a good drilling machining effect and flexibility in use.

The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks.This epoxy resin composition includes:(A) an epoxy resin;(B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent,(C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and(D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A).The epoxy resin composition exhibits, when cured into an article, a linear coefficient (az) of thermal expansion of 48 or less with respect to a thickness of said article.

The invention discloses a thermosetting resin composition. The composition comprises 20wt%-70wt% of thermosetting resin, 1wt%-30wt% of a curing agent, 0wt%-10wt% of an accelerator, an organic molybdenum compound, organic silicon powder and inorganic filler which are prepared into prepreg through an impregnation way or prepared into a coating through a coating way. The composition can be used for remarkably lowering a coefficient of thermal expansion and water absorption of a composite material, improving a bonding interface between the resin and the inorganic filler, improving interlayer adhesiveness of a laminated board and improving drilling processability of the laminated board.

There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1):xMgCO3.yMg(OH)2.zH2O  (1)wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4and huntite; (B) an epoxy resin; and (C) a curing agent.

Provided is a process for producing a compatibilized resin which comprises reacting a cyanate compound, a siloxane resin having a hydroxy group at an end, and an epoxy resin to a specific conversion. Also provided is a thermosetting resin composition which comprises: a compatibilized resin (A1) produced by the process or a thermosetting resin (A2) obtained by reacting a cyanate compound with a siloxane resin having a hydroxy group at an end to a specific conversion; and fused silica (B) in which the surface has been treated with a trimethoxysilane compound. Furthermore provided are a prepreg, a laminate, and a wiring board each obtained using the resin composition. The thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foils, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric properties, and drillability. With the composition, increases in the density of wiring boards and high reliability thereof, which are required at present, are attained. The composition can be widely used for producing electronic appliances, etc.

The invention provides continuous type drilling equipment for front supports of safety frames of forklifts. The continuous type drilling equipment comprises a workbench, a drilling device and a limiting device. A conveying roll set used for conveying the front supports is arranged between the feeding end and the discharging end of the workbench. The drilling device is located above the conveying roll set and comprises a drilling unit used for drilling the front supports and a fixing unit used for fixing the front supports. The drilling unit comprises a plurality of drill rods arranged in the conveying direction of the conveying roll set side by side. Drill bits are arranged at the ends, close to the conveying roll set, of the drill rods. The limiting device comprises a first limiting unit and a second limiting unit. The first limiting unit comprises a first limiting blocking frame and a first driving device used for driving the first limiting blocking frame to move in the vertical direction. The second limiting unit comprises a second limiting blocking frame and a second driving device used for driving the second limiting blocking frame to move in the vertical direction. The continuous type drilling equipment is simple in structure, capable of conducting continuous machining, high in working efficiency and good in drilling effect.

The invention relates to a prepreg for improving electric leakage-resisting tracking index and drilling processing properties and an application thereof. The prepreg is prepared according to the method which comprises the following steps: controlling a coating linear velocity at 6-15m / min, circularly loading an adhesive onto a gluing machine, uniformly coating a glass fiber cloth with the adhesive by presoaking and primarily soaking, baking the glass fiber cloth coated with the adhesive in a drying box at 100 DEG C-250 DEG C, evaporating the solvent, preliminarily reacting and curing the adhesive, thereby acquiring the prepreg. Compared with the prior art, the invention not only can promote the electric leakage-resisting tracking index of a Tg unleaded coated copper foil plate, but also can obviously improve the drilling processing properties of a sandwich plate prepared from the prepreg.

Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g / cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.

The invention provides a thermosetting resin composition, a prepreg containing the same, a metal foil-coated laminate, and a printed circuit board. The thermosetting resin composition comprises alicyclic epoxy resin with a structure as shown in a formula I. Through usage of the alicyclic epoxy resin with a specific structure, the prepared resin composition has excellent resistance to yellowing caused by heat, resistance to ageing caused by light and excellent drilling processability; and a laminate, the metal foil-coated laminate and the printed circuit board prepared from the composition have excellent heat resistance, excellent resistance to ageing caused by light and a water absorption rate of 0.32% or below. According to the invention, the problems of proneness to yellowing and ageing under heat and proneness to yellowing and ageing under illumination of traditional printed circuit boards are overcome; and a preparation process for the thermosetting resin composition is simple and feasible and is low in cost.

An epoxy resin composition that excels in drillability, moldability and interlayer adhesion, ensuring favorably performing of desmear treatment. The epoxy resin composition comprises an epoxy resin, a hardening agent and an inorganic filler. As the epoxy resin, use is made of an epoxy resin with dicyclopentadiene skeleton or an epoxy resin with novolac skeleton. As the hardening agent, use is made of a phenolic resin hardening agent with biphenyl skeleton. As the inorganic filler, use is made of aluminum hydroxide and spherical silica surface-treated with epoxysilane. The content of spherical silica based on the total amount of the epoxy resin composition is in the range of 20 to 50 mass%. The content of aluminum hydroxide based on the total amount of spherical silica is in the range of 2 to 15 mass%.

The present invention provides a thermosetting resin composition, a prepreg produced by using the thermosetting resin composition, and a metal foil clad laminate, wherein the thermosetting resin composition comprises a component (A) and a component (B), wherein the component (A) is a solvent-soluble polyfunctional vinyl aromatic copolymer, the solvent-soluble polyfunctional vinyl aromatic copolymer has the structure unit of a monomer comprising a divinyl aromatic compound (a) and an ethyl vinyl aromatic compound (b), the component (B) is a polybutadiene resin having a number average molecularweight of 500-10000, and the content of the vinyl added at the sites 1 and 2 in the molecule is more than or equal to 50%. According to the present invention, the prepreg produced by using the thermosetting resin composition and the metal foil clad laminate have good toughness, maintain high glass transition temperature, low water absorption, dielectric property and damp heat resistance, can be used in the field of high-frequency high-speed printed circuit boards, and are further suitable for multi-layer printed circuit board processing.

The present invention provides a thermosetting resin composition, a prepreg produced by using the thermosetting resin composition, and a metal foil clad laminate, wherein the thermosetting resin composition comprises a component (A) and a component (B), wherein the component (A) is a solvent-soluble polyfunctional vinyl aromatic copolymer, the solvent-soluble polyfunctional vinyl aromatic copolymer has the structure unit of a monomer comprising a divinyl aromatic compound (a) and an ethyl vinyl aromatic compound (b), the component (B) is an olefin resin having a number average molecular weightof 500-10000 and having a styrene structure weight ratio of 10-50%, and the molecule contains the butadiene structure added at the sites 1 and 2. According to the present invention, the prepreg produced by using the thermosetting resin composition and the metal foil clad laminate have good toughness, maintain high glass transition temperature, low water absorption, excellent dielectric property and damp heat resistance, can be used in the field of high-frequency high-speed printed circuit boards, and are further suitable for multi-layer printed circuit board processing.

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

The invention provides a resin composition, a prepreg containing the resin composition, a dielectric substrate and a printed circuit board. The resin composition comprises the following components: (A) thermosetting resin with unsaturated double bonds; (B) a resin film-forming property improving material; (C) Hexagonal boron nitride; D, any one or a combination of at least two of aluminum nitride,silicon nitride or silicon carbide; (E) other inorganic fillers except the components (C) and (D); (F) a flame retardant and (G) an initiator, wherein the mass sum of the component (C), the component(D) and the component (E) accounts for 60-80% of the total mass of the resin composition, and the mass ratio of the component (C) to the component (D) is (1-4): 2. The dielectric substrate obtained by using the resin composition provided by the invention has the advantages of low dielectric constant, low dielectric loss, high thermal conductivity and stable thickness and dielectric constant, andcan fully meet the requirements of a high-frequency high-thermal-conductivity dielectric substrate.

The invention relates to an epoxy resin composition and an adhesive sheet and a substrate made by the same. The epoxy resin composition comprises component A: epoxy resin, component B: a hardening agent, component C: an accelerator, component D: a packing material namely sericite powder, wherein, the sericite powder contains 55%+ / -3% of silicon dioxide, and the hardness of the sericite powder is mohs' hardnees 2-3. Therefore, the adhesive sheet / substrate made by dipping in epoxy resin composition glue solution has better processibility.

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and / or a phenol resin (C), and an inorganic filler (D).

The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

The invention discloses a drill bit connecting piece convenient to replace and used for steel structure machining and a using method, and belongs to the technical field of steel structure machining. According to the drill bit connecting piece convenient to replace and used for steel structure machining and the using method,when a connecting drill bit device is installed on a mounting device, the drill bit connecting device and the mounting device can be fixed only by extending the drill bit connecting device into a mounting box in the first step and rotating a rotating rod to enable a fixing rod to be rotated into a fixing groove in the second step, and mounting is easy and convenient; and when the drill bit connecting device is disassembled or replaced, the whole drill bit connecting device can be taken out and separated from the mounting device only by lifting connecting rods on the two sides to drive a check block to descend in the first step, rotating the rotating rod to the initial position to be aligned with a positioning groove in the second step and directly pulling down a connecting column in the third step, the operation process is simple and labor-saving, replacement is convenient, and the drilling machining efficiency of a steel structure workpiece is greatly improved.

A resin composition is provided. The resin composition includes the following constituents:(A) an epoxy resin;(B) an amino group-containing hardener; and(C) a compound of formula (I),wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

The invention provides a resin composition and an application thereof. The resin composition comprises the following components in percentage by weight: 15-39% of crosslinkable and curable resin and 61-85% of filler; and the filler is silicon dioxide prepared by an organic silicon hydrolysis method, the average particle size D50 of the silicon dioxide is 0.1-3 microns, the ratio of D100 to D10 is less than or equal to 2.5, and the purity of the silicon dioxide is greater than 99.9%. According to the resin composition disclosed by the invention, a prepared adhesive film and a resin-coated copper foil have relatively high tensile strength and peel strength, relatively good drilling processability, controllable flowability, good adhesive filling capability and relatively high electrical strength, can realize finer circuit processing capability, and are a printed circuit board material capable of being applied to a multi-layer laminated board, particularly a printed circuit board material of a multilayer laminated board with fine lines.

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2 / g to 15 m2 / g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

The present invention relates to a laminate including two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition, the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y), the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers, the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and the second glass fibers having a higher tensile elastic modulus at 25° C. than the first glass fibers, a printed wiring board including the laminate, a semiconductor package, and a method for producing a laminate.

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and / or a phenol resin (C), and an inorganic filler (D).

The invention discloses a thermosetting resin composition and application thereof. The thermosetting resin composition contains thermosetting resin and inorganic filler, and the inorganic filler is subjected to wrapping treatment by molybdenum alkene disulfide; and on the basis of the total mass of the thermosetting resin composition, the content of the inorganic filler is 10wt%-80wt%. According to the provided thermosetting resin composition, the molybdenum alkene disulfide wraps the inorganic filler, the compatibility of the inorganic filler and a resin system can be improved effectively, and the resin composition which is uniform and stable in dispersion can be obtained without complicated dispersing equipment. Provided prepreg is prepared by dipping the thermosetting resin compositionin a reinforcing material and then drying the thermosetting resin composition, problems about dispersion and settling of a molybdenum compound are solved effectively, and the molybdenum compound can be uniformly distributed in the prepreg. A provided laminated board contains at least one prepreg; and a provided printed circuit board contains at least one prepreg.

The invention discloses a thermosetting epoxy resin composition, which contains modified silicon dioxide and therefore can be used in the preparation of epoxy resin laminated boards with a low expansion coefficient property and excellent drilling processability. The modified silicon dioxide does not contain crystal water, has a low expansion coefficient property and comprises 40 to 80 weight percent of silicon dioxide and 60 to 20 percent of inorganic additive. And the modified silicon dioxide is prepared by sintering and melting at a high temperature above 1,000 DEG C and crushing.

The invention discloses a drilling machining device for a metal plate. The drilling machining device comprises a base, a supporting shaft, a driving mechanism, a machining table, multiple supporting units, N first racks and (n+1) drilling mechanisms, and N is a positive integer; the supporting shaft is vertically and rotationally installed on the base; the driving mechanism is used for driving thesupporting shaft to rotate; the machining table is installed on the supporting shaft; the multiple supporting units are sequentially distributed around the circumferential direction of the supportingshaft, and the supporting units comprise supporting plates and first gears, and the supporting plates are rotationally connected with the machining table; the first gears are installed on the supporting plates; and the N first racks are uniformly distributed in the circumferential direction of the supporting shaft, and the first racks are located on the moving path of the first gears. The drilling machining device has the advantages of being high in drilling efficiency and good in effect.

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2 / g to 15 m2 / g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.