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Resin composition, prepreg, and laminate

a technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, metal layered products, domestic applications, etc., can solve the problems of poor connection between the semiconductor element and the printed wiring board of the semiconductor plastic package or between the semiconductor plastic package and the printed wiring board mounted, the drilling workability and the coefficient of thermal expansion in a plane direction are unsatisfactory, and the heat resistance is deteriorated. , to achieve the effect of excellent drilling workability,

Inactive Publication Date: 2013-05-30
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a resin composition that can be used to make a laminated sheet for various applications, such as semiconductor packages. The composition has excellent heat resistance, flame retardance without using halogens or phosphorus compounds, and is easy to drill. Additionally, the composition has a low coefficient of thermal expansion in the plane direction, making it useful for applications that require specific properties.

Problems solved by technology

When the difference in coefficient of thermal expansion between a semiconductor element and a printed wiring board for a semiconductor plastic package is large, warpage occurs in the semiconductor plastic package due to the difference in coefficient of thermal expansion upon exposure to thermal shock, sometimes leading to poor connection between the semiconductor element and the printed wiring board for a semiconductor plastic package or between the semiconductor plastic package and the printed wiring board mounted.
When the amount of gibbsite that is a general structure of aluminum hydroxide is large, heat resistance is deteriorated due to an influence of water of crystallization that is released upon heating.
Copper-clad laminated sheets prepared using boehmite are superior in heat resistance to those prepared using aluminum hydroxide, but on the other hand, drilling workability and coefficient of thermal expansion in a plane direction are unsatisfactory.
Thus, the effect attained by this technique regarding a reduction in coefficient of thermal expansion and an improvement in heat resistance and drilling workability that are required of the laminated sheet applications has not been found.
This method suffers from a problem that increasing the amount of the inorganic filler filled into the resins to further lower the coefficient of thermal expansion is disadvantageous in that the resultant resin composition is hard and fragile, the abrasion of drill bits is fast, and breakage of drill bits and a lowering in the accuracy of hole position lead to an increased frequency of replacement of drill bits, resulting in a deteriorated drilling workability.

Method used

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  • Resin composition, prepreg, and laminate
  • Resin composition, prepreg, and laminate
  • Resin composition, prepreg, and laminate

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

Synthesis of α-Naphthol Aralkyl Cyanate Ester Compound

[0061]A reactor equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser was preliminarily cooled with brine to 0 to 5° C. Cyanogen chloride (7.47 g, 0.122 mol), 9.75 g (0.0935 mol) of 35% hydrochloric acid, 76 ml of water, and 44 ml of methylene chloride were charged into the reactor. The temperature within the reactor and pH were kept at −5 to +5° C. and 1 or less, respectively, and, while stirring, a solution of 20 g (0.0935 mol) of α-naphthol aralkyl (compound of formula (VI); all of Rs in the formula representing a hydrogen atom; SN: 485, hydroxyl group equivalent: 214 g / eq., softening point: 86° C., manufactured by Nippon Steel Chemical Co., Ltd.), and 14.16 g (0.14 mol) of triethylamine dissolved in 92 ml of methylene chloride was added dropwise to the contents in the reactor through a dropping funnel over a time period of one hr. After the completion of the dropwise addition, 4.72 g (0.047 mol) of...

synthesis example 2

Synthesis of BT Resin (BT2610)

[0064]2,2-Bis(4-cyanatophenyl)propane (CX: manufactured by Mitsubishi Gas Chemical Co., Inc.) (40 parts by weight) and 60 parts by weight of bis(3-ethyl-5-methyl-4-maleimidephenyl)methane (BMI-70: manufactured by K.I. Kasei K.K.) were melted at 150° C. and were allowed to react with each other until the viscosity of the mixed resin became 12 Pa·s as measured with a cone-plate viscometer while stirring. The mixed resin was dissolved in methyl ethyl ketone to obtain a BT resin.

synthesis example 3

Synthesis of BT Resin (BT9510)

[0065]A novolak cyanate ester resin (Primaset PT-30, manufactured by Lonza Japan, cyanate equivalent: 124 g / eq.) (50 parts by weight) and 50 parts by weight of bis(3-ethyl-5-methyl-4-maleimidephenyl)methane (BMI-70: manufactured by K.I. Kasei K.K.) were melted at 150° C. and were allowed to react with each other until the viscosity of the mixed resin became 15 Pa·s as measured with a cone-plate viscometer with stirring. The mixed resin was dissolved in methyl ethyl ketone to obtain a BT resin.

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Abstract

There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1):xMgCO3.yMg(OH)2.zH2O  (1)wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4and huntite; (B) an epoxy resin; and (C) a curing agent.

Description

TECHNICAL FIELD[0001]The present invention relates to a resin composition and more particularly relates to a resin composition for use in prepregs for printed wiring boards. The present invention also relates to a prepreg for printed wiring boards prepared using the resin composition, and a laminated sheet and a metal foil-clad laminated sheet prepared using the prepreg.BACKGROUND ART[0002]In recent years, there is an ever-increasing tendency towards high-density integration, high function, and high-density assembly of semiconductors extensively used, for example, in electronic equipments, communication instruments, and personal computers. This has led to a demand for better properties and higher reliability of laminated sheets for semiconductor plastic packages. In particular, there is a recent demand for a reduction in coefficient of thermal expansion in a plane direction of laminated sheets. When the difference in coefficient of thermal expansion between a semiconductor element a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08K3/00
CPCH05K1/0373H05K2201/0209C08J2363/00C08J5/24H05K2201/012B32B5/26B32B15/14C08K3/0083B32B15/04C08G59/4014C08G59/62C08K3/26C08K3/34C08K9/02C08L63/00B32B2307/3065B32B2260/046B32B2457/08C08L2201/22C08L2201/08C08L2201/02C08K2003/267C08K2003/262C08K2201/003C08J5/244C08J5/249C08L83/00C08K3/105Y10T428/31529C08K3/013B32B15/092B32B2262/10B32B2307/58B32B2307/734C08J2363/04
Inventor KATO, YOSHIHIROOGASHIWA, TAKAAKITAKAHASHI, HIROSHIMIYAHIRA, TETSURO
Owner MITSUBISHI GAS CHEM CO INC
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