66results about How to "Low removal rate" patented technology

The invention discloses a microbial purifying ecological treatment system of a landscape water body, which comprises a first-stage filter tank (1), a second-stage biochemical pool (2), a third-stage biochemical pool (3), a fourth-stage reduction pool (4), a fifth-stage clean water pool (5), and a pollution discharge pool (6). The invention adopts micro-power circulation, filtration and sedimentation, utilizes a microbial contact oxidation method, via a multi-stage artificial beneficial microbial culture bed, by a technical proposal that an aerobic beneficial microorganism takes in and degrades the organic pollutant, nitrogen and phosphorus plant nutrient, and then a ultraviolet ray implements sterilization and disinfection for purifying and restoring the clear water, and thus solving the problems and shortcomings of high cost, water source restriction, drug contamination, and lower removal rate which exist in the prior art. The microbial purifying ecological treatment system of the landscape water body can lead the purifying treatment of the landscape water body to achieve the purposes of easy control, high removal, low cost, non-needing water change, and non-drug pollution by the way of artificially cultivating aerobic beneficial microbial ecological circular automatic purification.

A method of forming an oxygen-containing ceramic hard mask film on a semiconductor substrate involves receiving a semiconductor substrate in a plasma-enhanced chemical vapor deposition (PECVD) process chamber and depositing forming by PEVCD on the substrate an oxygen-containing ceramic hard mask film, the film being etch selective to low-k dielectric and copper, resistant to plasma dry-etch and removable by wet-etch. The method may further involve removing the oxygen-containing ceramic hard mask film from the substrate with a wet etch. Corresponding films and apparatus are also provided.

A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

The invention provides a chemical-mechanical polishing composition containing a ceria abrasive, one or more nonionic polymers, optionally one or more phosphonic acids, optionally one or more nitrogen-containing zwitterionic compounds, optionally one or more sulfonic acid copolymers, optionally one or more anionic copolymers, optionally one or more polymers comprising quaternary amines, optionally one or more compounds that adjust the pH of the polishing compositions, water, and optionally one or more additives. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide, silicon nitride, and / or polysilicon.

The present invention includes a method of allele-specific amplification, utilizing an allele-specific oligonucleotide, at least partially complementary to more than one variant of the target sequence, having an internally-placed selective nucleotide complementary to only one variant of the target sequence wherein the allele-specific oligonucleotide is extended by a nucleic acid polymerase predominantly or exclusively when hybridized to the variant of the target sequence for which it has said complementary selective nucleotide.

Disclosed herein is a chemical mechanical polishing (CMP) method for manufacturing a semiconductor device, comprising performing partial ion implantation of dopants at different concentrations into a plurality of at least two divided regions of a wafer having a planarization-target film, and subjecting the partially ion implanted-wafer to a chemical mechanical polishing process. In accordance with the present invention, non-uniformity of the removal rate in a chemical mechanical polishing process is countervailed by dopants which are implanted at different concentrations via partial ion implantation, and thereby it is possible to polish the target film at a uniform removal rate.

The present invention provides auto-stopping CMP slurry compositions that minimize post-CMP non-uniformity and also extend the time that polishing can be continued beyond the end point without the risk of over-polishing the dielectric silicon dioxide film. Auto-stopping CMP slurry compositions according to the invention include ceria abrasive particles and an effective amount of a polyalkylamine such as polyethyleneimine dispersed in water. The methods of the invention include polishing a topographic dielectric silicon dioxide film layer using the auto-stopping CMP slurry compositions to obtain a dielectric silicon dioxide surface having a desired predetermined minimum step height.

The invention discloses a scraping and touching air flow type seed removing device of a seeding machine. The seed removing device is arranged on a roller body of the seeding unit and comprises at least one set of seed removing pipes which are externally connected with an air supply system. Each seed removing pipe comprises a seed removing pipe body, air needles, thread rotary needle heads, seed pulling needles and a quick plug connector, wherein the thread rotary needle heads are distributed on one side of the cylindrical face of the seed removing pipe body, the quick plug connector is arranged on the other side of the cylindrical face of the seed removing pipe body, each thread rotary needle head corresponds to one air needle and one seed pulling needle, each thread rotary needle head, the corresponding air needle and the corresponding seed pulling needle are sequentially connected, and the quick plug connector is externally connected with the air supply system. According to the seed removing device, pneumatic power seed removing and mechanical power seed removing are combined, the seed removing effect is good, small round seeds and smell flat seeds can be removed so that the seeding unit can be used for sowing small flowering cabbage round seeds and the like and can also be suitable for sowing small tomato flat seeds and the like, single seeds can be precisely sown, and the seeding qualified rate is increased.

The invention relates to a method for hydrogenating a hydrocarbon material containing metal impurities, in particular to a method for hydrogenating a hydrocarbon material containing metal impurities, such as ferrum, sodium, calcium, and the like. The method comprises the raw material pretreatment process, the hydrogenating reaction process and the hydrogenated product separating process. In the raw material pretreatment process, the hydrocarbon material containing the metal impurities is mixed with the flash steam (low-pressure fractionation gas) of a low pressure separator of a hydrogenating reaction product separating system; then, the hydrocarbon material with higher impurity removing rate can be obtained by a fixed bed layer of a filter material, an adsorbent or catalyst; and the material is carried out the hydrogenating reaction process and can effectively ensure the stable running of the hydrogenating reaction process. Compared with the prior art, the method has mild operation condition and high impurity removing rate, and can be used for various hydrogenating reaction systems.

The present invention discloses a process for the selective hydrogenation of phenylacetylene in the presence of styrene conducted in a combined bed, which process comprises under hydrogenation reaction conditions, passing a hydrocarbon fraction feedstock containing phenylacetylene and styrene through a combined bed reactor containing a catalyst A and a catalyst B to contact the feedstock with the catalyst A and the catalyst B in turn, wherein the catalyst A is a nickel-based catalyst, the catalyst B is at least one selected from the group consisting of palladium-based catalysts and copper-based catalysts, and a weight ratio of the catalyst A loaded to the catalyst B loaded is from 0.5:1 to 5:1.

The invention relates to a small melon and fruit leaf removing device and belongs to the technical field of melon and fruit processing devices. Firstly, melons and fruits are fed into a machine body from a small melon and fruit inlet and fall onto a rotary drum, then a motor drives a large belt wheel through a belt to make the rotary drum roll forwards, a fan for downward blowing is configured above the rotary drum, part of withered leaves on small melon and fruit branches and leaves are blown off, then melons and fruits are driven to roll through a parallel bristle brush zone provided with a high-pressure spray nozzle at the upper portion and by using a bristle brush after being flushed by water sprayed by the high-pressure spray nozzle, meanwhile the axial flow fan at the upper portion blows the small melon and fruit branches and leaves and cooperates with brush bristles to remove dead twigs and withered leaves, the dead twigs and withered leaves fall into a branch and leaf collecting groove at the lower portion, and finally the melons and fruits roll into a discharging port and enter a collecting bag. The small melon and fruit leaf removing device is good in leaf removing effect and high in removal speed and has a wide application prospect.