Epoxy resin composition and adhesive sheet and substrate made by same

A technology of epoxy resin and composition, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of film/substrate processability limitation, difficult machining, plate hardening, etc., and achieve the purpose of increasing drilling processability Effect

Active Publication Date: 2011-04-06
ITEQ WUXIELECTRONICS TECH
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  • Abstract
  • Description
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Problems solved by technology

However, the addition of the above-mentioned inorganic silicon micropowder fillers leads to the unfavorable phenomenon that the board becomes hard, which makes it difficult to be machined; Defects such as cracks in laminates and laminates, broken drill needles, or excessive wear of drill needles
[0004] In other words, the traditional resin glue is added with fillers with high hardness, such as silica with a Mohs hardness of up to seven, which limits the processability of the produced film / substrate

Method used

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  • Epoxy resin composition and adhesive sheet and substrate made by same

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Embodiment 1

[0024] Embodiment 1 is the most preferred embodiment of the present invention, and in the composition of embodiment 1, the silica weight in this sericite powder composition is 55 ± 3%, and the particle diameter of this sericite powder is 3 ± 3%. 1um, from the data in Table 1, the resin glue time, peel strength and water absorption of the copper-clad substrate can meet the specifications of the substrate; and the glass transition temperature (Tg) is 141 ° C, indicating that its reactivity is also good; And it can be known that the film / copper-clad substrate manufactured after the glass fiber cloth impregnation operation through the epoxy resin composition glue proposed by the present invention has higher heat resistance, so the time required for the explosion board is longer and meets At the same time, the drilling roughness of the substrate can be reduced by up to 0.9mil, so the addition of low-hardness sericite powder (Mohs hardness 2 to 3) can reduce the interlayer peeling wh...

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Abstract

The invention relates to an epoxy resin composition and an adhesive sheet and a substrate made by the same. The epoxy resin composition comprises component A: epoxy resin, component B: a hardening agent, component C: an accelerator, component D: a packing material namely sericite powder, wherein, the sericite powder contains 55%+ / -3% of silicon dioxide, and the hardness of the sericite powder is mohs' hardnees 2-3. Therefore, the adhesive sheet / substrate made by dipping in epoxy resin composition glue solution has better processibility.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition added with sericite powder. Background technique [0002] The printed circuit board is made of impregnated film (PP), or multiple films such as copper clad laminate (CCL) or copper foil, which are fully pressed by thermal pressing; and the impregnated film is impregnated with glass fiber cloth. Epoxy resin glue, and drying and other subsequent processes to form a thin film. With the implementation of environmental laws and regulations (such as RoHS, WEEE), the process of lead-free solder replaces the process of lead solder, and the assembly temperature is increased by 30 to 40 degrees, which greatly increases the heat resistance requirements of the substrate. [0003] The current trend is to change the hardener from the original highly polar and water-absorbing DICY hardener to a phenolic resin hardener containing a benzene ring structure that is difficult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/36C08J5/24H05K1/03
Inventor 袁燕华
Owner ITEQ WUXIELECTRONICS TECH
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