Resin composition, prepreg containing resin composition, dielectric substrate and printed circuit board

Abstract

The invention provides a resin composition, a prepreg containing the resin composition, a dielectric substrate and a printed circuit board. The resin composition comprises the following components: (A) thermosetting resin with unsaturated double bonds; (B) a resin film-forming property improving material; (C) Hexagonal boron nitride; D, any one or a combination of at least two of aluminum nitride,silicon nitride or silicon carbide; (E) other inorganic fillers except the components (C) and (D); (F) a flame retardant and (G) an initiator, wherein the mass sum of the component (C), the component(D) and the component (E) accounts for 60-80% of the total mass of the resin composition, and the mass ratio of the component (C) to the component (D) is (1-4): 2. The dielectric substrate obtained by using the resin composition provided by the invention has the advantages of low dielectric constant, low dielectric loss, high thermal conductivity and stable thickness and dielectric constant, andcan fully meet the requirements of a high-frequency high-thermal-conductivity dielectric substrate.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition, a prepreg containing it, a dielectric substrate and a printed circuit board. Background technique [0002] With the continuous development of printed circuit boards (PCBs) towards high density and multi-layers, the space for mounting and installing components on PCBs has been greatly reduced, and the power requirements for power components in electronic products are getting higher and higher. Space and high power inevitably generate more heat accumulation. On the other hand, with the rapid development of modern communication technology, the operating frequency of electronic equipment is getting higher and higher, and the heat generation is getting bigger and bigger. In short, the integration of a large number of powerful functions into smaller components drives the printed board to become more dense, and at the same time the development of high-fr...

AI Technical Summary

Problems solved by technology

Although the final circuit substrate has good high-frequency dielectric properties, its thermal conductivity has not been studied, and may not meet the requirements of high thermal conductivity

US6291374 discloses a resin composition comprising thermosetting polybutadiene or polyisoprene resin, ethylene propylene rubber and optional thermoplastic unsaturated butadiene or isoprene-containing polymer, particle filler, barrier Combustion additives, curing agents and woven or non-woven fabrics, the final circuit substrate has better heat aging performance and lower dielectric constant, but does not provide how to improve the thermal conductivity of the substrate

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