Mounting device and structure for semiconductor component, electro-optical device and producing method thereof

Abstract

The invention seeks to provide a new semiconductor device mounting method, a semiconductor device mounting structure, an electro-optical device and an electronic device that can improve the reliability of conductively joined portions, even if the numbers of wiring terminals and electrodes increases and intervals therebetween are narrowed. A wiring terminal is formed on a wiring substrate, and an electrode is formed on a semiconductor device. Here, the width of the wiring terminal is formed so that it becomes smaller than the width of the electrode. When the semiconductor device is mounted on the wiring substrate, the wiring terminal becomes embedded in the electrode due to applied pressure. It is preferable for the embedding amount of the wiring terminal to be within the range of about 1 µm to 5 µm.

Description

technical field [0001] The present invention relates to a method for mounting a semiconductor device, a mounting structure for a semiconductor device, an electro-optic device and electronic equipment, and a method for manufacturing an electro-optic device, in particular to a method for directly mounting a semiconductor device on a substrate and a mounting structure for the semiconductor device on the substrate. Background technique [0002] In general, there is a method of directly mounting a semiconductor device on a substrate, such as a flip chip mounting method. In this mounting method, while electrodes are provided on a semiconductor device (bare chip), wiring (wiring) terminals are formed on a substrate, and electrodes and wiring terminals are directly conductively contacted without via leads (ヮィャ). In this method, on a semiconductor device, an electrode having a protruding shape called a bump electrode is often formed, and the protruding electrode is directly contacted...

AI Technical Summary

Problems solved by technology

[0006] In this situation, because it is difficult to sufficiently ensure the width, interval, etc. of the wiring terminals 121, 125 of the wiring board 120 and the electrodes 131, 135 of the semiconductor device 130, the conductive contact between the wiring terminals and the electrodes is poor, and adjacent Short-circuit defects between wiring terminals or electrodes increase, and there is a problem that the reliability of the conductive joint part of the semiconductor mounting structure is reduced, and the yield of the product is deteriorated.

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