An object is to provide an electronic device of a multilayer structure with
high density and high reliability that can be reduced in size while incorporating an
electronic component therein, and further provide a production method for easily producing such an electronic device. An electronic device of the present invention includes wiring
layers and electrically insulating
layers stacked on a core board and establishes predetermined
electrical conduction between the wiring
layers through upper-lower side conducting vias provided in the electrically insulating layers. An
electronic component incorporating layer formed by directly forming a lower layer and insulating resin layer having a cutout portion for receiving an
electronic component therein and upper-lower side conducting vias and by incorporating the electronic component in the cutout portion is provided at least between one of the wiring layers and one of the electrically insulating layers and / or between the core board and the electrically insulating layer. At least the uppermost-layer electronic component incorporating layer of electronic incorporating layers has a
metal frame body surrounding the electronic component and the upper-lower side conducting vias, and a
metal cap having a
flange portion fixed to the
metal frame body of the uppermost-layer electronic component incorporating layer is provided.