A level
electroplating equipment comprises essentially a group of plating-solution baffles, a group of first electrodes, a group of reticulated, surface-like or needle-like second electrodes, and an
electrode regeneration and plating-solution recycling
system. When the baseplate is sent horizontally for positioning, the plating-solution slowly flowing plate and the contact
cathode will clamp and conduct
electricity for the baseplate; then by filling plating solution and contacting with the
anode at upper, an electro plating environment is formed so as to carry out one-side plating for the baseplate at the side of
cathode; or by filling electro-deposition solution and contacting with the
anode at upper, an electro-deposition environment is formed, so as to carry out one-side electro deposition at the side of the
anode for color optic filter
pigment, dyestuff, or electro conductive
photoresistor. The invention provides a level
electroplating / electro-deposition /
electrode-free
electroplating equipment, can be used for electroplating an one-side even and horizontal film on the upper surface of a baseplate, for electro deposition of color optic filter
pigment, dyestuff, or electro conductive
photoresistor, or for depositing metallic film on a single side by chemical oxidation-reduction method.