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Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate

A resin composition, thermosetting technology, applied in the fields of thermosetting resin compositions, prepregs and laminates, can solve poor curing reactivity, heat resistance, insufficient reliability, processability, curing reactivity and toughness Low thermal expansion, excellent drilling processability, and no environmental problems

Inactive Publication Date: 2013-07-03
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cyanate resin, which is the essential component, is a resin with poor toughness and curing reactivity, the improvement of curing reactivity and toughness is still insufficient, and when it is used as a copper-clad laminate or an interlayer insulating material , heat resistance, reliability, processability, etc. are also insufficient

Method used

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  • Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate
  • Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate
  • Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0097] Next, the present invention is explained in more detail by the following examples, but these examples do not limit the present invention in any way.

[0098] In addition, the copper clad laminated board obtained by the following Example and the comparative example was measured and evaluated by the following method.

[0099] (1) Copper foil adhesion (copper foil peel strength)

[0100] The copper-clad laminate was immersed in a copper etchant to form a 1-cm-wide copper foil to prepare an evaluation board, and the adhesiveness (peel strength) of the copper foil was measured using a tensile tester.

[0101] (2) Glass transition temperature (Tg)

[0102] Prepare a 5 mm square evaluation substrate obtained by immersing the copper-clad laminate in a copper etchant to remove the copper foil, and evaluate by observing the thermal expansion characteristics in the plane direction of the evaluation substrate using a TMA tester (manufactured by DuPont, TMA2940) .

[0103] (3) So...

manufacture example 1

[0115] Production Example 1: Production of Compatible Resin (A1-1)

[0116] 600.0 g of bisphenol A type cyanate resin (manufactured by Lonza Japan Ltd.: trade name Primaset BADCy), 200.0 g of siloxane resin represented by the following formula (V) (manufactured by Shin-Etsu Chemical Co., Ltd.: trade name X-22-1821, hydroxyl equivalent weight: 1,600), 200.0 g of biphenyl type epoxy resin (Japan Epoxy Resins Co. , Ltd.: trade name YX-4000, epoxy equivalent 186), and 1000.0 g of toluene. Then, the temperature was raised to 120°C while stirring, and after confirming that the solid content of the resin was dissolved into a uniform solution, 0.01 g of an 8% by mass mineral spirits solution of zinc naphthenate was added, and the reaction was carried out at about 110°C for 4 hours. . Then, it was cooled to room temperature to obtain a solution of compatible resin (A1-1).

[0117] Take out a small amount of this reaction solution, carry out GPC measurement (converted into polystyren...

manufacture example 2

[0120] Production Example 2: Production of Compatible Resin (A1-2)

[0121] In a reaction vessel with a volume of 3 liters that can be heated and cooled with a thermometer, a stirring device, and a reflux cooling pipe, 800.0 g of novolak type cyanate resin (manufactured by Lonza Japan Ltd.: trade name Primaset PT-15) was dropped into , weight average molecular weight 500-1,000), and 100.0 g of a siloxane resin represented by the following formula (VI) (manufactured by Shin-Etsu Chemical Co., Ltd.: trade name KF-6003, hydroxyl equivalent weight: 2800), 100.0 g of naphthol arane Base / cresol copolymerization type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.: trade name NC-7000L, epoxy equivalent: 230) and 1000.0 g of toluene. Then, the temperature was raised to 120° C. while stirring, and after confirming that the resin solid content was dissolved into a uniform solution, 0.01 g of an 8% by mass mineral spirits solution of zinc naphthenate was added, and the reaction was ...

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Abstract

Provided is a process for producing a compatibilized resin which comprises reacting a cyanate compound, a siloxane resin having a hydroxy group at an end, and an epoxy resin to a specific conversion. Also provided is a thermosetting resin composition which comprises: a compatibilized resin (A1) produced by the process or a thermosetting resin (A2) obtained by reacting a cyanate compound with a siloxane resin having a hydroxy group at an end to a specific conversion; and fused silica (B) in which the surface has been treated with a trimethoxysilane compound. Furthermore provided are a prepreg, a laminate, and a wiring board each obtained using the resin composition. The thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foils, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric properties, and drillability. With the composition, increases in the density of wiring boards and high reliability thereof, which are required at present, are attained. The composition can be widely used for producing electronic appliances, etc.

Description

technical field [0001] The present invention relates to the ability to obtain a thermosetting resin composition excellent in low thermal expansion, copper foil adhesion, heat resistance, flame retardancy, copper clad heat resistance (T-300), dielectric properties, and drilling processability A method for producing a compatible resin, a thermosetting resin composition, a prepreg, and a laminate. Background technique [0002] Thermosetting resin compositions are widely used in the fields of electronic devices and the like because they have a crosslinked structure and exhibit high heat resistance and dimensional stability. In particular, it is used as a prepreg or an interlayer insulating material constituting a printed wiring board on which wiring or a circuit pattern is printed, or a copper-clad laminate obtained by multilayering a printed wiring board. [0003] In recent years, the miniaturization, light weight, and high-speed operation of electronic instruments have accele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/06B32B5/28C08J5/24C08K9/06C08L79/04
CPCC08G77/16C08G77/452C08G73/0644C08G73/0655H05K1/0326H05K1/0366H05K1/0373H05K2201/0209H05K2201/029B32B5/022B32B5/024B32B5/08B32B7/06B32B15/14B32B15/20B32B2260/023B32B2260/046B32B2262/0276B32B2262/101B32B2307/306B32B2307/3065B32B2307/51B32B2307/714B32B2307/734B32B2307/748B32B2457/00C08J2383/10C08K9/06C08J5/244C08J5/249C08L83/10B32B5/28C08G73/06C08L79/04C08L83/06
Inventor 土川信次泉宽之石仓久美子村井曜
Owner RESONAC CORPORATION
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