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Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board

A technology of epoxy resin and composition, applied in the direction of metal layered products, synthetic resin layered products, printed circuits, etc., can solve the problems of reduced drilling processability and easy wear of drill bits, and achieve excellent interlayer adhesion, Good desmear treatment effect

Inactive Publication Date: 2010-12-08
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the conventional epoxy resin composition, when the hole is drilled in the manufacturing process of the printed wiring board, there is a problem that the drill bit is easily worn and the drilling workability is lowered.

Method used

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  • Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board

Examples

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Effect test

Embodiment

[0035] Hereinafter, the present invention will be specifically described by way of examples.

[0036] As the epoxy resin, "HP-7200" (epoxy equivalent 280) manufactured by Dainippon Ink Chemicals Co., Ltd., which is an epoxy resin having a dicyclopentadiene skeleton, and Dainichi, which is an epoxy resin having a novolak skeleton, were used. "N-690" manufactured by Nippon Ink Chemical Industry Co., Ltd. (epoxy equivalent is 225), halogenated epoxy resin (flame retardant) is "Epiclon153" manufactured by Dainippon Ink Chemical Industry Co., Ltd. (epoxy equivalent is 400, The bromine content is 48.0% by mass).

[0037] As a curing agent, "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., which is a phenolic resin curing agent having a biphenyl skeleton, was used.

[0038] As the inorganic filler, "SC2500-SEJ" manufactured by admatechs.co., which is spherical silica surface-treated with epoxysilane, "CL303" manufactured by Sumitomo Chemical Co., Ltd., aluminum hydroxide, and crushe...

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Abstract

An epoxy resin composition that excels in drillability, moldability and interlayer adhesion, ensuring favorably performing of desmear treatment. The epoxy resin composition comprises an epoxy resin, a hardening agent and an inorganic filler. As the epoxy resin, use is made of an epoxy resin with dicyclopentadiene skeleton or an epoxy resin with novolac skeleton. As the hardening agent, use is made of a phenolic resin hardening agent with biphenyl skeleton. As the inorganic filler, use is made of aluminum hydroxide and spherical silica surface-treated with epoxysilane. The content of spherical silica based on the total amount of the epoxy resin composition is in the range of 20 to 50 mass%. The content of aluminum hydroxide based on the total amount of spherical silica is in the range of 2 to 15 mass%.

Description

technical field [0001] The present invention relates to epoxy resin compositions, prepregs, and metal-clad laminates used as materials for printed wiring boards, and multilayer printed wiring boards manufactured using these materials. Background technique [0002] Conventionally, various materials have been used as materials for printed wiring boards (for example, refer to Patent Documents 1 to 6), but recently, along with lead-free soldering, epoxy resin compositions used as materials for printed wiring boards are required to have heat resistance. Therefore, in order to meet this demand, an epoxy resin composition containing an epoxy resin having a dicyclopentadiene skeleton, an epoxy resin having a novolak skeleton, and a phenol resin curing agent having a biphenyl skeleton has been developed. [0003] Patent Document 1: JP Unexamined Publication No. 2007-2053 [0004] Patent Document 2: JP-A-2005-336426 [0005] Patent Document 3: JP Unexamined Publication No. 2002-378...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/32B32B15/08C08G59/62C08J5/24C08K3/22C08K7/18C08L63/00H05K1/03H05K3/46
CPCH05K3/4626C08J5/24C08G59/621C08K3/36B32B27/12B32B15/08C08J2363/08C08L63/00H05K2201/0239B32B27/38H05K2201/0209C08G59/38C08K5/13C08K3/22H05K1/0373B32B27/04B32B5/024B32B15/14B32B15/20B32B2260/021B32B2260/046B32B2262/101B32B2264/102B32B2307/306B32B2307/50B32B2457/08Y10T428/31529C08J5/244C08J5/249C08L2666/22C08K3/013C08J2363/00C08K2003/2227
Inventor 藤泽洋之田宫裕记
Owner PANASONIC CORP
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