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Thermosetting resin composition, prepreg produced by using thermosetting resin composition, and metal foil clad laminate

A technology of resin composition and prepreg, which is applied in the direction of metal layered products, synthetic resin layered products, applications, etc., can solve the problems of inability to meet the needs of high-frequency signal transmission, deterioration of dielectric properties, and large polarity, and achieve improvement Drillability, excellent dielectric properties, and the effect of improving brittleness

Inactive Publication Date: 2019-02-26
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It does not point out that the resin composition can be used for copper-clad laminates and prepregs. Even if the resin composition is used to cure the copper-clad laminate, its dielectric properties (dielectric loss tangent Df) will be significantly deteriorated (the resin composition contains acryloyl-based silicone resins, and acryloyl-containing silicone resins are more polar), which cannot meet the needs of high-frequency signal transmission

Method used

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  • Thermosetting resin composition, prepreg produced by using thermosetting resin composition, and metal foil clad laminate
  • Thermosetting resin composition, prepreg produced by using thermosetting resin composition, and metal foil clad laminate
  • Thermosetting resin composition, prepreg produced by using thermosetting resin composition, and metal foil clad laminate

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0098]0.481 moles (68.4 mL) of vinylbenzene, 0.0362 moles (5.16 mL) of ethyl vinylbenzene, and 63 mL of dichloroethane solution (concentration: 0.634 mmol / mL) of 1-chlorovinylbenzene (40 mmol), brominated Put 11 mL of tetra-n-butylammonium (1.5 mmol) in dichloroethane (concentration: 0.135 mmol / mL) and 500 mL of dichloroethane into a 1000 mL flask, and add 1.5 mmol of SnCl at 70°C 4 Dichloroethane solution (concentration: 0.068mmol / mL) 1.5mL, reaction time 1 hour. After the polymerization reaction is terminated by a small amount of methanol that has been foamed with nitrogen, the reaction mixture is dropped into a large amount of methanol at room temperature to precipitate the polymer, and the obtained polymer is washed with methanol, filtered, dried, and weighed to obtain a copolymer The product VOD-A was 54.6g in total (yield 49.8wt%).

[0099] The obtained polymer VOD-A had Mw of 4180, Mn of 2560, and Mw / Mn of 1.6. The polymer VOD-A contains 52 mol% of structural units de...

preparation example 2

[0102] 0.481 moles (68 mL) of vinylbenzene, 0.362 moles (52 mL) of ethyl vinylbenzene, 47 mL of dichloroethane solution (concentration: 0.634 mmol / mL) of 1-chlorovinylbenzene (30 mmol), tetra-n-chloride Put 65 mL of butylammonium (2.25 mmol) in dichloroethane (concentration: 0.035 mmol / mL) and 500 mL of dichloroethane into a 1000 mL flask, and add 1.5 mmol of SnCl at 70°C 4 Dichloroethane solution (concentration: 0.068mmol / mL) 22mL, reaction time 1 hour. After the polymerization reaction is terminated by a small amount of methanol that has been foamed with nitrogen, the reaction mixture is dropped into a large amount of methanol at room temperature to precipitate the polymer, and the obtained polymer is washed with methanol, filtered, dried, and weighed to obtain a copolymer The product VOD-B was 67.4g in total (yield 61.4wt%).

[0103] The obtained polymer VOD-B had Mw of 7670, Mn of 3680, and Mw / Mn of 2.1. The polymer VOD-B contains 51 mol% of structural units derived from...

preparation example 3

[0106] Vinylbenzene 0.0481 moles (6.84mL), ethyl vinylbenzene 0.0362 moles (5.16mL), the following general formula (a 5 )

[0107]

[0108] (where, R 30 is isopropyl, Py is pyridyl)

[0109] Put 12.0mg of the cobalt-based chain transfer agent and 150ml of tetrahydrofuran into a 300ml flask, and then add 2,2'-azobis(2,4-dimethylvaleronitrile) at 50°C for 72 hours. Drop the reaction mixture into a large amount of methanol at room temperature to precipitate the polymer, wash the obtained polymer with methanol, filter, dry, and weigh to obtain a total of 3.15 g of copolymer VOD-C (yield 28.7 wt%).

[0110] The obtained polymer VOD-C contains gel, so it is only soluble in THF solvent, its Mw is 94600, Mn is 12800, and Mw / Mn is 7.4. The polymer VOD-C contains 58 mol% of structural units derived from divinylbenzene and 42 mol% of structural units derived from ethylvinylbenzene as measured by a JNM-LA600 nuclear magnetic resonance spectrometer manufactured by JEOL Ltd. It was a...

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Abstract

The present invention provides a thermosetting resin composition, a prepreg produced by using the thermosetting resin composition, and a metal foil clad laminate, wherein the thermosetting resin composition comprises a component (A) and a component (B), wherein the component (A) is a solvent-soluble polyfunctional vinyl aromatic copolymer, the solvent-soluble polyfunctional vinyl aromatic copolymer has the structure unit of a monomer comprising a divinyl aromatic compound (a) and an ethyl vinyl aromatic compound (b), the component (B) is an olefin resin having a number average molecular weightof 500-10000 and having a styrene structure weight ratio of 10-50%, and the molecule contains the butadiene structure added at the sites 1 and 2. According to the present invention, the prepreg produced by using the thermosetting resin composition and the metal foil clad laminate have good toughness, maintain high glass transition temperature, low water absorption, excellent dielectric property and damp heat resistance, can be used in the field of high-frequency high-speed printed circuit boards, and are further suitable for multi-layer printed circuit board processing.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and relates to a thermosetting resin composition and a prepreg and a metal foil-clad laminate made of the same. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and information communication equipment, in order to transmit high-speed and process large-capacity information, the operating signal tends to be high-frequency, so the material of the circuit board is required. In particular, there is a rapid development in those electronic devices using broadband such as mobile communication devices. [0003] Among conventional printed circuit board materials, epoxy resins excellent in adhesive properties are widely used. However, epoxy resin circuit substrates generally have high dielectric constant and dielectric loss tangent (dielectric constant Dk is greater than 4, dielectric loss tangent Df is abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/08C08L25/10C08K5/3417C08K3/36C08K7/14B32B27/34B32B9/00B32B9/04B32B15/14B32B15/20B32B15/00H05K1/03
CPCH05K1/0353C08L25/08B32B5/02B32B15/00B32B15/14B32B15/20C08L2205/02C08L2201/02C08L2203/20B32B2262/0269B32B2262/106B32B2262/10C08J5/244C08J5/249C08L25/10C08K5/3417C08K3/36C08K7/14C08L9/06C08L25/16C08F212/12C08F212/36H05K1/0237H05K1/0373C08J2325/16C08J2309/06C08J2409/06H05K2201/0209B32B5/024B32B2457/08B32B2307/3065B32B2307/204B32B2250/20B32B5/022B32B2260/046B32B2264/0214B32B5/028B32B2264/10B32B2255/02B32B2250/40B32B2264/104B32B5/26B32B2264/101B32B2307/558B32B2260/021B32B2307/30B32B2264/0257B32B2255/205B32B2307/7246B32B2307/728B32B2264/12B32B2250/05B32B2307/538B32B2264/102B32B2262/101B32B2307/306C08K5/14C08F212/18C08F212/32C08L53/02C08K7/02C08J5/04B32B15/06B32B15/082B32B27/302B32B25/08B32B25/16C08J5/24B32B2260/023C08J2325/10C08J2347/00C08J2425/10C08J2447/00C08L47/00C09D147/00H05K1/036
Inventor 曾宪平关迟记陈广兵徐浩晟
Owner GUANGDONG SHENGYI SCI TECH
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