Semiconductor structure and forming method thereof
A semiconductor and conductive structure technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, transistors, etc., can solve the problem of small size of conductive contact window
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] It can be seen from the background art that the size of the conductive contact window of the semiconductor structure in the prior art is too small.
[0030] figure 1 A schematic diagram of a semiconductor structure.
[0031] refer to figure 1 , now combined with a semiconductor structure for analysis. The semiconductor structure includes: a substrate 200 and a plurality of mutually separated conductive structures 210 on the substrate; an insulating layer 203 located on the upper surface of the conductive structure; an isolation structure 220, and the isolation structure 220 is located on the sidewall of the conductive structure 210 and the side of the insulating layer 203 Wall; the surface of the substrate 200 and the sidewall of the isolation structure 220 form a trench, and in the direction perpendicular to the sidewall of the trench, the width of the opening of the trench is the same as the width of the bottom of the trench; the trench serves as a conductive contac...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com