33results about How to "Improve production line capacity" patented technology

The invention relates to an operating method of automatically feeding steel for hot rolling. The operating method comprises the following steps of: in a tapping process of heating furnaces, adopting a tapping mode switchable between automatic steel feeding and manual steel feeding; manually controlling the heating furnaces to tap for manual steel feeding; and controlling the heating furnaces to tap by a PLC control unit for automatic steel feeding. The step of automatic steel feeding specifically comprises the steps: the PLC control unit is connected to communication units of four heating furnaces and sends a steel feeding signal to the communication units, and the communication units control corresponding heating furnaces to tap, wherein the four heating furnaces tap circularly; and the distances between slabs sent out by the heating furnaces are equal. According to the operating method of automatically feeding steel for hot rolling provided by the invention, the primary steel feeding time is cured, non-uniform tapping gaps and great differences in operating times are avoided, and the burden of operators is reduced.

The invention discloses a low-compression ratio thick-gauge pipeline steel, the chemical composition and mass percentage of which are: C 0.03-0.07%, Si 0.10-0.30%, Mn 1.1-1.6%, Cr 0.1-0.3%, Ni 0.1 ~0.4%, Mo 0.10~0.25%, Nb 0.04~0.07%, V≤0.03%, Ti 0.01~0.025%, Al 0.01~0.045%, Mg 0.002‑0.0022%, using clean steel smelting, continuous casting, and slab heating , Three-stage controlled rolling, and ultra-fast cooling process. The matrix structure of the obtained steel plate is granular bainite and acicular ferrite, which has good strength-toughness matching and low yield ratio, and has excellent resistance to HIC and SSCC acid corrosion, and can meet the thickness specification yield strength ≥ 485MPa pipeline steel and service technical requirements for acid-resistant pipelines.

The invention provides a graded storage method of substrates. A random storage mode and a mixed storage mode are additionally arranged on the basis of a manual specific storage mode. When graded storage of the substrates is performed, the substrates of large number and grade of multiple substrates are arranged in corresponding manual specific storage mode carriers so that the loading rate of the carriers can be guaranteed, and the efficiency of the corresponding grades of substrates to the next station can be enhanced; partial grades of substrates are randomly arranged in random storage mode carriers so that empty waste of the carriers caused by the fact that an operator forgets to set the grade can be prevented, and an elastic space for storing multiple grades of substrates can also be provided for machines having less storage positions; and multiple grades of substrates of less number are arranged in mixed storage mode carriers in a mixed way so that each carrier is enabled to be fully loaded as much as possible, the utilization rate of the carriers can be enhanced, the transport time can be reduced, the efficiency of later continuous classification and waiting can be enhanced and the capacity of the production line can be greatly enhanced.

The invention discloses a wafer three-sided cutting method in the technical field of semiconductors. The method includes the following steps: providing a wafer, conveying the wafer to a rotatable wafer stage below a cutting mechanism, enabling a detection camera to perform scanning and analyzing to form a plurality of horizontal cutting channels and longitudinal cutting channels arranged at intervals, and enabling first and second cutters to cut the wafer along corresponding longitudinal cutting channels; rotating the wafer stage by 90 degrees, enabling the first cutter to cut the wafer alongthe respective horizontal cutting channels, and enabling the first cutter to cut out a groove on the wafer along the horizontal cutting channels; enabling the second cutter to the wafer along the respective horizontal cutting channels, and enabling the second cutter to through cut the wafer along the horizontal cutting channels so as to separate an IC. The method can separate the IC from the waferin three cutting steps, can reduce a risk of cracks on the back of the IC, enhances the reliability of the IC, reduce product stress concentration, and improves the quality of the cut IC product.

The present disclosure relates to the technical field of liquid crystal display. A liquid crystal panel and a display panel are provided. A main post spacer of the liquid crystal panel is arranged on a first substrate. A stopping structure used to stop the main post spacer from moving in a direction away from a second substrate is arranged on the second substrate. Hence, even if lots of liquid crystals are filled, the main post spacer and the second substrate may be kept in a seamless state due to the stopping structure.

The invention relates to a normalization-free high-magnetic induction low-iron loss acid etching-resistant non-oriented silicon steel and a production method thereof. The normalization-free high-magnetic induction low-iron loss acid etching-resistant non-oriented silicon steel comprises the following components in percentage by weight: C less than or equal to 0.0050%, 0.30-2.50% of Si, 0.15%-0.80% of Mn, 0.25-0.80% of Al, P less than or equal to 0.050%, S less than or equal to 0.0050%, N less than or equal to 0.0050%, Ti less than or equal to 0.0050% and 0.20-0.45% of Sn+Cu, wherein Sn and Cu are not equal to 0.The production method comprises the following steps of: smelting and casting into a blank; heating and soaking the cast blank to 1080-1150 DEG C; carrying out conventional hot rolling; rolling; pickling; carrying out one-time cold rolling to the thickness of a finished product; and annealing. The normalization-free high-magnetic induction low-iron loss acid etching-resistant non-oriented silicon steel disclosed by the invention is low in Si alloying degree, achieves the P 1.5 / 50 to the level of medium-high grade non-oriented silicon steels and the magnetic induction B 5000 higher than that of common non-oriented silicon steels by more than 0.08 T and equivalent to that of high-magnetic induction non-oriented silicon steels with same iron loss grades, is very conductive to enhancing the stability of a motor operated in a harsh environment for a long time and prolonging the service life of the motor and can also reduce the rusting loss in producing, storing, transporting and using processes.

The invention discloses a method for quantitative analysis of sulfur and phosphorus in steel. The method comprises the following steps: preparation of standard establishing samples; adjustment of theparameters of a laser induced breakdown system; collection of laser induced breakdown spectrum signals; establishment of standard curves for SII 233.249 nm and PI253.560 nm based on an internal standard method; collection of the signals of the sample to be tested; and acquisition of the S / P quantitative analysis result of the sample to be tested according to the standard curves. The method of theinvention integrates the internal standard method with laser induced breakdown spectroscopy and can thus rapidly detect the contents of elemental sulfur and elemental phosphorus in situ.

The invention provides a silicon wafer flower basket dispatching platform for double-track feeding, which includes a first delivery module, a second delivery module and a translation module, the first delivery module and the second delivery module are horizontally slidably arranged on the translation module, and the One side of the delivery module 1 and the delivery module 2 is used for docking with the flower basket transmission line, the opposite side of the delivery module 1 and the delivery module 2 is connected to the flower basket transmission line and the flower basket lifting system, and the flower basket transmission line The AGV loading level is connected, and the flower basket lifting system is connected with the lowering level, which solves the problem of using the AGV transfer flower basket and the silicon wafer flower feeding machine for docking and loading in intelligent production, and the AGV loading must ensure two The flower baskets on the feed flow line are empty. Due to the double-line production, there will be different output quantities of the two feed flow lines, so the flower baskets on one feed flow line will be emptied and the other feed flow line will be empty. The AGV can only load the material after the flower basket is discharged, which reduces the technical problem of production efficiency.