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Thermosetting resin composition and use thereof

A resin composition and thermosetting technology, which is applied in the field of laminates and printed circuit boards, resin glue, and prepregs, and can solve the problem of deteriorating interlayer adhesion, reduced interlayer adhesion of laminates, and poor dispersion, etc. problems, to achieve the effects of improving drilling processability, improving thermal expansion coefficient, and reducing water absorption

Active Publication Date: 2014-01-08
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, some people use block fillers such as talc as lubricants to improve processability, but the effect is not obvious, and the addition of these block fillers further deteriorates the interlayer adhesion.
In addition, in order to improve the drilling processability, metal molybdenum compounds are added. For example, CN102656234A mentions that metal molybdenum compounds such as zinc molybdate are added to improve processability, and the patent recommends the use of molybdenum compound particles loaded on talc, etc. This has the problem that the interlayer adhesion of the laminate is significantly reduced, and the dispersion of this type of molybdenum compound in the resin is poor, and special dispersion equipment is required to disperse it. In addition, the density of this type of molybdenum compound is relatively high , prone to settling, so that satisfactory results cannot be obtained

Method used

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  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0037] Brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), dicyandiamide, 2-methylimidazole, organic molybdenum compound, organic silicon powder, inorganic filler , dissolved in an organic solvent, mechanically stirred and emulsified to prepare a 65wt% glue solution, then impregnated with glass fiber cloth, heated and dried to form a prepreg (prepreg), placed copper foil on both sides, pressurized and heated to form a copper foil substrate .

[0038] Using the obtained copper-clad laminates, the drillability, thermal expansion coefficient, interlayer adhesion, and dispersion effects were evaluated by the methods shown below. Table 1 shows the results.

[0039] A) Organic molybdenum compounds:

[0040] A-1 molybdenum dialkyldithiocarbamate, D50=10μm, Pacific Union (Beijing) Petrochemical Co., Ltd.

[0041] A-2 molybdenum sulfide dialkyl dithiophosphate, self-made

[0042] A-3 organic molybdate, homemade

[...

Embodiment 7

[0054] A copper-clad laminate using a resin composition was obtained in the same manner as in Example 1 except that the silicone powder was not blended. Table 1 shows the measurement and evaluation results.

Embodiment 8-13

[0084] 100 parts by weight of brominated bisphenol A epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight novolak resin (Japan Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight of 2-methylimidazole, organic molybdenum compound, organic silicon powder and inorganic filler are dissolved in organic solvent, mechanically stirred and emulsified to prepare a 65wt% glue solution, then impregnated with glass fiber cloth, and formed after heating and drying Prepreg (prepreg), placed copper foil on both sides, pressurized and heated to form a copper foil substrate.

[0085] Using the obtained copper-clad laminate, the drillability, coefficient of thermal expansion, interlayer adhesion, and dispersibility effects were evaluated by the method described above. Table 3 shows the results.

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Abstract

The invention discloses a thermosetting resin composition. The composition comprises 20wt%-70wt% of thermosetting resin, 1wt%-30wt% of a curing agent, 0wt%-10wt% of an accelerator, an organic molybdenum compound, organic silicon powder and inorganic filler which are prepared into prepreg through an impregnation way or prepared into a coating through a coating way. The composition can be used for remarkably lowering a coefficient of thermal expansion and water absorption of a composite material, improving a bonding interface between the resin and the inorganic filler, improving interlayer adhesiveness of a laminated board and improving drilling processability of the laminated board.

Description

technical field [0001] The invention relates to a thermosetting resin composition and its application, in particular to a thermosetting resin composition and resin glue, prepreg, laminate and printed circuit board obtained therefrom. Background technique [0002] With the rapid development of electronic products towards miniaturization, multi-function, high performance and high reliability, printed circuit boards begin to move towards high precision, high density, high performance, microporous, thin and multilayer The direction is developing rapidly, and its application scope is becoming more and more extensive. It has rapidly entered civilian electrical appliances and related products from industrial large-scale electronic computers, communication instruments, electrical measurement, national defense, aviation, aerospace and other departments. The matrix material largely determines the performance of printed circuit boards, so it is urgent to develop a new generation of mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L83/04C08L83/05C08L83/07C08K13/02C08K5/39C08K3/24C08K5/10C08K5/098C08J5/24B32B15/092B32B27/04H05K1/03
Inventor 杜翠鸣郝良鹏柴颂刚
Owner GUANGDONG SHENGYI SCI TECH
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