62results about How to "Increase the conductive contact area" patented technology

The present invention relate to the field of power tool, in particular to a terminal connection structure, comprises a connecting seat and a two-action chuck, A plug hole is arranged on the connectingseat, A movable chuck comprises a splint and an elastic pressing member, the splints of the two moving chucks are respectively articulated with the connecting seat, As that two end of the two elasticpressing member abut on the connecting seat and the corresponding splint respectively, the clam ends of the two splints are pressed against each other to clamp the terminal, the clamping end includessuccessively arranged inlet segments, a flat pressure section and an anti-disengagement section, wherein the inlet section is raised in the opposite direction to the pressing direction so as to facilitate insertion of the terminal, the flat pressure section is a planar structure capable of abutting against the pressing of the terminal and forming an electrically conductive contact surface with the terminal, and the anti-disengagement section is provided with barbs inclined in the insertion direction of the terminal for hooking the terminal to prevent disengagement of the terminal; The terminal connection structure has the advantages of convenient operation, firm connection, tight contact of the conductive contact surface and no gap.

The present invention provides an electric conduction contact component and an electric connector using the same. The electric conduction contact component comprises a base body which extends flatly and straightly; the front end of the base body is connected with a first connecting section which is arranged in an upwards tilting manner through a first bent section; the front end of the first connecting section is connected with a contact section through a second bent section; the contact section is provided with a front contact portion which is in electric conduction contact with a matched electric conduction contact component; the lower side surface of the first connecting section is provided with a rear contact point which is in electric conduction contact with the front contact portion of the matched electric conduction contact component; and the front contact portion and space at the upper side and lower side of the base body form an insertion space into which the matched electric conduction contact component can be inserted. The electric conduction contact component provided by the invention is simple in structure. With the electric conduction contact component adopted, multi-point contact can be realized, the radiation effect of a short pile can be eliminated, and insertion loss can be decreased.

A solar cell and a module group thereof are disclosed. The cell comprises a substrate having a light receiving face and a back face that are opposite to each other, a passivation layer which is arranged on the back face and is provided with an opening part, and a back face electrode which is positioned on the passivation layer and contacts with the back face through the opening part, wherein the opening part is provided with a first opening pattern and a second opening pattern, wherein the first opening pattern extends along the circumferential edge of the substrate and is annular in shape, the second opening pattern is surrounded by the first opening pattern and is provided with a plurality of sub-openings, and distance between the first opening pattern and the circumferential edge of the substrate is smaller than 5 mm. The first opening pattern is arranged at the outer periphery of the second opening pattern, the first opening pattern is arranged close to the circumferential edge of the substrate, an electric conduction area between the back face electrode and the substrate can be improved, and thus electric current collection effects and photoelectric conversion efficiency can be improved.

The invention discloses a vacuum circuit breaker solid-sealed polar pole which structurally comprises a bolt 1, silicone rubber 4, a lower leading-out terminal 5, an upper leading-out terminal 7, a vacuum arc extinguish chamber 8, an insert 11, a fixing flange 12 and an insulating body 13. The vacuum circuit breaker solid-sealed polar pole has the advantages that the vacuum arc extinguish chamber is convenient to replace, and the defect that the whole solid-sealed polar pole is scrapped when the solid-sealed polar has a problem; the upper leading-out terminal and the vacuum arc extinguish chamber are in contact and connected in a tooth-shaped meshed and contact mode, the vacuum arc distinguish chamber is fixed to the insert of the insulating body by the bolt through the fixing flange, the contact pressure of the upper leading-out terminal and the conduction contact face of the vacuum arc extinguish chamber is ensured, the conduction contact area and the current carrying capacity of a conduction circuit are improved, and the resistance of the conduction circuit is reduced; a vacuum layer is arranged between the insulating body and the vacuum arc extinguish chamber, it is ensured that the external insulation of the vacuum arc extinguish chamber is not affected by the external environment, the insulation performance of the solid-sealed polar pole is improved, and compared with the technology that the whole vacuum arc extinguish chamber is wrapped by silicon, more production cost is lowered.

The invention seeks to provide a new semiconductor device mounting method, a semiconductor device mounting structure, an electro-optical device and an electronic device that can improve the reliability of conductively joined portions, even if the numbers of wiring terminals and electrodes increases and intervals therebetween are narrowed. A wiring terminal is formed on a wiring substrate, and an electrode is formed on a semiconductor device. Here, the width of the wiring terminal is formed so that it becomes smaller than the width of the electrode. When the semiconductor device is mounted on the wiring substrate, the wiring terminal becomes embedded in the electrode due to applied pressure. It is preferable for the embedding amount of the wiring terminal to be within the range of about 1 µm to 5 µm.

The invention discloses a split wire clamp hardware. The terminal interface of the wire clamp hardware is provided with two terminal splints for relatively clamping the terminal board. The conductive contact surfaces on both sides of the board, and the two terminal splints are correspondingly provided with fastening holes extending in opposite directions. In this way, when conducting conductive connection with the terminal board, the terminal board is clamped between the two terminal splints, and the conductive contact surfaces on the opposite side plates of the two terminal splints are in contact with the wires on both sides of the terminal board to realize current conduction In this way, when the bolt connection between the hardware and the terminal board is loose, one of the two terminal splints is always in close contact with the terminal board. The conductive contact between the terminal splint and the terminal board can increase the conductive contact area and further improve the flow performance.

The invention discloses a line repairing device, and belongs to the technical field of power maintenance tools. The line repairing device comprises a connecting conductor, two packing elastic pieces,two expansion pieces and two turncaps, mounting holes are formed in the two ends of the connecting conductor, and two wires are arranged in the two mounting holes respectively and can be electricallyconnected with the connecting conductor; and the two expansion pieces respectively sleeve the two wires, the expansion pieces are in a conical column shape, and the large-diameter ends of the expansion pieces are close to the connecting conductor. The two packing elastic pieces are arranged in the two mounting holes respectively, and the two ends of each packing elastic piece abut against the large-diameter end of the expansion piece and the connecting conductor respectively; and the two turncaps are connected to the two ends of the connecting conductor respectively, the turncaps are arrangedon the expansion piece in a sleeving mode, and inner cavities of the turncaps are in a conical hole shape matched with the appearance of the expansion piece. According to the line repairing device provided by the invention, the expansion piece is compressed from the two ends by the compression elastic piece and the turncap, so that the expansion piece is tightly attached to the wire, the overcurrent capacity is improved, the wire is prevented from loosening, and the connection reliability is improved.

The invention discloses a fast connecting device realizing heavy current charge and discharge; the fast connecting device comprises a fixed seat and a movable seat; the fixed seat comprises a fixed pedestal; a wedge form female end is fixed in the fixed pedestal; the movable seat comprises a movable pedestal; a wedge form male end is fixed in the movable pedestal; the wedge form male end inserts the wedge form female end, the wedge form female end wraps left, right and front end faces of the wedge form male end so as to form a mutually attached electric connecting structure; a buckling mechanism is arranged between the movable seat and the fixed seat, and pulled to push the movable seat to move to the fixed seat so as to form firm connection. The wedge form female end and the wedge form male end can realize multi-aspect electric connections via an insertion and matching mode, thus providing a much greater conductive contact area when compared with a conventional spring form; a spring buckle is arranged outside the connecting device so as to keep firm connection, thus enabling the wedge form female end to always firmly wrap the wedge form male end, keeping the electric connection stability, and realizing fast charging / discharging connection of heavy currents above 100A.

The invention discloses an electrode lead-out structure. According to the electrode lead-out structure, a positioning projection and a positioning hole are arranged on the opposite end faces of an end cover and a current collecting plate respectively; the positioning projection is inserted into the positioning hole in a transitional mode; a combining part is arranged at the periphery of the positioning projection and the positioning hole and in the combining position of the end faces of the end cover and the current collecting plate; and a welding structure fixedly connected with the end cover and the current collecting plate is arranged on the combining part. By virtue of transitional insertion and welding modes, the positioning projection is inserted into the positioning hole by pressing or knocking, and the end cover and the current collecting plate do not need to be subjected to pretreatment of cooling or heating, so that the assembling time is saved, the production efficiency is improved, and the cost is reduced.

The invention provides a method for connecting an electrolytic aluminum anode without pouring. In the method, a steel talon is manufactured into a wedge shape with a big end down cross section; the cross section of an anode carbon block is made into a boss shape, and a dovetail through slot is formed in the middle of the upper plane of the anode carbon block along the vertical direction; after the steel talon is put in the dovetail through slot, steel plates with the same number and same thickness are filled in gaps on two sides of the steel talon correspondingly, so that the two sides of thesteel talon and the copper plates are closely jointed, and the two steel plates and the anode carbon blocks on two sides are closely jointed. The pouring connecting method of melting ferro-phosphorusis changed into a wedge plate compacting connecting method, an intermediate frequency furnace for melting ferro-phosphorus and pressure-disengaging equipment for disengaging a phosphorus iron hoop bypressure are canceled, so that the equipment investment is reduced, the labor intensity is reduced, and the working environment is improved; the profile steel talon is put in the dovetail through slot of the carbon block and compacted by a wedge-shaped stainless steel plate without pouring, so the operation is easy and convenient; and the conventional mode of combining the anode steel talon and the anode carbon block is changed, a transitional connecting mode of combining copper and carbon is adopted, so that the conductive contact area is enlarged, and the anode conductive drop can be effectively reduced.

The embodiment of the invention provides a semiconductor structure and a forming method thereof. The semiconductor structure comprises the following steps: providing a substrate and a plurality of mutually separated conductive structures located on the substrate; forming an insulating layer on the upper surface of each conductive structure; forming an isolation structure, wherein the isolation structure is located on the side wall of each conductive structure and the side wall of each insulating layer; removing part of the isolation structure on the side wall of the insulating layer, wherein the upper surface of the residual isolation structure is higher than the upper surface of the conductive structure; removing part of the insulating layer away from the conductive structure, and in the direction perpendicular to the side wall of the insulating layer, the width of the top of the remaining insulating layer being smaller than that of the bottom of the remaining insulating layer; the surface of the substrate, the side wall of the isolation structure and the side wall of the insulating layer defining a groove, and the width of an opening of the groove being larger than that of the bottom of the groove in the direction perpendicular to the side wall of the groove. The embodiment of the invention is beneficial to improving the performance of the semiconductor structure.

The present invention provides an electric conduction contact component and an electric connector using the same. The electric conduction contact component comprises a base body which extends flatly and straightly; the front end of the base body is connected with a first connecting section which is arranged in an upwards tilting manner through a first bent section; the front end of the first connecting section is connected with a contact section through a second bent section; the contact section is provided with a front contact portion which is in electric conduction contact with a matched electric conduction contact component; the lower side surface of the first connecting section is provided with a rear contact point which is in electric conduction contact with the front contact portion of the matched electric conduction contact component; and the front contact portion and space at the upper side and lower side of the base body form an insertion space into which the matched electric conduction contact component can be inserted. The electric conduction contact component provided by the invention is simple in structure. With the electric conduction contact component adopted, multi-point contact can be realized, the radiation effect of a short pile can be eliminated, and insertion loss can be decreased.

The invention relates to an encapsulated conducting structure for a semiconductor substrate and the forming method thereof. The encapsulated conducting structure consists of a under bump metal layer covering the liner of the semiconductor substrate, at least one auxiliary part is arranged on the under bump metal layer, and then a bump metal layer is covered, and finally a bump is arranged on a bump conducting layer. Thereby, the bump can electrically connect with the lining of the semiconductor substrate by the under bump metal layer and the bump conducting layer, and provide better connecting buffer capacity and conduction property.