The invention discloses a low-temperature fast curing underfill adhesive, which is characterized by comprising the following raw materials by weight portion: 40 to 65 portions of resin, 0.5 portion of colorant, 20 to 25 portions of curing agent, 1 to 6 portions of accelerant, 0.1 to 3 portions of coupler and 15 to 25 portions of epoxy active diluents. The preparation method comprises the following steps: firstly, uniformly mixing the resin and color paste for 20 to 40 minutes at 20 to 30 DEG C; secondly, adding the curing agent and the accelerant by three times, uniformly mixing the materials with a three-roller at 20 to 30 DEG C under a condition of chilling drying with cooling water kept at 15 DEG C for 3 times, adding the uniformly mixed materials into a reaction kettle and completely vacuumizing the reaction kettle for 15 minutes; and finally, after the resin and the curing agent are mixed uniformly, adding the coupler and the epoxy active diluents, mixing the materials in the reaction kettle, and completely vacuumizing for 30 minutes to obtain the product. The product is low in curing temperature, high in curing speed and good in storage stability, simple, easy and environmentally-friendly in preparation process, low in cost and wide in application range.